Abstract:
A method for fabricating a pixel structure includes providing a substrate having a pixel area. A first metal layer, a gate insulator and a semiconductor layer are formed on the substrate and patterned by using a first half-tone mask or a gray-tone mask to form a transistor pattern, a lower capacitance pattern and a lower circuit pattern. Next, a dielectric layer and an electrode layer both covering the three patterns are sequentially formed and patterned to expose a part of the lower circuit pattern, a part of the lower capacitance pattern and a source/drain region of the transistor pattern. A second metal layer formed on the electrode layer and the electrode layer are patterned by using a second half-tone mask or the gray-tone mask to form an upper circuit pattern, a source/drain pattern and an upper capacitance pattern. A portion of the electrode layer constructs a pixel electrode.
Abstract:
A semiconductor structure of a display device and the method for fabricating the same are provided. The semiconductor structure is formed on a substrate having a TFT region and a pixel capacitor region thereon. A TFT, including a gate electrode, a source electrode, a drain electrode, a channel layer, and a gate insulating layer, is formed on the TFT region of the substrate. A pixel capacitor is formed on the pixel capacitor region, wherein the pixel capacitor comprises a bottom electrode formed on a bottom dielectric layer, an interlayer dielectric layer formed on the bottom electrode, a top electrode formed on the interlayer dielectric layer, a contact plug passing through the interlayer dielectric layer and electrically connected to the top and bottom electrodes, a capacitor dielectric layer formed on the top electrode, a transparent electrode formed on the capacitor dielectric layer and electrically connected to the drain electrode.
Abstract:
A semiconductor structure of a display device and the method for fabricating the same are provided. The semiconductor structure is formed on a substrate having a TFT region and a pixel capacitor region thereon. A TFT, including a gate electrode, a source electrode, a drain electrode, a channel layer, and a gate insulating layer, is formed on the TFT region of the substrate. A pixel capacitor is formed on the pixel capacitor region, wherein the pixel capacitor comprises a bottom electrode formed on a bottom dielectric layer, an interlayer dielectric layer formed on the bottom electrode, a top electrode formed on the interlayer dielectric layer, a contact plug passing through the interlayer dielectric layer and electrically connected to the top and bottom electrodes, a capacitor dielectric layer formed on the top electrode, a transparent electrode formed on the capacitor dielectric layer and electrically connected to the drain electrode.
Abstract:
A method for fabricating an active device array substrate is provided. A first patterned semiconductor layer, a gate insulator, a first patterned conductive layer and a first dielectric layer is sequentially formed on a substrate. First contact holes exposing the first patterned semiconductor layer are formed in the first dielectric layer and the gate insulator. A second patterned conductive layer and a second patterned semiconductor layer disposed thereon are simultaneously formed on the first dielectric layer. The second conductive layer includes contact conductors and a bottom electrode. The second patterned semiconductor layer includes an active layer. A second dielectric layer having second contact holes is formed on the first dielectric layer, wherein a portion of the second contact holes exposes the active layer. A third patterned conductive layer electrically connected to the active layer through a portion of the second contact holes is formed on the second dielectric layer.
Abstract:
An active device, a pixel structure, and a display panel are provided. The pixel structure includes a scan line, a data line, an active device, a gate insulating layer, a pixel electrode, a capacitor electrode, and a capacitor dielectric layer. The active device includes a gate, a channel, a source, and a drain. The gate is electrically connected to the scan line. The source is electrically connected to the data line. The gate insulating layer is disposed between the gate and the channel. The pixel electrode is electrically connected to the drain. The capacitor electrode is located on the gate insulating layer. The capacitor dielectric layer is located between the capacitor electrode and the drain.
Abstract:
An operation method for a server system includes: (A) under control of a hardware abstraction layer (HAL), a plurality of node management units sharing a hardware resource; (B) if one of the node management units needs to use the hardware resource, the node management unit sending an instruction or a data to the HAL and accordingly the HAL using the hardware resource in represent of the node management unit; and (C) if an external instruction is received, the HAL identifying which transmission port of the hardware resource receives the external instruction, so to send the external instruction to a corresponding node management unit, and after the external instruction is executed, the corresponding node management unit sending back an information to the HAL so that the HAL sends back the information to an external system administrator.
Abstract:
An active device array substrate includes a substrate, scan lines disposed on the substrate, data lines intersected with the scan lines, scan signal transmission lines, and pixel units. The scan signal transmission lines are intersected with the scan lines. Each scan signal transmission line connects one scan line through a node. The pixel unit electrically connects the corresponding data line and the corresponding scan line and includes an active device and a pixel electrode. The active device has a gate, a source, and a drain. The pixel electrode electrically connects the drain. In the pixel units not adjacent to the nodes, a gate-to-drain capacitance of each active device is Cgd1. In the pixel units adjacent to the nodes, the gate-to-drain capacitances of some active devices are Cgd2, the gate-to-drain capacitances of the other active devices are Cgd1, and Cgd1≠Cgd2.
Abstract:
A method for processing an image includes inputting an image, generating a first mean luminance value and a second mean luminance value according to a plurality of pixels within a first luminance interval and a second luminance interval of the image, generating a first luminance threshold according to the first mean luminance value, setting a compensation parameter, generating a first compensation luminance value according to the first mean luminance value and the compensation parameter, generating a second compensation luminance value according to the first luminance threshold, the first mean luminance value, the second mean luminance value, and the compensation parameter, and adjusting luminance values of pixels within the a smaller compensation luminance value and a greater compensation luminance value according to the smaller compensation value and a comparison between the first compensation luminance value and the second compensation luminance value.
Abstract:
A substrate having a gate electrode layer, a gate insulating layer, and a silicon layer thereon is provided. These layers are patterned into a gate area, a gate line and a gate line wiring area. A passivation layer is formed on the entire substrate and patterned to form two contact holes in the passivation layer on the silicon layer at the gate area, and partions of the passivation layer at the gate line and at the gate line wiring areas are removed. An ion implanting layer and a metal layer are formed on the substrate and patterned to form a source region, a drain region, a data line, a data line wiring area and a second layer of the gate line wiring area. A pixel electrode is formed on the passivation layer and electrically coupled to the drain region. Therefore, the TFT array can be fabricated by only four masks.
Abstract:
A semiconductor structure and a method for manufacturing the same are provided. Compared to conventional structures of thin film transistors, the structure of the present invention uses a patterned first metal layer as a data line, and a patterned second metal layer as a gate line. In a thin film transistor, a gate is also located in the patterned first metal layer, and is electrically connected to the gate line located in the patterned second metal layer through a contact hole. A source and a drain of the thin film transistor are electrically connected to the data line through a contact hole. The structure of the present invention increases a storage capacitance and an aperture ratio.