APPARATUS FOR COOLING AND MOUNTING A CIRCUIT BOARD
    53.
    发明申请
    APPARATUS FOR COOLING AND MOUNTING A CIRCUIT BOARD 有权
    冷却和安装电路板的装置

    公开(公告)号:US20160105992A1

    公开(公告)日:2016-04-14

    申请号:US14511441

    申请日:2014-10-10

    CPC classification number: H05K7/209

    Abstract: An apparatus is provided that includes a housing for an electronic device. The housing includes a plurality of side walls and a removable exterior housing panel. A circuit board is mechanically attached to a first side of the panel, which faces an interior of the housing when the panel is secured to the plurality of side walls. The panel is made from a heat-conductive material to conduct heat from the circuit board to the panel and exterior environment.

    Abstract translation: 提供一种包括用于电子设备的外壳的设备。 壳体包括多个侧壁和可移除的外部外壳面板。 当面板被固定到多个侧壁时,电路板机械地附接到面板的第一侧,面向壳体的内部。 面板由导热材料制成,以将热量从电路板传导到面板和外部环境。

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