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公开(公告)号：US10416380B1
公开(公告)日：2019-09-17
申请号：US15631781
申请日：2017-06-23
Applicant: Acacia Communications, Inc.
Inventor： Li Chen , Long Chen , Christopher Doerr
Abstract: Techniques for forming a photonic device that includes a suspended photonic structure suspended over a silicon substrate are described. A sealed cavity is positioned between the silicon substrate and the photonic structure, and one or more regions of dielectric material act to seal the cavity. Additional structure(s) may be formed on top of the dielectric material.
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62.发明授权公开(公告)号：US10345525B2
公开(公告)日：2019-07-09
申请号：US15639018
申请日：2017-06-30
Applicant: Acacia Communications, Inc.
Inventor： Christopher Doerr , Li Chen , Long Chen
Abstract: Photonic integrated circuits including controllable cantilevers are described. Such photonic integrated circuits may be used in connection with other optical devices, in which light is transferred between the photonic integrated circuit and one of these optical device. The photonic integrated circuit may comprise an optical waveguide having an end disposed proximate to a facet of the cantilever. The orientation of the cantilever may be actively controlled in one or two dimensions, thus adjusting the orientation of the optical waveguide. Actuation of the cantilever may be performed, for example, thermally and/or electrostatically. Orientation of the cantilever may be performed in such a way to align the optical waveguide with an optical device.
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公开(公告)号：US10203453B2
公开(公告)日：2019-02-12
申请号：US15620601
申请日：2017-06-12
Applicant: Acacia Communications, Inc.
Inventor： Long Chen
Abstract: Techniques for forming a facet optical coupler to couple light at an edge of silicon substrate are described. The facet optical coupler includes a silicon substrate, a layer of second material disposed on the silicon substrate and in direct contact with the edge of the silicon substrate, and an undercut region disposed between a portion of the silicon substrate and the layer of second material. The undercut region is offset from the edge to provide mechanical integrity of the facet optical coupler to improve production of photonic integrated circuits having the facet optical coupler from a wafer.
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公开(公告)号：US10088733B2
公开(公告)日：2018-10-02
申请号：US15230582
申请日：2016-08-08
Applicant: Acacia Communications, Inc.
Inventor： Christopher Doerr , Ricardo Aroca , Long Chen
IPC: H04B10/12 , G02F1/225 , H04B10/516 , H04B10/80 , G02F1/21
Abstract: A segmented traveling wave Mach Zehnder optical modulator is described. The segmented traveling wave Mach Zehnder optical modulator may comprise two or more radio frequency (RF) segments, and each RF segment may be configured to support a modulating RF signal. The modulating RF signals may be configured to modulate an optical signal propagating along an optical path of the segmented traveling wave Mach Zehnder optical modulator. The RF modulating signal in the second RF segment may be generated by amplifying the modulating RF signal of the first RF segment, using an RF amplifier. The RF amplifier may be configured to amplify a band-pass spectral portion of the modulating RF signal.
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公开(公告)号：US20180039151A1
公开(公告)日：2018-02-08
申请号：US15230582
申请日：2016-08-08
Applicant: Acacia Communications, Inc.
Inventor： Christopher Doerr , Ricardo Aroca , Long Chen
IPC: G02F1/225 , H04B10/80 , H04B10/516
CPC classification number: G02F1/2255 , G02F1/2257 , G02F2001/212 , G02F2201/127 , H04B10/516 , H04B10/801
Abstract: A segmented traveling wave Mach Zehnder optical modulator is described. The segmented traveling wave Mach Zehnder optical modulator may comprise two or more radio frequency (RF) segments, and each RF segment may be configured to support a modulating RF signal. The modulating RF signals may be configured to modulate an optical signal propagating along an optical path of the segmented traveling wave Mach Zehnder optical modulator. The RF modulating signal in the second RF segment may be generated by amplifying the modulating RF signal of the first RF segment, using an RF amplifier. The RF amplifier may be configured to amplify a band-pass spectral portion of the modulating RF signal.
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Patent Agency Ranking
公开(公告)号：US09829659B2
公开(公告)日：2017-11-28
申请号：US15295241
申请日：2016-10-17
Applicant: Acacia Communications, Inc.
Inventor： Long Chen , Christopher Doerr , Diedrik Vermeulen
CPC classification number: G02B6/4225 , G02B6/12004 , G02B6/122 , G02B6/1228 , G02B6/2852 , G02B6/30 , G02B6/34 , G02B6/4227 , G02B2006/12109 , G02B2006/12126
Abstract: A photonic integrated circuit (PIC) may be optically aligned to a plurality of optical components (e.g., an optical fiber array). Optical alignment may be facilitated by the use of an optical impedance element coupled between a first input/output (I/O) optical waveguide and a second I/O optical waveguide of the PIC. The optical impedance element me be configured to be transmissive during optical alignment and to be non-transmissive during the regular operation of the PIC.
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公开(公告)号：US20170336658A1
公开(公告)日：2017-11-23
申请号：US15584509
申请日：2017-05-02
Applicant: Acacia Communications, Inc.
Inventor： Long Chen
CPC classification number: G02F1/025 , G02B6/00 , G02B6/134 , G02F2001/0156
Abstract: Disclosed are designs and methods of fabrication of silicon carrier-depletion based electro-optical modulators having doping configurations that produce modulators exhibiting desirable modulation efficiency, optical absorption loss and bandwidth characteristics. The disclosed method of fabrication of a modulator having such doping configurations utilizes counter doping to create narrow regions of relatively high doping levels near a waveguide center.
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68.发明申请公开(公告)号：US20170293073A1
公开(公告)日：2017-10-12
申请号：US15482391
申请日：2017-04-07
Applicant: Acacia Communications, Inc.
Inventor： Long Chen , Christopher Doerr
CPC classification number: G02B6/122 , G02B6/12002 , G02B6/136 , G02B6/138 , G02B6/30 , G02B2006/12061 , G02B2006/12085 , G02B2006/12176
Abstract: Aspects of the present application provide an optical device comprising a suspended optical component over a cavity, such as an undercut region in a substrate. The cavity is filled with a filler material. In some embodiments, the optical device and a method may be provided to fill the cavity with the filler material using a reservoir and a channel in the substrate connecting the reservoir to the cavity to be filled.
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公开(公告)号：US20170285437A1
公开(公告)日：2017-10-05
申请号：US15472946
申请日：2017-03-29
Applicant: Acacia Communications, Inc.
Inventor： Christopher Doerr , Long Chen , Ricardo Aroca
CPC classification number: G02F1/2257 , G02F1/025 , G02F1/2255 , G02F2001/212
Abstract: An optical Mach Zehnder modulator is described. The optical Mach Zehnder modulator may comprise a plurality of segments separated by curved waveguides. For example, an optical Mach Zehnder modulator may comprise a first waveguide arm having a first pn-junction formed therein, a second waveguide arm having a second pn-junction formed therein, a third waveguide arm coupled to the first waveguide arm via a first curved waveguide and a fourth waveguide arm coupled to the second waveguide arm via a second curved waveguide. The segments may have the same polarities. Alternatively, the segments may have opposite polarities. The different segments may be driven using different RF signals. The RF signals may be delayed from one another.
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公开(公告)号：US20170285265A1
公开(公告)日：2017-10-05
申请号：US15620601
申请日：2017-06-12
Applicant: Acacia Communications, Inc.
Inventor： Long Chen
CPC classification number: G02B6/1228 , G02B6/122 , G02B6/14 , G02B6/24 , G02B6/305 , G02B2006/12097
Abstract: Techniques for forming a facet optical coupler to couple light at an edge of silicon substrate are described. The facet optical coupler includes a silicon substrate, a layer of second material disposed on the silicon substrate and in direct contact with the edge of the silicon substrate, and an undercut region disposed between a portion of the silicon substrate and the layer of second material. The undercut region is offset from the edge to provide mechanical integrity of the facet optical coupler to improve production of photonic integrated circuits having the facet optical coupler from a wafer.
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