摘要:
A method is provided for semiconductor ESD protection in a mixed voltage device using a cascaded gate driven NMOS clamp circuit. Use of a bias circuit allows for an external I/O signal to have a voltage higher than the internal circuit power supply voltage so that a proper trigger level is provided in reference to an external power supply reference. A cascaded gate NMOS clamp circuit dissipates charge from an ESD event from the higher external I/O signal level without interfering with the normal operation of the internal or “core” circuits.
摘要:
An integrated circuit system includes a first device in a first power domain, and a second device coupled to the first device in a second power domain. A circuit module is coupled between the first device and a power supply voltage or between the first device and a complementary power supply voltage in the first power domain for increasing an impedance against an ESD current flowing from the first device to the second device during an ESD event.
摘要:
A boost-biased level shifter is described. In the preferred embodiments of the present invention, a voltage divider circuit divides the high voltage applied on the receiver circuit that receives the input signal, a refresh and self-bias circuit maintains and refreshes a bias voltage that is high enough to turn on the transistors in the voltage divider circuit, and a voltage output circuit outputs a signal having the amplitude of a higher power supply source, which is higher than the input signal amplitude. The preferred embodiments can operate at input signals having a lower amplitude. The performance is improved.
摘要:
A semiconductor device including a plurality of input/output cells and having a first bond pad and at least one second bond pad coupled to each input/output cell. The first bond pads comprise a first pattern, and the at least second bond pads comprise at least one second pattern, wherein the at least one second pattern is different from or the same as the first pattern. Either the first bond pads, the at least second bond pads, or both, may be used to electrically couple the input/output cells of the semiconductor device to leads of an integrated circuit package or other circuit component.
摘要:
A semiconductor device having a first bond pad and at least one second bond pad coupled to each input/output cell. The first bond pads comprise a first pattern, and the at least one second bond pad comprise at least one second pattern, wherein the at least one second pattern is different from or the same as the first pattern. Either the first bond pads, the at least one second bond pad, or both, may be used to electrically couple the input/output cells of the semiconductor device to leads of an integrated circuit package or other circuit component.
摘要:
A boost-biased level shifter is described. In the preferred embodiments of the present invention, a voltage divider circuit divides the high voltage applied on the receiver circuit that receives the input signal, a refresh and self-bias circuit maintains and refreshes a bias voltage that is high enough to turn on the transistors in the voltage divider circuit, and a voltage output circuit outputs a signal having the amplitude of a higher power supply source, which is higher than the input signal amplitude. The preferred embodiments can operate at input signals having a lower amplitude. The performance is improved.
摘要:
A semiconductor device having a first bond pad and at least one second bond pad coupled to each input/output cell. The first bond pads comprise a first pattern, and the at least one second bond pad comprise at least one second pattern, wherein the at least one second pattern is different from or the same as the first pattern. Either the first bond pads, the at least one second bond pad, or both, may be used to electrically couple the input/output cells of the semiconductor device to leads of an integrated circuit package or other circuit component.
摘要:
A physical layer of a USB interface. A test signal generator generates a test signal. A signal sampling device coupled to the test signal generator samples the test signal and outputs the test signal after a predetermined time. A transmitter and a receiver coupled to a signal access the data of the transmission terminals. A USB transceiver macrocell coupled to the test signal generator, the transmitter and receiver converts the test signal to USB protocol, outputs a first converted signal through the transmitter, receives the first converted signal through the transmission terminals and the receiver, and converts the received first converted signal to a second converted signal. A comparator coupled to the USB transceiver macrocell and the signal sampling device compares the second converted signal with the test signal, and outputs an error acknowledging signal.
摘要:
A power-on control circuit for an integrated circuit of the type having plural voltage source. The circuit is powered on sequentially, thereby preventing bus contention. The power-on control circuit includes a power-on detection for generating an enabling signal and disabling signal to control output buffer. When the high voltage source is powered on and the low voltage is not, the output buffer is at a high impedance state to prevent bus contention. When the low voltage is powered on after the high voltage is powered on, the output buffer is at a normal state.