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公开(公告)号：US11515286B2
公开(公告)日：2022-11-29
申请号：US17317478
申请日：2021-05-11
摘要： A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a substrate oxide reduction chamber configured to receive a substrate. The substrate includes a plurality of first electrically conductive structures. The substrate oxide reduction chamber is configured to receive a reducing gas to contact each of the plurality of first electrically conductive structures. The bonding system also includes a substrate oxide prevention chamber for receiving the substrate after the reducing gas contacts the plurality of first electrically conductive structures. The substrate oxide prevention chamber has an inert environment when receiving the substrate. The bonding system also includes a reducing gas delivery system for providing a reducing gas environment during bonding of a semiconductor element to the substrate.
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公开(公告)号：US11515285B2
公开(公告)日：2022-11-29
申请号：US17212395
申请日：2021-03-25
发明人： Hui Xu , JeongHo Yang , Wei Qin , Ziauddin Ahmad
摘要： A method of adjusting a clamping of a semiconductor element against a support structure on a wire bonding machine is provided. The method includes: (a) detecting an indicia of floating of the semiconductor element with respect to the support structure at a plurality of locations of the semiconductor element; and (b) adjusting the clamping of the semiconductor element against the support structure based on the results of step (a).
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53.发明申请公开(公告)号：US20220338838A1
公开(公告)日：2022-10-27
申请号：US17718474
申请日：2022-04-12
IPC分类号： A61B8/00
摘要： An ultrasonic transducer system is provided. The ultrasonic transducer system includes a transducer body, wherein at least a portion of a surface of the transducer body includes a processed area. The processed area has a changed condition at the surface of the transducer body.
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公开(公告)号：US20220270937A1
公开(公告)日：2022-08-25
申请号：US17665984
申请日：2022-02-07
发明人： Gary S. Gillotti , Racheli Herskowits , Wei Qin
摘要： A method of determining a shear strength of a bonded free air ball on a wire bonding machine is provided. The method includes the steps of: (a) providing a free air ball at a working end of a wire bonding tool; (b) bonding the free air ball to a bonding location of a workpiece; (c) moving the wire bonding tool, while in contact with the bonded free air ball, in a direction along the bonding location; (d) monitoring wire bonding process signals during step (c); and (e) determining a shear strength using the wire bonding process signals monitored in step (d).
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公开(公告)号：US20220230314A1
公开(公告)日：2022-07-21
申请号：US17575705
申请日：2022-01-14
IPC分类号： G06T7/00 , G06V10/74 , G06V20/60 , G06V10/141
摘要： A method of operating a pattern recognition system of an electronic device packaging machine is provided. The method includes the steps of: (a) imaging a portion of a workpiece on an electronic device packaging machine using an image acquisition recipe; (b) utilizing a pattern recognition recipe in connection with an image from step (a) to determine if an acceptable level of matching occurs; and (c) automatically varying at least one parameter of at least one of (i) the image acquisition recipe and (ii) the pattern recognition recipe if the acceptable level of matching does not occur in step (b).
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公开(公告)号：US11338464B2
公开(公告)日：2022-05-24
申请号：US17225473
申请日：2021-04-08
发明人： Haim Meilin , Limor Zuri , Aime Elkouby
摘要： A system for forming apertures in a flexible film is provided. The system includes a punching tool for forming apertures in a flexible film. The punching tool defines a through hole therethrough. The system also includes a support plate. The punching tool is configured to press the flexible film against the support plate to form the apertures.
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公开(公告)号：US11285561B2
公开(公告)日：2022-03-29
申请号：US16697010
申请日：2019-11-26
IPC分类号： B23K20/00 , B23K20/10 , B23K101/32
摘要： An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The ultrasonic welding system also includes a z-axis motion system carrying the weld head assembly. The z-axis motion system includes (i) a z-axis forcer for moving the weld head assembly along a z-axis of the ultrasonic welding system, and (ii) a z-axis overtravel mechanism disposed between the z-axis forcer and the weld head assembly.
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公开(公告)号：US20210394292A1
公开(公告)日：2021-12-23
申请号：US17349805
申请日：2021-06-16
摘要： An oven for assisting in conductive joint formation related to a workpiece is provided. The oven includes (a) a chamber, the chamber being at least partially defined by (i) an oven plate and (ii) a cover; (b) a material handling system for moving the workpiece through the oven in connection with a conductive joint formation process; and (c) at least one vacuum chamber within the chamber. The oven provides a stepped temperature profile including a plurality of temperature zones along the oven plate.
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公开(公告)号：US11205633B2
公开(公告)日：2021-12-21
申请号：US16736416
申请日：2020-01-07
摘要： A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a substrate oxide reduction chamber configured to receive a substrate. The substrate includes a plurality of first electrically conductive structures. The substrate oxide reduction chamber is configured to receive a reducing gas to contact each of the plurality of first electrically conductive structures. The bonding system also includes a substrate oxide prevention chamber for receiving the substrate after the reducing gas contacts the plurality of first electrically conductive structures. The substrate oxide prevention chamber has an inert environment when receiving the substrate. The bonding system also includes a reducing gas delivery system for providing a reducing gas environment during bonding of a semiconductor element to the substrate.
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60.发明申请公开(公告)号：US20210272926A1
公开(公告)日：2021-09-02
申请号：US17324977
申请日：2021-05-19
摘要： A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The bonding tool also includes a standoff extending from the body portion, and configured to contact the substrate during at least a portion of the bonding process.
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