公开(公告)号：US11021790B2

公开(公告)日：2021-06-01

申请号：US16521826

申请日：2019-07-25

Applicant: Applied Materials, Inc.

Inventor： Zhepeng Cong ,  Schubert Chu ,  Nyi O. Myo ,  Kartik Shah ,  Surajit Kumar

IPC: C23C16/44 ,  C30B25/08 ,  C23C16/458 ,  C23C16/46

Abstract: Embodiments herein relate to chamber liners with a multi-piece design for use in processing chambers. The multi-piece design can have an inner portion and an outer portion. A portion of the inner surface of the outer portion may be designed to be in contact with the outer surface of the inner portion at a single junction point, creating a thermal barrier between the inner portion and outer portion, thus reducing heat transfer from the inner portion and outer portion. The thermal barrier creates higher temperatures at the chamber liner inner surface and therefore leads to shorter heat up times within the chamber. Additionally, the thermal barrier also creates lower temperatures near the base ring and outer surface of the outer ring, thereby protecting the chamber walls and requiring less thermal regulation/dissipation at the chamber walls.

公开(公告)号：US10697061B2

公开(公告)日：2020-06-30

申请号：US15808543

申请日：2017-11-09

Applicant: Applied Materials, Inc.

Inventor： Kartik Shah ,  Nisha Prakash Holla ,  Vijaykumar Krithivasan ,  Anantha K. Subramani ,  Hamid Noorbakhsh

IPC: C23C16/40 ,  C23C16/455 ,  C23C16/505 ,  C23C16/44 ,  C23C16/452 ,  H01J37/32

Abstract: An apparatus and method for cooling a gas distribution assembly with a cooling plate. The cooling plate having a body having a top surface, an outer perimeter, a center, an inner zone and an outer zone. A plurality of channels formed through the top surface. The plurality of channels having a first outer channel having one or more first outer channel segments configured for flowing a first cooling fluid from a cooling fluid inlet to a cooling fluid outlet and a first inner channel disposed between the first outer channel and the center having one or more first inner channel segments configured for flowing a second cooling fluid from a cooling fluid inlet to a cooling fluid outlet wherein flow in adjacent segments is in an opposite direction.

公开(公告)号：US10232324B2

公开(公告)日：2019-03-19

申请号：US13918033

申请日：2013-06-14

Applicant: APPLIED MATERIALS, INC.

Inventor： Kartik Shah ,  Kalyanjit Ghosh ,  Scott McClelland

IPC: B01F3/02 ,  B01F5/00 ,  B01F5/06 ,  H01J37/32

Abstract: Embodiments of gas mixing apparatus are provided herein. In some embodiments, a gas mixing apparatus may include a container defining an interior volume, the container having a closed top and bottom and a sidewall having a circular cross section with respect to a central axis of the container passing through the top and bottom; a plurality of first inlets coupled to the container proximate the top of the container to provide a plurality of process gases to the interior volume of the container, the plurality of first inlets disposed such that a flow path of the plurality of process gases through the plurality of first inlets is substantially tangential to the sidewall of the container; and an outlet coupled to the container proximate the bottom of the container to allow the plurality of process gases to be removed from the interior volume of the container.

公开(公告)号：US20180211826A1

公开(公告)日：2018-07-26

申请号：US15411579

申请日：2017-01-20

Applicant: Applied Materials, Inc.

Inventor： Wei W. Wang ,  Kartik Shah ,  Vishwas Kumar Pandey

IPC: H01J37/34 ,  C23C14/54

CPC classification number: H01J37/3497 ,  C23C14/3407 ,  C23C14/35 ,  C23C14/54 ,  H01J37/3417

Abstract: Physical vapor deposition target assemblies and methods of cooling physical vapor deposition targets are disclosed. An exemplary target assembly comprises a flow pattern including a plurality of rows and bends fluidly connected to an inlet end and an outlet end.

公开(公告)号：US20160083840A1

公开(公告)日：2016-03-24

申请号：US14863063

申请日：2015-09-23

Applicant: Applied Materials, Inc.

Inventor： PREETHAM RAO ,  Subramani Iyer ,  Kartik Shah ,  Mehran Behdjat

IPC: C23C16/458 ,  C23C16/46

CPC classification number: C23C16/4583 ,  C23C16/4581 ,  H01L21/67098 ,  H01L21/68785

Abstract: Embodiments described herein include a susceptor for semiconductor processing including an oriented graphite plate that may have a thickness of at least 1 mm. The susceptor may have a support member, and the oriented graphite plate may be disposed on the support member. The support member may have a center thermal conduit and an edge thermal conduit, and may be substantially solid between the center thermal conduit and the edge thermal conduit.

Abstract translation: 本文描述的实施例包括用于半导体处理的基座，其包括可以具有至少1mm的厚度的取向石墨板。 基座可以具有支撑构件，并且取向的石墨板可以设置在支撑构件上。 支撑构件可以具有中心热导管和边缘热导管，并且可以在中心热导管和边缘热导管之间基本上是固体的。