公开(公告)号：US20220414268A1

公开(公告)日：2022-12-29

申请号：US17850497

申请日：2022-06-27

Applicant: STMICROELECTRONICS (ROUSSET) SAS

Inventor： Simon LANDRY ,  Yanis LINGE

IPC: G06F21/72

Abstract: The present disclosure relates to a method for protecting a first data item applied to a cryptographic algorithm, executed by a processor, wherein said algorithm is a per-round algorithm, with each round processing contents of first, second and third registers, the content of the second register being masked, during first parity rounds, by the content of a fourth register and the content of the third register being masked, during second parity rounds, by the content of a fifth register.

公开(公告)号：US11538941B2

公开(公告)日：2022-12-27

申请号：US17196226

申请日：2021-03-09

Applicant: STMicroelectronics (Rousset) SAS

Inventor： Abderrezak Marzaki

IPC: H01L29/94 ,  H01L27/11531 ,  H01L29/06 ,  H01L29/66 ,  H01L27/092 ,  H01L27/118

Abstract: An integrated circuit includes a first semiconductor well contained in a semiconductor substrate and a second semiconductor well contained in the first semiconductor well. A capacitive element for the integrated circuit includes a first electrode and a second electrode, where the first electrode includes at least one vertical conductive structure filling a trench extending vertically into the first semiconductor well. The vertical conductive structure is electrically isolated from the first semiconductor well by a dielectric envelope covering a base and the sides of the trench. The vertical conductive structure penetrates into the second semiconductor well at least at one longitudinal end of the trench. The second electrode includes the first semiconductor well and the second semiconductor well.

公开(公告)号：US11537834B2

公开(公告)日：2022-12-27

申请号：US17521524

申请日：2021-11-08

Applicant: STMicroelectronics (Rousset) SAS

Inventor： Olivier Rouy

IPC: G06K19/07 ,  G06K19/077 ,  G06Q20/40 ,  H01Q1/22

Abstract: A smart card includes a first circuit delivering a power supply voltage and a second circuit coupled to the first circuit by an electrical conductor and powered with the power supply voltage. A light-emitting diode has a first terminal coupled to the electrical conductor and a second terminal coupled to a first terminal of the second circuit. During a first operating phase, the first circuit delivers a first value of the power supply voltage and the second circuit applies a first voltage to the first terminal. During a second operating phase, the first circuit delivers a second value of the power supply voltage and the second circuit applies a second voltage to the first terminal.

公开(公告)号：US11536872B2

公开(公告)日：2022-12-27

申请号：US16450365

申请日：2019-06-24

Applicant: STMicroelectronics (Rousset) SAS

Inventor： Abderrezak Marzaki ,  Yoann Goasduff ,  Virginie Bidal ,  Pascal Fornara

IPC: H01H37/04 ,  H01H37/32 ,  H01H37/42 ,  H01H9/02 ,  H01L29/423 ,  H01L49/02 ,  G01V7/04 ,  B81B3/00 ,  B81C1/00 ,  H01L21/3213 ,  H01H61/013

Abstract: A method of operating a mechanical switching device is disclosed. The switching device includes a housing, an assembly disposed in the housing, and a body. The assembly is thermally deformable and comprises a beam held in two different places by two arms secured to edges of the housing. The beam is remote from the body in a first configuration and in contact with and immobilized by the body in a second configuration. The assembly has the first configuration at a first temperature and the second configuration when one of the arms has a second temperature different from the first temperature. The method includes exposing an arm of the assembly to the second temperature, and releasing the beam using a release mechanism. The release mechanism includes a pointed element comprising a pointed region directed towards the body. The pointed element limits an open crater in a concave part of a projection.

公开(公告)号：US11531049B2

公开(公告)日：2022-12-20

申请号：US17322140

申请日：2021-05-17

Applicant: STMicroelectronics (Rousset) SAS

Inventor： Clement Champeix ,  Mathieu Dumont ,  Nicolas Borrel ,  Mathieu Lisart

IPC: G01R29/08 ,  G06F21/55 ,  G06F21/75 ,  H01L23/00 ,  H01L23/66

Abstract: An embodiment integrated circuit includes a first electromagnetic pulse detection device that comprises a first loop antenna formed in an interconnection structure of the integrated circuit, a first end of the first antenna being connected to a first node of application of a power supply potential and a second end of the antenna being coupled to a second node of application of the power supply potential, and a first circuit connected to the second end of the first antenna and configured to output a first signal representative of a comparison of a first current in the first antenna with a first threshold.

公开(公告)号：US20220376622A1

公开(公告)日：2022-11-24

申请号：US17731000

申请日：2022-04-27

Applicant: STMicroelectronics (Rousset) SAS

Inventor： Sebastien Ortet

IPC: H02M3/158

Abstract: In an embodiment a switching power supply includes a voltage ramp generator comprising at least one output capacitor, wherein the generator is configured such that the output capacitor has a first value during a first operating cycle of a first operating mode and a second value during subsequent operating cycles of the first operating mode.

公开(公告)号：US11493470B2

公开(公告)日：2022-11-08

申请号：US16928551

申请日：2020-07-14

Applicant: STMicroelectronics (Rousset) SAS

Inventor： Matthias Vidal-Dho ,  Quentin Hubert ,  Pascal Fornara

IPC: G01N27/22 ,  G01N27/12 ,  H01L23/00

Abstract: Moisture that is possibly present in an integrated circuit is detected autonomously by the integrated circuit itself. An interconnect region of the integrated circuit includes a metal level with a first track and a second track which are separated by a dielectric material. A detection circuit applies a potential difference between the first and second tracks. A current circulating in one of the first and second tracks in response to the potential difference is measured and compared to a threshold. If the current exceeds the threshold, this is indicative of the presence of moisture which renders said dielectric material less insulating.

公开(公告)号：US20220276972A1

公开(公告)日：2022-09-01

申请号：US17667515

申请日：2022-02-08

Applicant: STMicroelectronics (Rousset) SAS

Inventor： François Tailliet

IPC: G06F13/16 ,  G06F12/02

Abstract: The present description concerns attribution, on a communication over an I2C bus, of a first address to a first device by a second device, wherein the second device sends the first address over the I2C bus and, if the second device receives no acknowledgment data, then the first device records the first address.

公开(公告)号：US11411177B2

公开(公告)日：2022-08-09

申请号：US16879577

申请日：2020-05-20

Applicant: STMicroelectronics (Crolles 2) SAS ,  STMICROELECTRONICS (ROUSSET) SAS

Inventor： Philippe Boivin ,  Daniel Benoit ,  Remy Berthelon

IPC: H01L29/02 ,  H01L45/00 ,  H01L27/24

Abstract: The present disclosure concerns a phase-change memory manufacturing method and a phase-change memory device. The method includes forming a first insulating layer in cavities located vertically in line with strips of phase-change material, and anisotropically etching the portions of the first insulating layer located at the bottom of the cavities; and a phase-change memory device including a first insulating layer against lateral walls of cavities located vertically in line with strips of phase-change material.

公开(公告)号：US11387197B2

公开(公告)日：2022-07-12

申请号：US17166156

申请日：2021-02-03

Applicant: STMicroelectronics (Rousset) SAS ,  STMicroelectronics (Research & Development) Limited

Inventor： Mathieu Lisart ,  Bruce Rae

IPC: H01L23/00

Abstract: An electronic integrated circuit chip includes a semiconductor substrate with a front side and a back side. A first reflective shield is positioned adjacent the front side of the semiconductor substrate and a second reflective shield is positioned adjacent the back side of the semiconductor substrate. Photons are emitted by a photon source to pass through the semiconductor substrate and bounce off the first and second reflective shields to reach a photon detector at the front side of the semiconductor substrate. The detected photons are processed in order to determine whether to issue an alert indicating the existence of an attack on the electronic integrated circuit chip.