公开(公告)号：US20080023687A1

公开(公告)日：2008-01-31

申请号：US11599391

申请日：2006-11-15

Applicant: Seung Tae Choi ,  Hyun Soo Kim ,  Jin Seung Choi ,  Suk Jin Ham ,  Ki Hwan Kwon ,  Chang Youl Moon

Inventor： Seung Tae Choi ,  Hyun Soo Kim ,  Jin Seung Choi ,  Suk Jin Ham ,  Ki Hwan Kwon ,  Chang Youl Moon

IPC: H01L29/06

CPC classification number: H01L33/0079 ,  H01L33/54

Abstract: A method of manufacturing a light emitting device includes: forming a plurality of independent light emitting portions on a growth substrate; separating the light emitting portions from the growth substrate; mounting the light emitting portions onto a receiving substrate; and dicing the receiving substrate, onto which the light emitting portions are mounted, into a light emitting unit. Residual stress, which occurs when the light emitting portions are separated from the substrate, can be reduced, and the light emitting portions can be mounted onto the receiving substrate in a fluid state, whereby the light emitting device can be easily mass produced with excellent quality, and its manufacturing costs can be reduced.

Abstract translation: 一种制造发光器件的方法包括：在生长衬底上形成多个独立的发光部分; 将发光部分与生长衬底分离; 将发光部分安装在接收基板上; 并将其上安装有发光部分的接收基板切割成发光单元。 当发光部分与基板分离时发生的残余应力可以减小，并且发光部分可以以流体状态安装到接收基板上，由此可以容易地以优质的质量批量生产发光器件 ，其制造成本可以降低。

公开(公告)号：US20080007814A1

公开(公告)日：2008-01-10

申请号：US11582964

申请日：2006-10-19

Applicant: Young-tack Hong ,  Jong-seok Kim ,  In-sang Song ,  Sang-wook Kwon ,  Seung-jin Oh ,  Eun-sung Lee ,  Seung-tae Choi

Inventor： Young-tack Hong ,  Jong-seok Kim ,  In-sang Song ,  Sang-wook Kwon ,  Seung-jin Oh ,  Eun-sung Lee ,  Seung-tae Choi

IPC: G02B26/00

CPC classification number: G02B26/0841 ,  B81B2201/016 ,  B81C1/00571 ,  H01H1/0036 ,  H01H1/58 ,  H01H59/0009 ,  H01H2001/0052

Abstract: A MEMS structure includes an element substrate, an electrode pad formed on the element substrate, a MEMS activated element formed on the element substrate, and having an electrode-connecting layer, and a connecting line to electrically connect the electrode pad and the electrode-connecting layer.

Abstract translation: MEMS结构包括元件基板，形成在元件基板上的电极焊盘，形成在元件基板上的MEMS激活元件，并具有电极连接层，以及连接线，用于将电极焊盘和电极连接 层。

公开(公告)号：US20070194336A1

公开(公告)日：2007-08-23

申请号：US11520834

申请日：2006-09-14

Applicant: Su-ho Shin ,  Kyu Ho Shin ,  Jin-seung Choi ,  Soon Cheol Kweon ,  Seung-tae Choi ,  Ki-hwan Kwon ,  Chang Youl Moon

Inventor： Su-ho Shin ,  Kyu Ho Shin ,  Jin-seung Choi ,  Soon Cheol Kweon ,  Seung-tae Choi ,  Ki-hwan Kwon ,  Chang Youl Moon

IPC: H01L33/00 ,  H01L21/00

CPC classification number: H01L33/483 ,  H01L33/62 ,  H01L33/64 ,  H01L33/641 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light emitting device package including: a heat dissipating substrate including a cavity; a first conductive pattern formed on the cavity; a light emitting device installed on the first conductive pattern; and a second conductive pattern formed on the heat dissipating substrate at a periphery of the first conductive pattern. The second conductive pattern is electrically separated from the first conductive pattern, and the first and second conductive patterns supply power required for operating the light emitting device.

Abstract translation: 1.一种发光器件封装，包括：散热衬底，其包括空腔; 形成在所述空腔上的第一导电图案; 安装在第一导电图案上的发光器件; 以及形成在第一导电图案的周边的散热基板上的第二导电图案。 第二导电图案与第一导电图案电分离，并且第一和第二导电图案提供操作发光器件所需的功率。

公开(公告)号：US20070001582A1

公开(公告)日：2007-01-04

申请号：US11473188

申请日：2006-06-23

Applicant: Su-ho Shin ,  Chang-youl Moon ,  Kyu-ho Shin ,  Soon-cheol Kweon ,  Seung-tae Choi ,  Ki-hwan Kwon

Inventor： Su-ho Shin ,  Chang-youl Moon ,  Kyu-ho Shin ,  Soon-cheol Kweon ,  Seung-tae Choi ,  Ki-hwan Kwon

IPC: H01J1/62

CPC classification number: F21V29/51 ,  F21K9/00 ,  F21V29/52 ,  F21V29/67 ,  F21V29/677 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/648 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0203 ,  H05K1/0272 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: A light emitting diode (LED) array module includes a plurality of LEDs; and a substrate which mounts the LEDs and has a built-in cooling device for cooling heat generated when the LED is driven. The cooling device includes a heat radiation space formed on the substrate and a minute passage member which is wick- or mesh-structured to form a plurality of minute passages that operate by a heat pipe principle in the heat radiation space. The cooling device operating by the heat pipe principle is integrally formed on the substrate mounted with the LEDs, so heat radiation performance of the LEDs is enhanced, such that the LEDs can operate stably for a long time.

Abstract translation: 发光二极管（LED）阵列模块包括多个LED; 以及安装LED并具有内置冷却装置的基板，用于冷却LED被驱动时产生的热量。 冷却装置包括形成在基板上的散热空间和微通道构件，其是芯或网状构造以形成通过热管原理在热辐射空间中操作的多个微小通道。 通过热管原理操作的冷却装置一体地形成在安装有LED的基板上，因此LED的散热性能得到增强，使得LED可以长时间稳定地工作。