公开(公告)号：US20210233832A1

公开(公告)日：2021-07-29

申请号：US16750213

申请日：2020-01-23

Applicant: INTEL CORPORATION

Inventor： Aastha Uppal ,  Je-Young Chang

IPC: H01L23/42 ,  H01L21/56

Abstract: An integrated circuit assembly may be formed comprising an electronic substrate, at least one integrated circuit device electrically attached to the electronic substrate, a heat dissipation device, a thermal interface material between the at least one integrated circuit device and the heat dissipation device, and a metal foam surrounding the at least one integrated circuit device and contacting the thermal interface material. The integrated circuit assembly may further include a stiffener attached to the electronic substrate and surrounding the at least one integrated circuit device, wherein the metal foam is disposed between the stiffener, the at least one integrated circuit device, the electronic substrate, and the heat dissipation device.

公开(公告)号：US20200350229A1

公开(公告)日：2020-11-05

申请号：US16398452

申请日：2019-04-30

Applicant: Intel Corporation

Inventor： Je-Young Chang ,  James C. Matayabas, JR. ,  Zhimin Wan ,  Kyle Arrington

IPC: H01L23/473 ,  H01L23/373 ,  H01L23/367 ,  H05K7/20

Abstract: An integrated circuit package includes a first die and second die above a substrate, and a vapor chamber above at least one of the first and second die. A vapor space within the vapor chamber is separated into at least a first section and a second section. The first section may be over the first die, and the second section may be over the second die, for example. The structure separating the first and second sections at least partly restricts flow of vapor between the first and second sections, thereby preventing or reducing thermal cross talk between the first and second dies. In some cases, an anisotropic thermal material is above one of the first or second die, wherein the anisotropic thermal material has substantially higher thermal conductivity in a direction of a heat sink than a thermal conductivity in a direction of a section of the vapor chamber.

公开(公告)号：US20200260609A1

公开(公告)日：2020-08-13

申请号：US16273633

申请日：2019-02-12

Applicant: Intel Corporation

Inventor： Amitesh Saha ,  Je-Young Chang ,  Betsegaw K. Gebrehiwot

IPC: H05K7/20 ,  H01L23/373 ,  H05K1/02

Abstract: A heat dissipation device may be formed having a planar structure with a first surface and a surface area enhancement structure projecting from or extending into the first surface of the planar structure. In one embodiment, an integrated circuit package may be formed with the heat dissipation device, wherein the heat dissipation device and at least one integrated circuit device are brought into thermal contact with a thermal interface material between the at least one integrated circuit device and the heat dissipation device and wherein the surface area enhancement structure of the heat dissipation device directly contacts the thermal interface material.

公开(公告)号：US20200251403A1

公开(公告)日：2020-08-06

申请号：US16264419

申请日：2019-01-31

Applicant: Intel Corporation

Inventor： Shrenik Kothari ,  Sandeep Ahuja ,  Susan Smith ,  Jeffory Smalley ,  Francisco Gabriel Lozano Sanchez ,  Maria de la Luz Belmont Velazquez ,  Je-Young Chang ,  Jorge Contreras Perez ,  Phil Geng ,  Andres Ramirez Macias ,  Gilberto Rayas Paredes

IPC: H01L23/40 ,  H01L23/427 ,  H01L25/18

Abstract: An apparatus incorporating a multi-surface heat sink may comprise an integrated circuit die, a heat spreader, a plate element, and a heat sink. The heat spreader may be positioned above the IC die. The plate element may be positioned above the heat spreader. A bottom surface of the heat sink may have a first region positioned above the plate element. One or more spring elements may be positioned between the plate element and the first region of the bottom surface of the heat sink. The one or more spring elements may be under a compressive load between the plate element and the heat sink. One or more thermal conduit elements may be secured to both the plate element and the heat sink. The one or more thermal conduit elements may apply at least a part of the compressive load between the plate element and the heat sink.

公开(公告)号：US10727160B2

公开(公告)日：2020-07-28

申请号：US15859236

申请日：2017-12-29

Applicant: Intel Corporation

Inventor： Devdatta P. Kulkarni ,  Richard J. Dischler ,  Je-Young Chang

IPC: H01L23/433 ,  H01L23/367 ,  H01L23/427 ,  H01L23/00

Abstract: Thermal management technology is disclosed. A thermal management component in accordance with the present disclosure can comprise a heat spreader having a plurality of microchannels. The thermal management component can also comprise a plurality of fins directly coupled to the heat spreader to provide surface area for heat transfer. In another aspect, a thermal management component can comprise a heat spreader having a plurality of microchannels, and an inlet port and an outlet port in fluid communication with the plurality of microchannels. The thermal management component can also comprise a plurality of fins coupled to the heat spreader to provide surface area for heat transfer. Additionally, the thermal management component can comprise a fluid conduit thermally coupled to the plurality of fins and fluidly coupled to the outlet port and the inlet port to facilitate flow of a heat transfer fluid through the microchannels and the fluid conduit. Associated electronic devices, systems, and methods are also disclosed.

公开(公告)号：US20190094925A1

公开(公告)日：2019-03-28

申请号：US16198476

申请日：2018-11-21

Applicant: Intel Corporation

Inventor： Devdatta P. Kulkarni ,  Richard J. Dischler ,  Je-Young Chang

IPC: G06F1/20 ,  H01L23/367 ,  H01L23/495 ,  H01L21/02

Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures formed herein may include a die disposed on a substrate; a cooling solution comprising a first surface and a second surface opposite the first surface, wherein the second surface is disposed on a backside of the die disposed on a package substrate. A lid comprising an outer surface is disposed on the first surface of the cooling solution, wherein the lid includes a plurality of fins disposed on an inner surface of the lid. A solder is disposed between the outer surface of the lid and the first surface of the cooling solution.