Electronic devices having circuitry in housing attachment structures

    公开(公告)号:US11050452B2

    公开(公告)日:2021-06-29

    申请号:US16589643

    申请日:2019-10-01

    Applicant: Apple Inc.

    Abstract: An electronic device housing may be formed from housing members. A first housing member may form a display cover layer that overlaps pixels. During operation, the pixels may display an image that is viewable through the display cover layer. The second housing member may have a rear wall portion and a sidewall. A band may be coupled to the sidewall or other portion of the second housing member. The first and second housing members may be attached together using a housing member attachment structure. The housing member attachment structure may have layers of adhesive and printed circuit structures. The printed circuit structures may include metal traces that form an antenna and that form capacitive force sensor electrodes on opposing sides of a compressible member.

    Headphone eartips with internal support components for outer eartip bodies

    公开(公告)号:US10771879B2

    公开(公告)日:2020-09-08

    申请号:US16780881

    申请日:2020-02-03

    Applicant: Apple Inc.

    Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.

    Headphone eartips with internal support components for outer eartip bodies

    公开(公告)号:US10595113B2

    公开(公告)日:2020-03-17

    申请号:US16148552

    申请日:2018-10-01

    Applicant: Apple Inc.

    Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.

    Speaker module architecture
    66.
    发明授权

    公开(公告)号:US10595107B2

    公开(公告)日:2020-03-17

    申请号:US15710779

    申请日:2017-09-20

    Applicant: Apple Inc.

    Abstract: An electronic device includes a housing having an opening comprising an audio port and a speaker assembly carried by the device housing. The speaker assembly includes a water ejection system having a diaphragm coupled to a magnetic driver and a mesh that covers the audio port where the diaphragm and the mesh together define an acoustic volume. When a water ejection signal is received at the magnetic driver, the magnetic driver is caused to move the diaphragm in a manner that ejects water contained within the acoustic volume out of the acoustic volume and through the mesh.

    Concealed connector for an electronic device

    公开(公告)号:US10542338B2

    公开(公告)日:2020-01-21

    申请号:US15989115

    申请日:2018-05-24

    Applicant: Apple Inc.

    Abstract: An electronic device includes a concealed electrical connector positioned within a speaker opening defined by an enclosure of the electronic device. A mating connector is configured to fit through the speaker opening and couple to the concealed electrical connector to form a bidirectional communications path with circuitry within the electronic device.

    Handsfree beam pattern configuration

    公开(公告)号:US10251008B2

    公开(公告)日:2019-04-02

    申请号:US15037302

    申请日:2014-09-25

    Applicant: Apple Inc.

    Abstract: An audio system that adjusts one or more beam patterns emitted by one or more loudspeaker arrays based on the preferences of users/listeners is described. The audio system includes an audio receiver that contains a listener location estimator, a listener identifier, and a voice command processor. Inputs from the listener location estimator, the listener identifier, and the voice command processor are fed into an array processor. The array processor drives the one or more loudspeaker arrays to emit beam patterns into the listening area based on inputs from each of these devices. By examining the location, preferred usage settings, and voice commands from listeners, the generated beam patterns are customized to the explicit and implicit preferences of the listeners with minimal direct input. Other embodiments are also described.

    Headphone eartips with internal support components for outer eartip bodies

    公开(公告)号:US10129625B2

    公开(公告)日:2018-11-13

    申请号:US15253794

    申请日:2016-08-31

    Applicant: Apple Inc.

    Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.

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