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    ANGLE SENSOR USING EDDY CURRENTS AND HAVING HARMONIC COMPENSATION
    62.
    发明公开
    ANGLE SENSOR USING EDDY CURRENTS AND HAVING HARMONIC COMPENSATION 审中-公开

    公开(公告)号：US20240318950A1

    公开(公告)日：2024-09-26

    申请号：US18187919

    申请日：2023-03-22

    Applicant: Allegro MicroSystems, LLC

    Inventor： Rémy Lassalle-Balier ,  Alexander Latham

    IPC: G01B7/30 ,  G01D5/20

    CPC classification number: G01B7/30 ,  G01D5/20

    Abstract: Methods and apparatus for sensors having a main coil to direct a magnetic field at a rotatable target for inducing eddy currents in the target and a receive coil having sine and cosine coils for detecting a reflected field from the target wherein each of the sine and cosine coils is configured such that an asymmetric reflected field from the target seen by the sine and cosine coils corresponds to conductive properties of a surface of the target in relation to the main coil and the receive coil. The sine coil comprises first and second constituent coils offset from each other to compensate for third order harmonic effects and the cosine coil comprises first and second constituent coils to compensate for third order harmonic effects.

    Magnetic field differential linear torque sensor
    63.
    发明授权
    Magnetic field differential linear torque sensor 有权

    公开(公告)号：US11953395B2

    公开(公告)日：2024-04-09

    申请号：US17655469

    申请日：2022-03-18

    Applicant: Allegro MicroSystems, LLC

    Inventor： Alexander Latham

    IPC: G01L3/10

    CPC classification number: G01L3/104

    Abstract: Differential magnetic field torque sensors include first and second magnetic field concentrators that guide magnetic flux to a magnetic field sensor from first and second magnetic field directors and a target, such as a multipole magnet assembly configured as a ring magnet. The magnetic field concentrators have pairs of sections that are interdigitated and configured adjacent to magnetic field sensing elements of the magnetic field sensor. The magnetic field directors can each have a plurality of teeth, which can be interdigitated and adjacent or proximate to the target. The magnetic field directors can be configured to be mounted as a unit to a rotatable shaft while the target can be configured to be mounted to a different rotatable shaft. The magnetic field concentrators and magnetic field sensor can be fixed while the magnetic field directors and target can rotate with respect to each other about a twist axis.

    Auto-calibration for coreless current sensors
    64.
    发明授权
    Auto-calibration for coreless current sensors 有权

    公开(公告)号：US11885866B2

    公开(公告)日：2024-01-30

    申请号：US17804647

    申请日：2022-05-31

    Applicant: Allegro MicroSystems, LLC

    Inventor： Yannick Vuillermet ,  Loïc André Messier ,  Simon E. Rock ,  Maxwell McNally ,  Alexander Latham ,  Andreas P. Friedrich

    IPC: G01R35/00 ,  G01R15/20 ,  G01R33/07

    CPC classification number: G01R35/005 ,  G01R15/202 ,  G01R15/207 ,  G01R33/072

    Abstract: Auto-calibrating current sensor integrated circuits (ICs) are configured for mounting at a position relative to a conductor. The auto-calibrating current sensor ICs can include a plurality of magnetic field sensing elements disposed at different locations within the integrated circuit, respectively, and can be configured to measure a magnetic field produced by a current carried by the conductor. The auto-calibrating sensors can include an electromagnetic model of the IC and the conductor. The model can be operative to determine a magnetic field at points in space due to a given current in the conductor at a known location of the conductor from the IC, and also the inverse situation of determining an unknown current and/or location of the conductor based on measurements of a magnetic field at known locations in space due to an unknown current in the conductor. Related auto-calibration methods are also described.

    SENSOR PACKAGE AND SYSTEM
    65.
    发明公开
    SENSOR PACKAGE AND SYSTEM 审中-公开

    公开(公告)号：US20240003995A1

    公开(公告)日：2024-01-04

    申请号：US17810353

    申请日：2022-07-01

    Applicant: Allegro MicroSystems, LLC

    Inventor： Simon E. Rock ,  Georges El Bacha ,  Shaun D. Milano ,  Loïc André Messier ,  Alexander Latham ,  Maxwell McNally ,  Shixi Louis Liu

    IPC: G01R33/06 ,  G01R19/00 ,  H05K1/18

    CPC classification number: G01R33/06 ,  G01R19/0092 ,  H05K1/181 ,  H05K2201/10151

    Abstract: A current sensor IC includes a lead frame having a die attach pad and elongated leads extending in a single direction with respect to the die attach pad, a semiconductor die having a first surface attached to the die attach pad and a second, opposing surface supporting magnetic field sensing elements, and a non-conductive mold material. A first portion of the mold material encloses the semiconductor die and the die attach pad, a second portion of the mold material encloses a portion of the elongated leads, and the mold material further includes a wing structure between the first portion and the second portion. In assembly, the first portion of the mold material extends into a cutout through a current conductor and the wing structure abuts a surface of the conductor. The current sensor can implement differential sensing based on signals from at least two magnetic field sensing elements.

    ANGLE SENSOR WITH A SINGLE DIE USING A SINGLE TARGET
    66.
    发明公开
    ANGLE SENSOR WITH A SINGLE DIE USING A SINGLE TARGET 审中-公开

    公开(公告)号：US20230332878A1

    公开(公告)日：2023-10-19

    申请号：US18337829

    申请日：2023-06-20

    Applicant: Allegro MicroSystems, LLC

    Inventor： Rémy Lassalle-Balier ,  Solène Bastien ,  Paul A. David ,  Maxime Rioult ,  Alexander Latham ,  Shaun Veilleux

    IPC: G01B7/30 ,  G01R33/00 ,  G01R33/09

    CPC classification number: G01B7/30 ,  G01R33/0094 ,  G01R33/098 ,  G01R33/091

    Abstract: In one aspect, an angle sensor includes a first plurality of magnetoresistance elements located at a first location on an axis and a second plurality of magnetoresistance elements located at a second location on the axis. The first plurality of magnetoresistance elements includes a first one or more magnetoresistance elements each having a reference direction in a first direction; and a second one or more magnetoresistance elements each having a reference direction in a second direction. The second plurality of magnetoresistance elements includes a third one or more magnetoresistance elements each having a reference direction in the first direction, and a fourth one or more magnetoresistance elements each having a reference direction in the second direction. The angle sensor senses movement of a magnetic target, and the magnetic target is a ring magnet or a single pole magnet.

    Current sensor integrated circuit with a dual gauge lead frame
    68.
    发明授权
    Current sensor integrated circuit with a dual gauge lead frame 有权

    公开(公告)号：US11768230B1

    公开(公告)日：2023-09-26

    申请号：US17657135

    申请日：2022-03-30

    Applicant: Allegro MicroSystems, LLC

    Inventor： Shixi Louis Liu ,  Maxwell McNally ,  Alexander Latham

    IPC: G01R15/20 ,  H10N52/01 ,  H10N52/80 ,  H10N52/00

    CPC classification number: G01R15/207 ,  H10N52/01 ,  H10N52/101 ,  H10N52/80

    Abstract: A current sensor IC includes a unitary lead frame having a primary conductor with a first thickness and a secondary lead having a second thickness less than the first thickness. A semiconductor die adjacent to the primary conductor includes a magnetic field sensing circuit to sense a magnetic field associated with the current and generate a secondary signal indicative of the current. An insulation structure is disposed between the primary conductor and the die. A mold material encloses a first portion of the secondary lead and a second portion of the secondary lead that is exposed outside of the package has the second thickness. A method of manufacturing a current sensor IC includes providing a unitary lead frame sheet having a first thickness, decreasing a thickness of a portion of the sheet to provide a first portion with the first thickness and a second portion with a smaller thickness, and stamping the sheet to form a repeating lead frame pattern, with each pattern including a primary conductor formed from the first portion and secondary leads formed from the second portion.

    Integrated shunt and magnetic field current sensor
    69.
    发明授权
    Integrated shunt and magnetic field current sensor 有权

    公开(公告)号：US11555832B2

    公开(公告)日：2023-01-17

    申请号：US17189480

    申请日：2021-03-02

    Applicant: Allegro MicroSystems, LLC

    Inventor： Andreas P. Friedrich ,  Loïc André Messier ,  Alexander Latham

    IPC: G01R15/20 ,  G01R19/00 ,  G01K7/22

    Abstract: According to some embodiments, a device includes: a magnetic field current sensor magnetically coupled to a conductor and configured to generate a magnetic field signal having a magnitude responsive to a current flowing through the conductor; a shunt interface having first and second input terminals electrically coupled to ends of a shunt disposed along the conductor, the shunt interface configured to generate a shunt signal having a magnitude responsive to the current flowing through the conductor; and a diagnostic circuit configured to receive the magnetic field signal and the shunt signal and to generate a fault signal based on a comparison between the magnitude of the magnetic field signal and the magnitude of the shunt signal.

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