METHOD FOR FORMING FLUORIDE SPRAY COATING, AND FLUORIDE SPRAY COATING COVERED MEMBER
    63.
    发明申请
    METHOD FOR FORMING FLUORIDE SPRAY COATING, AND FLUORIDE SPRAY COATING COVERED MEMBER 审中-公开
    形成氟喷涂涂层的方法和氟喷涂涂层成员

    公开(公告)号:US20150064406A1

    公开(公告)日:2015-03-05

    申请号:US14385644

    申请日:2012-11-28

    Abstract: [Problem] To provide a fluoride spray coating covered member in which a fluoride spray coating firmly adheres by coating carbide cermet to a surface of a substrate and interposing it, and to propose a method therefor. [Solution] A fluoride spray coating is formed in such a manner that an undercoat layer of carbide cermet, which covers a substrate in a film-shaped manner while a tip portion of carbide cermet particles is embedded in the substrate, or a primer part of carbide cermet, is formed by blowing a carbide cermet material at a high velocity by using a spray gun to a surface of the substrate, and after that, a fluoride particle is sprayed thereon.

    Abstract translation: [问题]提供一种氟化物喷涂覆盖部件,其中通过将碳化金属陶瓷涂覆到基材的表面并插入氟化物喷涂层,并提出其方法。 [解决方案]以这样一种方式形成氟化物喷涂,其中硬质合金金属陶瓷的底涂层在将硬质合金金属陶瓷颗粒的尖端部分嵌入基材中时以膜状方式覆盖基材,或底漆部分 碳化物金属陶瓷是通过使用喷枪将高硬度的碳化物金属陶瓷材料吹到基材表面而形成的,然后在其上喷涂氟化物粒子。

    PLASMA PROCESSING APPARATUS AND METHOD
    64.
    发明申请
    PLASMA PROCESSING APPARATUS AND METHOD 有权
    等离子体加工设备和方法

    公开(公告)号:US20130162142A1

    公开(公告)日:2013-06-27

    申请号:US13705712

    申请日:2012-12-05

    CPC classification number: H05H1/46 H01J37/32477 H01J37/32495

    Abstract: A plasma processing apparatus includes a processing chamber; a lower electrode serving as a mounting table for mounting thereon a target object; and an upper electrode or an antenna electrode provided to be opposite to the lower electrode. The apparatus further includes a gas supply source for introducing a gas including a halogen-containing gas and an oxygen gas into the processing chamber and a high frequency power supply for applying a high frequency power for generating plasma to at least one of the upper electrode, the antenna electrode, or the lower electrode. Among inner surfaces of the processing chamber which are exposed to the plasma, at least a part of or all of the surfaces between a mounting position of the target object and the upper electrode, or the antenna electrode; or at least a part of or all of the surfaces of the upper electrode or the antenna electrode are coated with a fluorinated compound.

    Abstract translation: 等离子体处理装置包括处理室; 用作安装台的下电极,用于安装目标物体; 以及设置成与下电极相对的上电极或天线电极。 该装置还包括用于将包含含卤素气体和氧气的气体引入处理室的气体供给源和用于将高频电力施加到上部电极中的至少一个的高频电源, 天线电极或下电极。 在暴露于等离子体的处理室的内表面中,目标物体的安装位置与上部电极或天线电极之间的至少一部分或全部表面; 或上部电极或天线电极的至少一部分或全部表面涂覆有氟化合物。

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