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65 条记录 (耗时 0.026 秒)

    Highly thermally conductive electronic connector
    55.
    发明授权
    Highly thermally conductive electronic connector 失效
    高导热电子连接器

    公开(公告)号：US06851869B2

    公开(公告)日：2005-02-08

    申请号：US09916056

    申请日：2001-07-26

    申请人： James D. Miller ,  E. Mikhail Sagal ,  Kevin A. McCullough

    发明人： James D. Miller ,  E. Mikhail Sagal ,  Kevin A. McCullough

    IPC分类号： G02B6/38 ,  G02B6/42 ,  H05K7/20 ,  H05K9/00 ,  G02B6/36

    CPC分类号： H05K9/0083 ,  G02B6/3814 ,  G02B6/4201 ,  G02B6/4246 ,  G02B6/4272 ,  G02B6/4277 ,  G02B6/4284 ,  H05K7/20

    摘要： The electronic connector (10) includes an improved heat dissipating housing for cooling heat generating devices located within the connector (10). The electronic connector (10) of the present invention enables the cost-effective cooling of electronic devices (22, 24) within the connector (10) while realizing superior thermal conductivity and improved electromagnetic shielding. A method of forming an electronic connector (10) that includes the steps of first providing a heat generating electronic component (22, 24) capable of electronically coupling two data devices together having a first port (16a) and a second port (16b). This component (22, 24) is typically mounted or installed into a circuit board (20). An outer housing (12) of moldable thermally conductive polymer material (102, 202, 302, 402) is overmolded around the heat generating electronic component (22, 24) leaving the first port (16a) and the second port (16b) of connector (10) exposed.

    摘要翻译： 电子连接器（10）包括改进的散热壳体，用于冷却位于连接器（10）内的发热装置。 本发明的电子连接器（10）能够在实现优良的导热性和改善的电磁屏蔽的同时，在连接器（10）内对电子设备（22,24）进行成本有效的冷却。 一种形成电子连接器（10）的方法，包括以下步骤：首先提供能够将具有第一端口（16a）和第二端口（16b）的两个数据装置电连接的发热电子部件（22,24）。 该组件（22,24）通常安装或安装到电路板（20）中。 可模制导热聚合物材料（102,202,302,402）的外壳（12）围绕发热电子部件（22,24）包覆模制，离开第一端口（16a）和连接器的第二端口（16b） （10）暴露。

    Thermally conductive lamp reflector
    56.
    发明授权
    Thermally conductive lamp reflector 有权
    导热灯反光板

    公开(公告)号：US06827470B2

    公开(公告)日：2004-12-07

    申请号：US10229557

    申请日：2002-08-28

    申请人： E. Mikhail Sagal ,  Kevin A. McCullough ,  James D. Miller

    发明人： E. Mikhail Sagal ,  Kevin A. McCullough ,  James D. Miller

    IPC分类号： F21V700

    CPC分类号： F21V29/505 ,  F21S41/321 ,  F21S41/37 ,  F21S45/47 ,  F21S45/48 ,  F21V7/22 ,  H01J5/16

    摘要： A thermally conductive lamp reflector is provided that dissipates heat from a light source within the reflector. The reflector assembly includes a shell having a metallized layer on its surface. The shell is made from a composition including about 30% to about 80% by volume of a base polymer matrix and about 20% to about 70% by volume of a thermally conductive filler material. The reflector has a thermal conductivity of greater than 3 W/m° K and preferably greater than 22 W/m° K. The reflectors can be used in automotive headlamps, flashlights, and other lighting fixtures. A method of forming the lamp reflector is also provided.

    摘要翻译： 提供一种散热来自反射器内的光源的导热灯反射器。 反射器组件包括在其表面上具有金属化层的壳体。 外壳由包含约30％至约80％体积的基础聚合物基质和约20％至约70％体积的导热填料的组合物制成。 反射器的热导率大于3W / m°K，优选大于22W / m°K.反射器可用于汽车前照灯，手电筒和其他照明灯具。 还提供了一种形成灯反射器的方法。

    Polymer composition with metal coated carbon flakes
    57.
    发明授权
    Polymer composition with metal coated carbon flakes 有权
    聚合物组成与金属涂层碳薄片

    公开(公告)号：US06503964B2

    公开(公告)日：2003-01-07

    申请号：US09757499

    申请日：2001-01-10

    申请人： Lyle James Smith ,  Mikhail Sagal ,  James D. Miller ,  Kevin A. McCullough

    发明人： Lyle James Smith ,  Mikhail Sagal ,  James D. Miller ,  Kevin A. McCullough

    IPC分类号： G21K112

    CPC分类号： C09K19/52 ,  C08K9/02 ,  Y10T428/12181 ,  Y10T428/2991

    摘要： A thermally conductive and electromagnetic interference and radio frequency reflective polymer composition and a method for creating the same is disclosed. Thermally conductive filler material is coated with a thermally conductive and electromagnetic interference and radio frequency reflective coating material and mixed with a base polymer matrix. The mixture is molded into the desired shape. The electromagnetic interference and radio frequency reflective coating material prevents the absorption and transfer of EMI and RF waves through the filler material thus resulting in an EMI and RF reflective composition.

    摘要翻译： 公开了导热和电磁干扰和射频反射聚合物组合物及其制备方法。 导热填充材料涂覆有导热和电磁干扰和射频反射涂层材料，并与基础聚合物基质混合。 将混合物模塑成所需的形状。 电磁干扰和射频反射涂层材料防止EMI和RF波通过填充材料的吸收和传递，从而导致EMI和RF反射组合物。

    Thermally conductive electronic device case
    58.
    发明授权
    Thermally conductive electronic device case 有权
    导热电子器件外壳

    公开(公告)号：US06487073B2

    公开(公告)日：2002-11-26

    申请号：US09726141

    申请日：2000-11-29

    申请人： Kevin A. McCullough ,  E. Mikhail Sagal ,  James D. Miller

    发明人： Kevin A. McCullough ,  E. Mikhail Sagal ,  James D. Miller

    IPC分类号： G06F120

    CPC分类号： H05K9/0022 ,  G06F1/203 ,  H01L23/3675 ,  H01L23/3737 ,  H01L23/552 ,  H01L2924/0002 ,  H05K7/20409 ,  H01L2924/00

    摘要： A case for dissipating heat from an electronic device is provided. The case includes an electronic circuit board with a heat generating electronic component installed thereon. A shield is positioned over the electronic component to protect it from electromagnetic interference. The shield includes an aperture through its top surface. A heat transfer conduit is molded into and through the aperture to contact the top surface of the heat generating electronic component. Outer housing, which is made of a thermally conductive material, is placed into contact with the top surface of the heat transfer conduit which extends outside the shield. As a result, heat is dissipated from the electronic component and through the housing of the electronic device via the heat transfer conduit while shielding the electronic component from electromagnetic interference.

    摘要翻译： 提供了用于从电子设备散热的情况。 该情况包括其上安装有发热电子部件的电子电路板。 屏蔽层位于电子元件上方，以防止电磁干扰。 屏蔽包括通过其顶表面的孔。 传热导管被模制到孔中并通过孔与接触发热电子部件的顶表面接触。 由导热材料制成的外壳与传导导管的顶部表面接触，延伸到屏蔽外部。 结果，通过传热导管从电子元件和电子设备的壳体散发热量，同时屏蔽电子部件免受电磁干扰。