公开(公告)号：US20060084239A1

公开(公告)日：2006-04-20

申请号：US11246103

申请日：2005-10-11

申请人： Yusuke Nagai ,  Kentaro Iizuka

发明人： Yusuke Nagai ,  Kentaro Iizuka

IPC分类号： H01L21/78 ,  H01L21/301

CPC分类号： H01L21/6835 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B28D5/0052 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/68336

摘要： A method of dividing a wafer having a plurality of dividing lines formed in a lattice pattern on the front surface, into individual chips along the dividing lines, the method comprising: a deteriorated layer forming step for forming a deteriorated layer in the inside of the wafer by applying a laser beam capable of passing through the wafer along the dividing lines; a wafer supporting step for putting one surface side of the wafer on a support tape which is mounted on an annular frame and shrinks by an external stimulus; a wafer-dividing step for dividing the wafer along the dividing lines where the deteriorated layer has been formed by exerting external force to the wafer which has been put on the support tape; and a chip spacing formation step for shrinking the shrink area between the inner periphery of the annular frame and the area, to which the wafer is affixed, in the support tape affixed to the divided wafer, by exerting an external stimulus to the shrink area.

摘要翻译： 一种将沿着分割线将具有以格状图案形成的多个分割线的晶片分割为分割线的各个芯片的方法，该方法包括：劣化层形成步骤，用于在晶片内部形成劣化层 通过施加能够沿分割线穿过晶片的激光束; 用于将晶片的一个表面侧放置在安装在环形框架上并通过外部刺激收缩的支撑带上的晶片支撑步骤; 晶片分割步骤，用于通过对已经放置在支撑带上的晶片施加外力沿着已经形成有劣化层的分割线分割晶片; 以及芯片间隔形成步骤，用于通过向收缩区域施加外部刺激，将环形框架的内周边和晶片固定到的区域之间的收缩区域收缩在固定到分割晶片的支撑带中。

公开(公告)号：US20050282359A1

公开(公告)日：2005-12-22

申请号：US11151526

申请日：2005-06-14

申请人： Yusuke Nagai ,  Satoshi Kobayashi ,  Masaru Nakamura

发明人： Yusuke Nagai ,  Satoshi Kobayashi ,  Masaru Nakamura

IPC分类号： B23K26/40 ,  B28D5/00 ,  H01L21/30 ,  H01L21/304 ,  H01L21/78

CPC分类号： H01L21/304 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  H01L21/78 ,  H01L2221/6834

摘要： A wafer processing method for dividing a wafer having function elements in area sectioned by dividing lines formed on the front surface in a lattice pattern into individual chips along the dividing lines, comprising a deteriorated layer forming step for forming a deteriorated layer on the side of the back surface of a position at a distance corresponding to the final thickness of the chip from the front surface of the wafer by applying a laser beam capable of passing through the wafer along the dividing lines from the back surface of the wafer; a dividing step for dividing the wafer into individual chips along the dividing lines by applying external force to the wafer in which the deteriorated layer has been formed along the dividing lines; and a back surface grinding step for grinding the back surface of the wafer divided into individual chips to the final thickness of the chip.

摘要翻译： 一种晶片处理方法，其特征在于，将沿着划分线将在前表面上形成的划分线的划分线的区域的功能元件分割为各个芯片，所述晶片处理方法包括在劣化层形成步骤中形成劣化层 通过施加能够从晶片的背面沿着划分线穿过晶片的激光束，从与晶片的前表面相对应的与芯片的最终厚度相对应的距离的位置的背面; 分割步骤，通过沿着分割线向已经形成有劣化层的晶片施加外力，沿着分割线将晶片分割成单个芯片; 以及后表面研磨步骤，用于将分成单个芯片的晶片的背面研磨至芯片的最终厚度。

公开(公告)号：US20050259459A1

公开(公告)日：2005-11-24

申请号：US11128197

申请日：2005-05-13

申请人： Yusuke Nagai ,  Toshiyuki Tateishi ,  Tadato Nagasawa

发明人： Yusuke Nagai ,  Toshiyuki Tateishi ,  Tadato Nagasawa

IPC分类号： B23K26/00 ,  B23K26/40 ,  B23K101/40 ,  B28D5/00 ,  G11C5/06 ,  H01L21/301 ,  H01L21/68 ,  H01L21/78

CPC分类号： H01L21/78 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336 ,  Y10T225/12

摘要： A method of dividing a wafer having a plurality of first dividing lines and a plurality of second dividing lines intersecting with the first dividing lines formed on the surface of the wafer along the first dividing lines and the second dividing lines, which comprises an internal deteriorated layer forming step for forming a deteriorated layer in the inside of the water along the first dividing lines and the second dividing lines by applying a laser beam along the first dividing lines and the second dividing lines; an intersection deteriorated layer forming step for forming a deteriorated layer thicker than the deteriorated layer formed in the internal deteriorated layer forming step by applying a laser beam to intersection areas between the first dividing lines and the second dividing lines; and a dividing step for dividing the wafer into individual chips along the first dividing lines and the second dividing lines by exerting external force to the wafer.

摘要翻译： 一种分割具有多个第一分割线和多条第二分割线的晶片的方法，该晶片具有与形成在晶片表面上的第一分割线相交的第一分割线和第二分割线，该第一分割线包括内部劣化层 通过沿着第一分割线和第二分割线施加激光束，沿着第一分割线和第二分割线在水的内部形成劣化层的形成步骤; 交叉劣化层形成步骤，用于通过对第一分割线和第二分割线之间的交叉区域施加激光来形成比内部劣化层形成步骤中形成的劣化层更厚的劣化层; 以及分割步骤，通过向晶片施加外力，将晶片沿着第一分割线和第二分割线分割成单独的芯片。

公开(公告)号：US20050127299A1

公开(公告)日：2005-06-16

申请号：US11004818

申请日：2004-12-07

申请人： Yusuke Nagai ,  Satoshi Kobayashi ,  Yukio Morishige ,  Masaru Nakamura ,  Masahiro Murata

发明人： Yusuke Nagai ,  Satoshi Kobayashi ,  Yukio Morishige ,  Masaru Nakamura ,  Masahiro Murata

IPC分类号： B23K26/00 ,  B23K101/40 ,  G03F7/20 ,  H01L21/301 ,  G03B27/42

CPC分类号： G03F7/70608

摘要： An apparatus for checking a laser processed deteriorated layer formed in the inside of a workpiece by applying a laser beam capable of passing through the workpiece to the workpiece, comprising a workpiece holding means for holding the workpiece; a light application means for applying light capable of passing through the workpiece held on the workpiece holding means to the exposed surface of the workpiece at a predetermined angle; a light receiving means for receiving light that is applied from the light application, passes through the inside of the workpiece and is reflected from the workpiece; and a display means for displaying the state of light received by the light receiving means.

摘要翻译： 一种用于通过将能够通过工件的激光束施加到工件来检查在工件内部形成的激光加工劣化层的装置，包括用于保持工件的工件保持装置; 光施加装置，用于施加能够以保持在工件保持装置上的工件以预定角度穿过工件的暴露表面的光; 用于接收从光照射施加的光的光接收装置通过工件内部并从工件反射; 以及显示装置，用于显示由光接收装置接收的光的状态。

公开(公告)号：US20050090077A1

公开(公告)日：2005-04-28

申请号：US10968100

申请日：2004-10-20

申请人： Yusuke Nagai ,  Masuru Nakamura ,  Satoshi Kobayashi ,  Yukio Morishige

发明人： Yusuke Nagai ,  Masuru Nakamura ,  Satoshi Kobayashi ,  Yukio Morishige

IPC分类号： B23K26/00 ,  B23K26/40 ,  B23K101/40 ,  B28D5/00 ,  H01L21/301 ,  H01L21/304 ,  H01L21/78 ,  H01L21/46

CPC分类号： H01L21/3043 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50 ,  B28D5/0011 ,  H01L21/78

摘要： A method of dividing a wafer along predetermined dividing lines, comprising the steps of a deteriorated layer forming step for applying a pulse laser beam capable of passing through the wafer along the dividing lines to form deteriorated layers in the inside of the wafer along the dividing lines; an extensible protective tape affixing step for affixing an extensible protective tape to one side of the wafer before or after the deteriorated layer forming step; and a dividing step for dividing the wafer along the deteriorated layers by expanding the protective tape affixed to the wafer after the deteriorated layer forming step.

摘要翻译： 一种沿着预定分割线分割晶片的方法，包括以下步骤：劣化层形成步骤，用于施加能够沿着分割线穿过晶片的脉冲激光束，以沿着分割线在晶片内部形成劣化层 ; 用于将可延伸保护带固定在劣化层形成步骤之前或之后的晶片的一侧的可延伸的保护带固定步骤; 以及分割步骤，用于通过在劣化层形成步骤之后扩展固定在晶片上的保护带，沿着劣化层分割晶片。

公开(公告)号：US20050082264A1

公开(公告)日：2005-04-21

申请号：US10961219

申请日：2004-10-12

申请人： Yusuke Nagai ,  Satoshi Kobayashi ,  Yukio Morishige ,  Masaru Nakamura ,  Masahiro Murata

发明人： Yusuke Nagai ,  Satoshi Kobayashi ,  Yukio Morishige ,  Masaru Nakamura ,  Masahiro Murata

IPC分类号： B23K26/00 ,  B23K26/03 ,  B23K101/40 ,  H01L21/301

CPC分类号： B23K26/032 ,  B23K26/03 ,  B23K26/034 ,  B23K2101/40

摘要： A laser beam machine comprising a chuck table for holding a workpiece and a laser beam application means for applying a laser beam to the workpiece held on the chuck table, wherein the machine further comprises a light detection means for detecting light of a processing portion of the workpiece to which a laser beam is applied from the laser beam application means and a control means for judging whether the output value of the light detection means falls within a predetermined permissible range.

摘要翻译： 一种激光束机，包括用于保持工件的卡盘台和用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，其中该机器还包括光检测装置，用于检测 从激光束施加装置施加激光束的工件和用于判断光检测装置的输出值是否落在预定容许范围内的控制装置。

公开(公告)号：US20050061788A1

公开(公告)日：2005-03-24

申请号：US10938724

申请日：2004-09-13

申请人： Yusuke Nagai ,  Satoshi Kobayashi

发明人： Yusuke Nagai ,  Satoshi Kobayashi

IPC分类号： B23K26/06 ,  B23K26/00 ,  B23K26/14 ,  B23K26/40 ,  B23K26/42 ,  B23Q11/14 ,  G02B7/00 ,  H01L21/78

CPC分类号： G02B7/008 ,  B23K26/40 ,  B23K26/703 ,  B23K2103/50

摘要： A laser beam machine comprising a workpiece holding means for holding a workpiece and a laser beam application means comprising a condenser for applying a laser beam to the workpiece held on the workpiece holding means, wherein the machine further comprises thermostatic means for maintaining the temperature of a case for housing the condenser lenses of the condenser constant.

摘要翻译： 一种激光束机，包括用于保持工件的工件保持装置和激光束施加装置，该激光束施加装置包括用于将激光束施加到被保持在工件保持装置上的工件的冷凝器，其中该机器还包括恒温装置， 用于容纳聚光镜的聚光镜的情况恒定。

公开(公告)号：US20050060407A1

公开(公告)日：2005-03-17

申请号：US10921898

申请日：2004-08-20

申请人： Yusuke Nagai

发明人： Yusuke Nagai

IPC分类号： H04L12/28 ,  G06F13/00 ,  G06F15/16 ,  G06F15/173 ,  H04L9/32 ,  H04L29/06

CPC分类号： H04L63/0236

摘要： When it is judged that the IP address of a PC for the administrator is not included in IP addresses received from the PC for the administrator under accessing while a PC whose access is to be authorized is registered (NO in S20), the IP address of the PC for the administrator is registered besides IP addresses received for identifying PCs (S21). Meanwhile, when it is judged that the IP address of a PC for the administrator is included in IP addresses received from the PC for the administrator under accessing while a PC whose access is to be rejected is registered (YES in S43), the IP addresses received for identifying PCs are registered after excluding the IP address of the PC for the administrator therefrom (S21). This makes it possible to avoid a situation that an access from the terminal device for the administrator to a network device becomes impossible.

摘要翻译： 当在待访问的PC被注册的情况下（在S20中为“否”），当从PC接收到的用于管理员的PC的IP地址中被判断为不包括用于管理员的PC的IP地址时， 除了接收到用于识别PC的IP地址之外，还登记用于管理员的PC（S21）。 同时，当登录了用于管理员的PC的IP地址时，在登录了要访问的PC的PC中接收到的用于管理员的PC的IP地址被包括在用于管理员的PC的IP地址中（S43中为是）时，IP地址 在从其中排除用于管理员的PC的IP地址之后，注册用于识别PC的接收（S21）。 这使得可以避免从终端设备对管理员到网络设备的访问变得不可能的情况。

公开(公告)号：US20140113365A1

公开(公告)日：2014-04-24

申请号：US14114134

申请日：2012-04-26

申请人： Yusuke Nagai ,  Keiji Naruse ,  Ken Takahashi ,  Eijiro Tokuyama

发明人： Yusuke Nagai ,  Keiji Naruse ,  Ken Takahashi ,  Eijiro Tokuyama

IPC分类号： C12M1/00

CPC分类号： C12M23/26 ,  C12M23/04 ,  C12M23/34

摘要： A cell culture vessel supplies cells close to the center of gel and deeper down to the bottom with sufficient nutrients for attaining an enhanced survival rate of the cultivated cells. The cell culturing vessel comprises a culture tray capable of holding a liquid culture medium and a cell mixture container fixed to inner walls of the culture tray for retaining the cell mixture. Once the culture tray is filled with the liquid culture medium, the cell mixture retained in the cell mixture container has its opposite outer parts exposed to the liquid culture medium.

摘要翻译： 细胞培养容器提供靠近凝胶中心的细胞，更深层次地向底部提供足够的营养物质，以达到提高培养细胞的存活率。 细胞培养容器包括能够保持液体培养基的培养托盘和固定在培养托盘的内壁上的细胞混合物容器，用于保持细胞混合物。 一旦培养皿填充有液体培养基，保留在细胞混合容器中的细胞混合物具有暴露于液体培养基的相对的外部部分。

公开(公告)号：US07631090B2

公开(公告)日：2009-12-08

申请号：US10921898

申请日：2004-08-20

申请人： Yusuke Nagai

发明人： Yusuke Nagai

IPC分类号： G06F15/16 ,  G06F15/173

CPC分类号： H04L63/0236

摘要： When it is judged that the IP address of a PC for the administrator is not included in IP addresses received from the PC for the administrator under accessing while a PC whose access is to be authorized is registered (NO in S20), the IP address of the PC for the administrator is registered besides IP addresses received for identifying PCs (S21). Meanwhile, when it is judged that the IP address of a PC for the administrator is included in IP addresses received from the PC for the administrator under accessing while a PC whose access is to be rejected is registered (YES in S43), the IP addresses received for identifying PCs are registered after excluding the IP address of the PC for the administrator therefrom (S21). This makes it possible to avoid a situation that an access from the terminal device for the administrator to a network device becomes impossible.

摘要翻译： 当在待访问的PC被注册的情况下（在S20中为“否”），当从PC接收到的用于管理员的PC的IP地址中被判断为不包括用于管理员的PC的IP地址时， 除了接收到用于识别PC的IP地址之外，还登记用于管理员的PC（S21）。 同时，当登录了用于管理员的PC的IP地址时，在登录了要访问的PC的PC中接收到的用于管理员的PC的IP地址被包括在用于管理员的PC的IP地址中（S43中为是）时，IP地址 在从其中排除用于管理员的PC的IP地址之后，注册用于识别PC的接收（S21）。 这使得可以避免从终端设备对管理员到网络设备的访问变得不可能的情况。