Abstract:
A semiconductor integrated circuit is capable of minimizing/decreasing the increase in the inductance of a package due to a power supply network thereof. The semiconductor integrated circuit includes a first power mesh configured to supply a first power to a first internal circuit, a second power mesh configured to supply a second power to a second internal circuit, the first power and the second power being used for different purposes and being equal in DC level, and a connection unit configured to connect the first power mesh to the second power mesh.
Abstract:
A semiconductor package includes a wire board, a plurality of semiconductor chips configured to be stacked over the wire board and to be electrically coupled with the wire board, and at least one shielding unit configured to be formed between the plurality of semiconductor chips and to be maintained at a predetermined voltage.
Abstract:
An impedance-controlled pseudo-open drain output driver circuit includes: a process, voltage, and temperature (PVT) detector configured to have a delay line receiving a reference clock and detect a state variation of the delay line according to PVT conditions to output detection signals; a select signal generator configured to generate a driving select signal based on the detection signals and an output data; and an output driver configured to drive an output terminal, the output driver including a plurality of pull-up/pull-down driving blocks controlled by the driving select signal, each of the pull-up/pull-down driving blocks including a resistor having an intended impedance.
Abstract:
An impedance-controlled pseudo-open drain output driver circuit includes: a process, voltage, and temperature (PVT) detector configured to have a delay line receiving a reference clock and detect a state variation of the delay line according to PVT conditions to output detection signals; a select signal generator configured to generate a driving select signal based on the detection signals and an output data; and an output driver configured to drive an output terminal, the output driver including a plurality of pull-up/pull-down driving blocks controlled by the driving select signal, each of the pull-up/pull-down driving blocks including a resistor having an intended impedance.
Abstract:
A data output circuit of a semiconductor memory apparatus includes a pre-driver generating pull-up and down signals from driving rising and falling data in active periods of rising and falling clocks, respectively, in accordance with a state of an output enable signal. A main driver generates last output data to a common node from the pull-up and down signals. An assistant pre-driver generates an assistant drive signal, which is activated when the rising data disagrees with the falling data, in correspondence with inputs of the rising data, the falling data, the rising clock, the falling clock, and a pipe output control signal. An assistant main driver generates assistant last output data to the common node from the pull-up and down signals in accordance with a state of the assistant drive signal.
Abstract:
The on-chip data transmission controller comprises a data comparison unit for comparing current data with previous data and issuing an inversion flag if the number of data bits phase-transited is larger than a preset number, a first data inversion unit for inverting a phase of the current data when the inversion flag is activated and providing inverted data onto a data bus, and a second data inversion unit for inverting a phase of the data transmitted via the data bus when the inversion flag is activated and outputting inverted data. Through this controller, an on-chip noise that largely occurs as the number of data to be transmitted increases can be reduced, by decreasing transition number of data inputted via the GIO line, in case of using a multi step pre-patch structure to improve an operation speed of a memory device.