公开(公告)号：US20190221345A1

公开(公告)日：2019-07-18

申请号：US15870302

申请日：2018-01-12

申请人： Intel Corporation

发明人： Sai Vadlamani ,  Prithwish Chatterjee ,  Rahul Jain ,  Kyu Oh Lee ,  Sheng C. Li ,  Andrew J. Brown ,  Lauren A. Link

IPC分类号： H01F1/42 ,  H01L21/56 ,  H01F27/38 ,  B32B27/38 ,  C22C45/04 ,  H01F27/28

CPC分类号： H01F1/42 ,  B32B27/38 ,  C22C45/04 ,  H01F27/2804 ,  H01F27/38 ,  H01L21/56

摘要： A substrate for an integrated circuit package, the substrate comprising a dielectric, at least one conductor plane within the dielectric, and a planar magnetic structure comprising an organic magnetic laminate embedded within the dielectric, wherein the planar magnetic structure is integrated within the at least one conductor plane.