Succinoylamino benzodiazepines as inhibitors of Aβ protein production
    54.
    发明授权
    Succinoylamino benzodiazepines as inhibitors of Aβ protein production 有权
    琥珀酰氨基苯二氮卓类作为Abeta蛋白生产的抑制剂

    公开(公告)号:US07053084B1

    公开(公告)日:2006-05-30

    申请号:US09505788

    申请日:2000-02-17

    申请人: Richard E. Olson

    发明人: Richard E. Olson

    摘要: This invention relates to novel lactams having the formula (I): to their pharmaceutical compositions and to their methods of use. These novel compounds inhibit the processing of amyloid precursor protein and, more specifically, inhibit the production of Aβ-peptide, thereby acting to prevent the formation of neurological deposits of amyloid protein. More particularly, the present invention relates to the treatment of neurological disorders related to β-amyloid production such as Alzheimer's disease and Down's Syndrome.

    摘要翻译: 本发明涉及具有式(I)的新型内酰胺:其药物组合物及其使用方法。 这些新化合物抑制淀粉样蛋白前体蛋白的加工,更具体地,抑制Aβ肽的产生,从而起到防止淀粉样蛋白质神经沉积的形成的作用。 更具体地,本发明涉及治疗与β-淀粉样蛋白产生相关的神经系统疾病,例如阿尔茨海默病和唐氏综合征。

    Cabinet system and method of assembling same
    55.
    发明授权
    Cabinet system and method of assembling same 失效
    柜系统及其组装方法

    公开(公告)号:US06443542B1

    公开(公告)日:2002-09-03

    申请号:US09576500

    申请日:2000-05-23

    IPC分类号: A47B8700

    CPC分类号: A47B87/008

    摘要: A cabinet system includes first and second cabinets each including first and second side walls, upper and lower rectilinear frames extending between the side walls at vertically spaced-apart locations therealong and weldments connecting the upper and lower frames to the side walls to form a rigid housing. A pair of spaced-apart locating holes are formed in the side wall of the first cabinet adjacent to the lower frame thereof and an additional locating hole is present in the first wall of the first cabinet adjacent to the upper frame thereof. Further, a pair of spaced-part locating pins are provided in the second side wall of the second cabinet adjacent to the lower frame thereof along with an additional locating pin in the side wall of the second cabinet adjacent to the upper frame thereof. The locating pins of the second cabinet are arranged and adapted to slide into the corresponding ones of the locating holes of the first cabinet when the second side wall of the second cabinet is positioned flush against the first side wall of the first cabinet so as to align the cabinets in the X and Y directions. Fasteners are provided for securing the second side wall of the second cabinet to the first side wall of the first cabinet. A method of aligning the two cabinets is also disclosed.

    摘要翻译: 橱柜系统包括第一和第二柜,每个第一和第二柜各自包括第一和第二侧壁,上部和下部直线框架在侧壁之间沿垂直间隔开的位置延伸,焊接件将上框架和下框架连接到侧壁,以形成刚性外壳 。 在第一机柜的与其下框架相邻的侧壁中形成一对间隔开的定位孔,并且在第一机柜的与其上框架相邻的第一壁中存在额外的定位孔。 此外,在第二机柜的与其下框架相邻的第二侧壁中设置有一对间隔开的定位销以及与其上框架相邻的第二机柜的侧壁中的附加定位销。 当第二机柜的第二侧壁与第一机柜的第一侧壁相对定位时,第二机柜的定位销布置并适于滑入第一机柜的对应的定位孔中,以便对准 机柜在X和Y方向。 紧固件用于将第二机柜的第二侧壁固定到第一机柜的第一侧壁。 还公开了对准这两个机柜的方法。

    Localized cooling apparatus for cooling integrated circuit devices
    60.
    发明授权
    Localized cooling apparatus for cooling integrated circuit devices 失效
    用于冷却集成电路器件的本地化冷却装置

    公开(公告)号:US4935864A

    公开(公告)日:1990-06-19

    申请号:US368741

    申请日:1989-06-20

    IPC分类号: H01L23/38 H05K7/20

    摘要: A localized cooling apparatus is provided for individually cooling integrated circuit chips mounted on a circuit board for insertion into a computer backplane. The cooling apparatus consists of a circuit board occupying a first slot and having an integrated circuit chip mounted thereon, the performance of which is known to improve by cooling, a heat removal assembly consisting of a heat sink attached to a card edge portion and occupying an adjacent second slot, and a thermoelectric cooler intimately bonded to both the chip and heat removal assembly. A controller provides power via the connector of the second slot to the thermoelectric cooler and stabilizes the temperature of the chip to a predetermined value.

    摘要翻译: 提供一种局部冷却装置,用于单独冷却安装在电路板上用于插入计算机背板的集成电路芯片。 冷却装置包括占据第一槽的电路板,其上安装有集成电路芯片,其性能已知通过冷却而改善,散热组件由散热片组成,该散热片附接到卡边缘部分并占据一个 相邻的第二狭槽和与芯片和散热组件两者紧密结合的热电冷却器。 控制器通过第二槽的连接器向热电冷却器提供电力,并将芯片的温度稳定在预定值。