Polyamic acid solution composition and polymide film made therefrom
    51.
    发明授权
    Polyamic acid solution composition and polymide film made therefrom 失效
    聚酰胺酸溶液组合物和由其制成的聚酰亚胺膜

    公开(公告)号:US4778872A

    公开(公告)日:1988-10-18

    申请号:US794756

    申请日:1985-11-04

    摘要: Disclosed is an aromatic polyamic acid solution composition comprising an aromatic polyamic acid dissolved in an amount of 5 to 40% by weight in an organic polar solvent. The aromatic polyamic acid is prepared by polymerizing substantially equimolar amounts of an aromatic tetracarboxylic acid component comprising 15 to 85 mole % of a biphenyltetracarboxylic acid or its functional derivative and 15 to 85 mole % of a pyromellitic acid or its functional derivative and an aromatic diamine component comprising 30 to 100 mole % of a phenylenediamine and 0 to 70 mole % of a diaminodiphenyl ether. The aromatic polyamic acid solution composition is formed into an aromatic polyimide film having a relatively small thermal expansion coefficient, high mechanical strength and good flexibility.

    摘要翻译: 公开了一种芳族聚酰胺酸溶液组合物,其包含在有机极性溶剂中以5-40重量%的量溶解的芳族聚酰胺酸。 通过聚合基本上等摩尔量的包含15至85摩尔%的联苯四羧酸或其官能衍生物和15至85摩尔%的均苯四酸或其功能衍生物和芳族二胺组分的芳族四羧酸组分来制备芳族聚酰胺酸 包含30至100摩尔%的苯二胺和0至70摩尔%的二氨基二苯醚。 芳香族聚酰胺酸溶液组合物形成为热膨胀系数比较小,机械强度高,柔软性好的芳香族聚酰亚胺膜。

    Process for continuously producing an aromatic polyimide film
    52.
    发明授权
    Process for continuously producing an aromatic polyimide film 失效
    用于连续生产芳族聚酰亚胺膜的方法

    公开(公告)号:US4473523A

    公开(公告)日:1984-09-25

    申请号:US457441

    申请日:1983-01-12

    CPC分类号: C08G73/1067

    摘要: An aromatic polyimide film having excellent mechanical, thermal and electrical properties, is continuously produced by the steps of:preparing a dope solution having a rotation viscosity of 500-10.sup.5 poises at 100.degree. C. by uniformly dissolving aromatic polyimide in a solvent consisting of at least one phenol compound; extruding the dope solution through a T-die at 50.degree. C. or more, but at least 30.degree. C. below the boiling point of the solvent, under conditions which cause the apparent viscosity and shear stress of the dope solution to be 500-5.times.10.sup.4 poises and 10.sup.4 -10.sup.6 dyne.multidot.cm.sup.-2, respectively, to form a filmy stream of the dope solution; placing the filmy stream of the dope solution on a surface of a supporting means while heating the surface at a temperature of 50.degree. C. or more and continuously moving it along its endless path, maintaining the placed filmy stream of the dope solution on the moving, heating surface of the supporting means until the filmy stream forms a film having a uniform thickness and then the film is solidifed by evaporating the solvent therefrom to an extent that the concentration of the solvent is 50% by weight or less; continuously peeling off the solidified film from the moving heating surface of the supporting means; and drying the peeled film at a temperature of 200.degree. C. to 600.degree. C. to provide an aromatic polyimide film free from the solvent.

    摘要翻译: 通过以下步骤连续生产具有优异的机械,热和电特性的芳族聚酰亚胺膜:在100℃下制备旋转粘度为500-105泊的涂料溶液,通过将芳族聚酰亚胺均匀地溶解在由 至少一种酚化合物; 在使溶液的表观粘度和剪切应力为500℃的条件下,在50℃以上,但低于溶剂沸点至少30℃的条件下,将掺杂溶液挤出, 5x104泊和104-106 dynexcm-2,以形成涂料溶液的薄膜流; 将涂料溶液的薄膜流放在支撑装置的表面上,同时在50℃或更高的温度下加热表面,并使其沿其环形路径连续移动,将涂布溶液的被放置的薄膜流保持在移动 加热支撑装置的表面,直到膜流形成具有均匀厚度的膜,然后通过从其中蒸发溶剂将膜固化至溶剂浓度为50重量%以下的程度; 连续地从支撑装置的移动加热表面剥离凝固膜; 在200〜600℃的温度下干燥剥离膜,得到不含溶剂的芳香族聚酰亚胺膜。

    Process for preparing polyimide solution
    53.
    发明授权
    Process for preparing polyimide solution 失效
    制备聚酰亚胺溶液的方法

    公开(公告)号:US4290936A

    公开(公告)日:1981-09-22

    申请号:US092508

    申请日:1979-11-08

    IPC分类号: C08G73/10 C08K5/13

    CPC分类号: C08G73/1028

    摘要: A polyimide solution is prepared by a process wherein a tetracarboxylic acid ingredient containing at least about 80% by mole of 3,3',4,4'-biphenyltetracarboxylic acid or its functional derivative and an aromatic diamine ingredient containing at least about 50% by mole of 4,4'-diaminodiphenyl ether are polymerized at from about 100.degree. to 300.degree. C. in phenol or a halogenated phenolic compound; the amount of the acid and diamine ingredients being approximately equimolar to each other; whereby polymerization of the tetracarboxylic acid ingredient and the aromatic diamine ingredient is effected while being accompanied by imidation. Preferably, the polymerization accompanied by imidation is effected in a manner such that at least a second half of the polymerization is carried out in a closed reaction system. The resulting polyimide solution is suitable for making therefrom shaped articles, such as films, possessing excellent mechanical properties.

    摘要翻译: 通过以下方法制备聚酰亚胺溶液,其中含有至少约80摩尔%的3,3',4,4'-联苯四羧酸或其官能衍生物的四羧酸成分和包含至少约50%的芳族二胺成分 摩尔的4,4'-二氨基二苯醚在苯酚或卤化酚类化合物中在约100-300℃下聚合; 酸和二胺成分的量彼此近似等摩尔数; 从而在伴随着酰亚胺化的同时进行四羧酸成分和芳香族二胺成分的聚合。 优选地,伴随着酰亚胺化的聚合以这样的方式进行,使得聚合的至少一半在闭合反应体系中进行。 所得到的聚酰亚胺溶液适用于具有优异机械性能的成型制品如膜。

    Aromatic polyimide resin composition
    54.
    发明授权
    Aromatic polyimide resin composition 失效
    芳香族聚酰亚胺树脂组合物

    公开(公告)号:US4247443A

    公开(公告)日:1981-01-27

    申请号:US67166

    申请日:1979-08-16

    IPC分类号: C08J3/09 C08K5/13

    CPC分类号: C08J3/095 C08J2379/08

    摘要: An aromatic polyimide resin composition useful for producing a film or sheet, comprises 2% by weight or more of an imide polymer having at least 90 molar % of a recurring unit of the formula (I): ##STR1## wherein R' is a divalent aromatic radical, and dissolved in an organic polar solvent consisting essentially of one or more halogenated phenol compounds of the formulae (II) or (III): ##STR2## wherein R.sup.2 is a hydrogen atom of a C.sub.1-3 alkyl radical and is a halogen atom, the halogenated phenol compound having a melting point of 100.degree. C. or less and a boiling point of 300.degree. C. or less.

    摘要翻译: 可用于制备薄膜或片材的芳族聚酰亚胺树脂组合物包含2重量%或更多的具有至少90摩尔%的式(I)的重复单元的酰亚胺聚合物:其中R' 并且溶解在基本上由一种或多种式(II)或(III)的卤代酚化合物组成的有机极性溶剂中:其中R 2是 氢原子为C1-3烷基,为卤素原子,该卤代酚化合物的熔点为100℃以下,沸点为300℃以下。