RADIO FREQUENCY INTEGRATED CIRCUIT AND WIRELESS COMMUNICATION DEVICE INCLUDING THE SAME

    公开(公告)号:US20250132775A1

    公开(公告)日:2025-04-24

    申请号:US18768569

    申请日:2024-07-10

    Abstract: A radio frequency integrated circuit (RFIC) includes a first receive chain configured to receive a first high-frequency input signal, generate a first baseband signal based on the first high-frequency input signal by using a first downward frequency signal, and output the first baseband signal to a first output port, a first local oscillator configured to generate a first oscillation clock signal, a second local oscillator configured to generate a second oscillation clock signal, a first multiplexer configured to output one among the first and oscillation clock signals to a second output port based on an oscillation clock output selection signal, a first input port configured to receive a third oscillation clock signal from an external source, and a second multiplexer configured to output one among the first through third oscillation signals to the first receive chain as the first downward frequency signal based on a first downward frequency selection signal.

    TERMINAL AND SERVING CELL PERFORMING HANDOVER AND OPERATING METHODS THEREOF

    公开(公告)号:US20250039757A1

    公开(公告)日:2025-01-30

    申请号:US18781433

    申请日:2024-07-23

    Abstract: A terminal receives a measurement configuration from a serving cell, measures at least one received signal based on the measurement configuration, and confirms whether an event corresponding to the measurement configuration has occurred. Based on the confirming that the event has occurred, the terminal generates a latent vector by encoding a measurement result set including a plurality of measurement results, and in response to the occurrence of the event, transmits, to the serving cell, a measurement report generated based on the latent vector.

    IF TRANSCEIVER, RF MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME

    公开(公告)号:US20230268939A1

    公开(公告)日:2023-08-24

    申请号:US18152360

    申请日:2023-01-10

    CPC classification number: H04B1/0075 H04B1/0057

    Abstract: An electronic device including an IF transceiver configured to output a first IF signal and an LO signal via an AC-coupled interface, the first IF signal being up-converted from a first baseband signal, and output a second IF signal and a first control signal via a DC-coupled interface, the second IF signal being up-converted from a second baseband signal, and the first control signal being generated based on the LO signal, and an RF module configured to separate the first IF signal and the LO signal obtained via the AC-coupled interface, separate the second IF signal and the first control signal obtained via the DC-coupled interface, generate a first RF signal based on the first IF signal for transmission via an antenna array, and generate a second RF signal based on the second IF signal for transmission via the antenna array.

    RADIO FREQUENCY COMMUNICATION DEVICE INCLUDING PACKAGE CONTAINING HETEROGENEOUS SEMICONDUCTOR CHIPS

    公开(公告)号:US20250105223A1

    公开(公告)日:2025-03-27

    申请号:US18773012

    申请日:2024-07-15

    Abstract: A radio frequency communication device may include a first package including a first semiconductor chip, the first semiconductor chip including a reception amplifier configured to receive a radio frequency (RF) signal, amplify the received RF signal, and output the amplified RF signal, a second package including a second semiconductor chip and a third semiconductor chip, the second semiconductor chip including a reception chain configured to receive the amplified RF signal from the first semiconductor chip via at least one first wire on a printed circuit board (PCB), and generate a baseband digital signal, and the third semiconductor chip being configured to receive the baseband digital signal from the second semiconductor chip via an internal transmission of the second package, and process the baseband digital signal, and the PCB on which the first package and the second package are mounted.

    PHASE LOCKED LOOP AND ELECTRONIC DEVICE INCLUDING THE SAME

    公开(公告)号:US20220077864A1

    公开(公告)日:2022-03-10

    申请号:US17334077

    申请日:2021-05-28

    Abstract: An electronic device includes a phase locked loop configured to perform a two-point modulation operation on a data signal by using first and second modulation paths, and the phase locked loop is configured to generate, based on a differential value of a first phase error signal generated in the first modulation path, a gain for adjusting a frequency variation of the data signal through the second modulation path so as to match with the frequency variation of the data signal through the first modulation path.

    HYBRID CHIP COMPRISING HYBRID CONNECTOR
    8.
    发明申请
    HYBRID CHIP COMPRISING HYBRID CONNECTOR 有权
    包含混合连接器的混合芯片

    公开(公告)号:US20170026041A1

    公开(公告)日:2017-01-26

    申请号:US15211459

    申请日:2016-07-15

    CPC classification number: H03K19/017509 H01L27/0248

    Abstract: An integrated circuit (IC), a method of testing the IC, and a method of manufacturing the IC are provided. The IC includes analog circuitry, digital circuitry, at least one first connector, and a switching unit operatively coupled with the at least one first connector and configured to, if a first signal is received, couple the analog circuitry and the at least one first connector, and, if a second signal is received, couple the digital circuitry and the at least one first connector.

    Abstract translation: 提供集成电路(IC),IC的测试方法以及IC的制造方法。 所述IC包括模拟电路,数字电路,至少一个第一连接器以及与所述至少一个第一连接器可操作耦合的开关单元,并且被配置为如果接收到第一信号则将所述模拟电路和所述至少一个第一连接器 并且如果接收到第二信号,则耦合数字电路和至少一个第一连接器。

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