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公开(公告)号：US07719819B2
公开(公告)日：2010-05-18
申请号：US12043225
申请日：2008-03-06
申请人： Akihiro Motoki , Makoto Ogawa , Tatsuo Kunishi , Jun Nishikawa , Yoshihiko Takano , Shigeyuki Kuroda
发明人： Akihiro Motoki , Makoto Ogawa , Tatsuo Kunishi , Jun Nishikawa , Yoshihiko Takano , Shigeyuki Kuroda
CPC分类号： H01G4/30 , H01G4/0085 , H01G4/012 , H01G4/232 , Y10T29/435
摘要： A method for manufacturing a laminated electronic component is performed such that a water-repellent agent is applied to end surfaces at which ends of internal electrodes are exposed so as to be filled in spaces along interfaces between insulating layers and the internal electrodes. Subsequently, an abrading step is performed such that the internal electrodes are sufficiently exposed at the end surfaces and an excess water-repellent agent is removed therefrom to enable plating films to be directly formed on the end surfaces.
摘要翻译： 进行层叠电子部件的制造方法，使得将防水剂施加到内部电极的端部露出的端面，以在绝缘层和内部电极之间的界面填充空间。 接着，进行研磨工序，使内部电极在端面充分露出，从其中除去多余的防水剂，使得能够在端面上直接形成镀膜。
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公开(公告)号：US09418790B2
公开(公告)日：2016-08-16
申请号：US13433320
申请日：2012-03-29
申请人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Shuji Matsumoto , Seiichi Nishihara
发明人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Shuji Matsumoto , Seiichi Nishihara
摘要： A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.
摘要翻译： 提供了一种多层陶瓷电子部件，其包括对陶瓷基体具有优良的结合力的薄的外部端子电极。 为了形成外部端子电极，通过在陶瓷基体上直接电镀将Cu电镀膜沉积在内部电极的露出部分上之后，会产生Cu液相，含O2液相和Cu固相， Cu镀膜和陶瓷基体进行热处理，使得Cu氧化物至少在陶瓷基体的界面附近分散在Cu镀膜中。 由于Cu氧化物作为粘合剂发挥功能，所以可以提高Cu镀膜对陶瓷基体的结合力，因此能够获得与陶瓷基体的粘接力优异的外部端子电极。
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公开(公告)号：US08804303B2
公开(公告)日：2014-08-12
申请号：US13439916
申请日：2012-04-05
CPC分类号： H01C7/008 , B05D5/12 , H01F27/2804 , H01G4/005 , H01G4/012 , H01G4/228 , H01G4/2325 , H01G4/30 , H01G4/308 , H01L41/083
摘要： A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.
摘要翻译： 一种多层电子部件的制造方法，其特征在于，具有：制造层叠绝缘层的多个层叠体和沿着绝缘层的界面配置的多个内部电极的层叠体的工序，在所述层叠体的规定表面露出内部电极的边缘 并且在所述预定表面上形成外部电极以电连接所述内部电极的边缘。 形成外部电极的步骤包括：电镀步骤，通过在暴露于预定表面的内部电极的边缘上沉积电镀沉积物并且通过进行电镀生长彼此连接来形成连续的镀膜;以及热处理步骤 在约5ppm或更低的氧分压和约600℃或更高的温度下进行热处理。
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公开(公告)号：US08631549B2
公开(公告)日：2014-01-21
申请号：US13051013
申请日：2011-03-18
申请人： Akihiro Motoki , Kenichi Kawasaki , Makoto Ogawa , Shigeyuki Kuroda , Shunsuke Takeuchi , Hideyuki Kashio
发明人： Akihiro Motoki , Kenichi Kawasaki , Makoto Ogawa , Shigeyuki Kuroda , Shunsuke Takeuchi , Hideyuki Kashio
IPC分类号： H01G4/228
摘要： A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.
摘要翻译： 层压陶瓷电容器的制造方法包括：制备具有第一主表面，第二主表面，第一端面，第二端面，第一侧表面和第二侧表面的层压体的步骤， 绝缘层和具有在第一或第二端面露出的端部的内部电极; 在所述第一和第二端面上形成外部电极的步骤，使得在所述内部电极的所述暴露端部上形成电镀沉积物以彼此连接; 以及形成与外部电极电连接的厚端电极的步骤，使得将导电浆料施加到层压体的第一和第二主表面和第一和第二侧表面的边缘部分上，然后烘烤。
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公开(公告)号：US08520361B2
公开(公告)日：2013-08-27
申请号：US13045585
申请日：2011-03-11
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/232 , H01G4/2325
摘要： A laminated electronic component includes a first plating film that defines a base for external terminal electrodes and that includes a plurality of layers including a first layer made of, for example, copper and a second layer provided on the first layer. The total thickness of the first plating film is about 3 μm to about 15 μm, and the thickness of the second layer is about 2 to 10 times as thick as the thickness of the first layer. The first layer is formed by electroless plating, and the second layer is formed by electrolytic plating. This formation results in a grain size of about 0.5 μm or more of a metal grain included in the second layer, and thus makes the film less susceptible to oxidation.
摘要翻译： 层叠电子部件包括：第一镀膜，其限定外部端子电极的基部，并且包括多个层，所述多个层包括由例如铜制成的第一层和设置在第一层上的第二层。 第一镀膜的总厚度为约3μm至约15μm，第二层的厚度为第一层的厚度的约2至10倍。 第一层由无电镀形成，第二层通过电解电镀形成。 这种形成导致包含在第二层中的约0.5μm或更多的金属颗粒的晶粒尺寸，因此使得膜不易氧化。
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公开(公告)号：US08355241B2
公开(公告)日：2013-01-15
申请号：US12943072
申请日：2010-11-10
CPC分类号： H01G4/2325 , H01G4/30
摘要： A laminated electronic component includes a component body including a plurality of laminated functional layers, a plurality of internal conductors provided inside the component body, and an external terminal electrode that is electrically connected to an internal conductor via an exposed portion of the internal conductor and that is defined by a direct plating film. An average grain diameter of metal grains defining the plating film is about 0.1 μm or less.
摘要翻译： 层叠电子部件包括：具有多个层叠功能层的多个内部导体和设置在所述部件主体内侧的多个内部导体的部件体以及经由所述内部导体的露出部与内部导体电连接的外部端子电极， 由直接电镀膜定义。 限定镀膜的金属颗粒的平均粒径为约0.1μm以下。
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公开(公告)号：US08184424B2
公开(公告)日：2012-05-22
申请号：US12110484
申请日：2008-04-28
CPC分类号： H01C7/008 , B05D5/12 , H01F27/2804 , H01G4/005 , H01G4/012 , H01G4/228 , H01G4/2325 , H01G4/30 , H01G4/308 , H01L41/083
摘要： A multilayer electronic component includes a laminate including insulating layers that are laminated to each other and internal electrodes provided along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate and an external electrode provided on the predetermined surface. The external electrode includes a plated film which is directly provided on the predetermined surface of the laminate so as to electrically connect edges of the internal electrodes exposed at the predetermined surface of the laminate, and at a boundary portion between each of the internal electrodes and the plated film, a counter diffusion layer is provided, in which a metal component in the plated film and a metal component in the internal electrodes are both detectable, and extend to both sides of the internal electrodes and the plated film, and, at a side of the internal electrodes.
摘要翻译： 多层电子部件包括层压体，该层压体包括彼此层压的绝缘层和沿着绝缘层之间的界面设置的内部电极，内部电极的边缘暴露在层压体的预定表面处，并且外部电极设置在预定表面上 。 外部电极包括直接设置在层压体的预定表面上的电镀膜，以电连接在层压体的预定表面处暴露的内部电极的边缘，以及在每个内部电极和 提供了一种反扩散层，其中镀膜中的金属成分和内部电极中的金属成分都是可检测的，并且延伸到内部电极和镀膜的两侧，并且在一侧 的内部电极。
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58.发明授权公开(公告)号：US07933113B2
公开(公告)日：2011-04-26
申请号：US12055372
申请日：2008-03-26
申请人： Akihiro Motoki , Kenichi Kawasaki , Makoto Ogawa , Shigeyuki Kuroda , Shunsuke Takeuchi , Hideyuki Kashio
发明人： Akihiro Motoki , Kenichi Kawasaki , Makoto Ogawa , Shigeyuki Kuroda , Shunsuke Takeuchi , Hideyuki Kashio
IPC分类号： H01G4/228
摘要： A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.
摘要翻译： 层压陶瓷电容器的制造方法包括：制备具有第一主表面，第二主表面，第一端面，第二端面，第一侧表面和第二侧表面的层压体的步骤， 绝缘层和具有在第一或第二端面露出的端部的内部电极; 在所述第一和第二端面上形成外部电极的步骤，使得在所述内部电极的所述暴露端部上形成电镀沉积物以彼此连接; 以及形成与外部电极电连接的厚端电极的步骤，使得将导电浆料施加到层压体的第一和第二主表面和第一和第二侧表面的边缘部分上，然后烘烤。
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公开(公告)号：US20090268374A1
公开(公告)日：2009-10-29
申请号：US12354026
申请日：2009-01-15
IPC分类号： H01G4/12
摘要： A multilayer ceramic electronic component includes a laminate including a stack of a plurality of ceramic layers and a plurality of internal electrodes extending along interfaces between the ceramic layers, and a plurality of external electrodes electrically connecting the internal electrodes exposed at surfaces of the laminate. Each external electrode includes a plating layer at least at the portion directly connected to the internal electrodes. The plating layer has a compressive film stress of about 100 MPa or less or a tensile film stress of about 100 MPa or less.
摘要翻译： 多层陶瓷电子部件包括层叠体，其包括多个陶瓷层的堆叠体和沿着陶瓷层之间的界面延伸的多个内部电极，以及电连接在层叠体的表面露出的内部电极的多个外部电极。 每个外部电极至少包括直接连接到内部电极的部分的镀层。 镀层的压缩应力为约100MPa以下或拉伸膜应力为约100MPa以下。
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公开(公告)号：US20090226705A1
公开(公告)日：2009-09-10
申请号：US12142924
申请日：2008-06-20
CPC分类号： H01G4/30 , H01G4/232 , H01G4/2325 , H05K1/0306 , H05K1/092 , H05K3/102 , H05K3/246 , H05K3/403 , H05K2201/0347 , H05K2203/025 , Y10T29/417 , Y10T29/43 , Y10T29/435 , Y10T428/25
摘要： A method for manufacturing a multilayer electronic component includes a step of preparing a laminate which includes a plurality of stacked insulator layers and a plurality of internal electrodes extending along the interfaces between the insulator layers, and in which an end of each of the plurality of internal electrodes is exposed at a predetermined surface corresponding to one of the first and second end surfaces; a step of forming external electrodes on the predetermined surfaces; and a step of forming thick-film edge electrodes at edge portions. The step of forming external electrodes includes a step of attaching a plurality of conductive particles having a particle size of about 1 μm or more to the predetermined surfaces of the laminate, and a step of performing plating directly on the predetermined surfaces to which the conductive particles are attached.
摘要翻译： 一种制造多层电子部件的方法包括制备层压体的步骤，该层压体包括多个堆叠的绝缘体层和沿着绝缘体层之间的界面延伸的多个内部电极，并且其中多个内部 电极在对应于第一和第二端面之一的预定表面处露出; 在所述预定表面上形成外部电极的步骤; 以及在边缘部分形成厚膜边缘电极的步骤。 形成外部电极的步骤包括将多个粒径为约1μm以上的导电粒子附着到层压体的规定表面的步骤，以及在导电粒子的规定表面上直接进行电镀的工序 附上。
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