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公开(公告)号:US20250167012A1
公开(公告)日:2025-05-22
申请号:US18794556
申请日:2024-08-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jihoon JEONG , Junho YOON , Young-Hoo KIM , Taeheon KIM , Woogwan SHIM , Jongwon LEE , Junho LEE , Jiwoong JUNG
Abstract: A substrate processing apparatus includes a stage configured to support a substrate, a rotation driving portion configured to rotate the stage around a first axis extending in a vertical direction, a first nozzle arm disposed on the stage and configured to rotate around a second axis parallel to the first axis, and a second nozzle arm disposed on the stage and configured to rotate around a third axis parallel to the second axis. The first nozzle arm includes a first nozzle supporting member extended parallel to the stage, a first connection member coupled to an end of the first nozzle supporting member, the first connection member having a stepwise shape, and a first nozzle coupled to the first connection member and configured to spray a fluidic material.
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公开(公告)号:US20250053198A1
公开(公告)日:2025-02-13
申请号:US18930650
申请日:2024-10-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Wonsun LEE , Gyejoon YOO , Hosoon LEE , Yena SHIN , Junho LEE , Jinsoo CHOI , Jinwan AN
IPC: G06F1/16
Abstract: An electronic device includes a housing, a display module having a first region, a second region and a third region between the first region and the second region. The display module comprises a window including a first portion having a first thickness in the first region, a second portion having a second thickness in the second region, the second thickness being less than the first thickness, and a recessed portion in the third region. The display module comprises an adhesive member disposed on at least one surface of the window. The display module comprises a display panel attached to the window. The recessed portion has a first radius of curvature between the first region and the third region, a second radius of curvature between the second region and the third region, and a third radius of curvature at a point having a minimum thickness in the recessed portion.
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公开(公告)号:US20250039757A1
公开(公告)日:2025-01-30
申请号:US18781433
申请日:2024-07-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sangwook HAN , Yoojin CHOI , Junho LEE
Abstract: A terminal receives a measurement configuration from a serving cell, measures at least one received signal based on the measurement configuration, and confirms whether an event corresponding to the measurement configuration has occurred. Based on the confirming that the event has occurred, the terminal generates a latent vector by encoding a measurement result set including a plurality of measurement results, and in response to the occurrence of the event, transmits, to the serving cell, a measurement report generated based on the latent vector.
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公开(公告)号:US20250039019A1
公开(公告)日:2025-01-30
申请号:US18784145
申请日:2024-07-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sangwook HAN , Junho LEE , Yoojin CHOI
Abstract: A method of operating a base station, includes: transmitting a reference signal to an electronic device comprising a first model and a third model; receiving a first intermediate output from the electronic device; obtaining a second intermediate output by inputting the first intermediate output to a partial model excluding an output layer from a second model comprising a second neural network for data decompression; transmitting the second intermediate output to the electronic device; receiving a first gradient value from the electronic device and updating weight parameters of the partial model; and generating a second gradient value different from the first gradient value and transmitting the second gradient value to the electronic device.
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公开(公告)号:US20250038083A1
公开(公告)日:2025-01-30
申请号:US18438719
申请日:2024-02-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
IPC: H01L23/498
Abstract: A semiconductor device according to embodiments includes a semiconductor package, a package pad positioned on a surface of the semiconductor package, and a solder ball positioned on the package pad. The package pad includes a package center pad positioned at the center of the semiconductor package, and a package edge pad positioned on an edge portion of the semiconductor package, the package edge pad covers a side surface extending from a surface of the semiconductor package.
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公开(公告)号:US20250003812A1
公开(公告)日:2025-01-02
申请号:US18810429
申请日:2024-08-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jaebum LEE , Hyunggwang KANG , Youngho KIM , Junho LEE , Seokmin JANG , Hyunju HONG
Abstract: An electronic device according to various embodiments of the disclosure may include a first housing, a second housing configured to be slid into the first housing and slid out from the first housing, a substrate part disposed between the front surface and the rear surface in the first housing and including at least one heat source, a first temperature sensor disposed on the substrate part, a second temperature sensor disposed in the second housing, and at least one processor. The at least one processor is configured to calculate a temperature of the electronic device based on at least one of a measurement value of the first temperature sensor or a measurement value of the second temperature sensor. Various other embodiments may be possible.
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57.
公开(公告)号:US20240243149A1
公开(公告)日:2024-07-18
申请号:US18409347
申请日:2024-01-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sangyun LEE , Sookyoung ROH , Seokho YUN , Junho LEE
IPC: H01L27/146
CPC classification number: H01L27/14627 , H01L27/14621
Abstract: Provided is an image sensor that includes a sensor substrate including a plurality of pixels, a nano-photonic lens array including a plurality of nano-structures that are disposed to color-separate incident light and condense the color-separated incident light onto the plurality of pixels, and a color filter layer including a plurality of color filters, wherein the total number of color filters transmitting the light of a first wavelength band is greater than a number of color filters transmitting the light of a second wavelength band and the number of the color filters transmitting the light of a third wavelength band, and the plurality of nano-structures of the nano-photonic lens array color-separate and condense the light of the second wavelength band and the light of the third wavelength band, and condense the light of the first wavelength band without color-separation.
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公开(公告)号:US20240230960A1
公开(公告)日:2024-07-11
申请号:US18405938
申请日:2024-01-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sangeun MUN , Sungmo AHN , Sookyoung ROH , Junho LEE , Choonlae CHO
CPC classification number: G02B3/0043 , H04N23/55 , G02B2207/101
Abstract: An image sensor includes a sensor substrate including a plurality of pixels that detect light, and a nano-optical microlens array arranged on the sensor substrate and including a plurality of nano-optical microlenses that focus incident light on the plurality of pixels, wherein the nano-optical microlens array includes a plurality of lens groups, each of the plurality of lens groups includes first, second, third, and fourth nano-optical microlenses, and each of the first, second, third, and fourth nano-optical microlenses includes a plurality of nanostructures arranged to focus incident light on a corresponding pixel, and centers of the first, second, third, and fourth nano-optical microlenses in each of the plurality of peripheral groups in the plurality of lens groups are offset with respect to a center of the corresponding pixel, and offset distances of at least two of the first, second, third, and fourth nano-optical microlenses are different from each other.
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59.
公开(公告)号:US20240195466A1
公开(公告)日:2024-06-13
申请号:US18582227
申请日:2024-02-20
Applicant: Samsung Electronics Co., Ltd.
Inventor: Federico PENNA , Hyukjoon KWON , Dongwoon BAI , Jaein KIM , Junho LEE , Hui Won JE
IPC: H04B7/0456 , H04B7/06 , H04L5/00
CPC classification number: H04B7/0456 , H04B7/0632 , H04L5/0094
Abstract: The disclosure provides methods of providing implicit channel state information (CSI) feedback from a user equipment (UE). A method performed by a first device includes determining a feedback parameter selection decision metric; selecting a particular method from a plurality of methods, based on the feedback parameter selection decision metric; determining, based at least in part on the particular method, and based on a configuration of an associated second device, one or more values associated with precoding; and transmitting the one or more values to the second device.
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公开(公告)号:US20240145295A1
公开(公告)日:2024-05-02
申请号:US18226372
申请日:2023-07-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jihyun LEE , Junho LEE , Kang Joon LEE
IPC: H01L21/768 , H01L21/56 , H01L23/00 , H01L23/498 , H01L23/532 , H01L25/18
CPC classification number: H01L21/768 , H01L21/565 , H01L23/49816 , H01L23/53209 , H01L24/48 , H01L25/18 , H01L2224/48151 , H01L2924/1431 , H01L2924/1434
Abstract: A semiconductor package includes a first structure that includes an upper connection pattern; a second structure that includes a lower connection pattern; and a connection structure that connects the upper connection pattern of the first structure to the lower connection pattern of the second structure, wherein the connection structure includes a lower conductor connected to the upper connection pattern of the first structure; an upper conductor connected to the lower conductor and the lower connection pattern of the second structure; and a dielectric pattern that at least partially surrounds the upper conductor, and the dielectric pattern includes a first surface in contact with the upper conductor; and a second surface in contact with the lower conductor.
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