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公开(公告)号:US20240014904A1
公开(公告)日:2024-01-11
申请号:US18471139
申请日:2023-09-20
Applicant: Ayar Labs, Inc.
Inventor: Chen Sun , Roy Edward Meade , Mark Wade , Alexandra Wright , Vladimir Stojanovic , Rajeev Ram , Milos Popovic , Derek Van Orden , Michael Davenport
IPC: H04B10/50 , H01S5/40 , H01S5/026 , H04B10/80 , H01S5/02325
CPC classification number: H04B10/504 , H01S5/4012 , H01S5/4087 , H01S5/0268 , H04B10/801 , H04B10/506 , H01S5/02325 , H01S5/02476
Abstract: An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.
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公开(公告)号:US20230341628A1
公开(公告)日:2023-10-26
申请号:US18333434
申请日:2023-06-12
Applicant: Ayar Labs, Inc.
Inventor: John Fini , Derek Van Orden , Mark Wade
CPC classification number: G02B6/2934 , G02B6/12007
Abstract: A photonic system includes a passive optical cavity and an optical waveguide. The passive optical cavity has a preferred radial mode for light propagation within the passive optical cavity. The preferred radial mode has a unique light propagation constant within the passive optical cavity. The optical waveguide is configured to extend past the passive optical cavity such that at least some light propagating through the optical waveguide will evanescently couple into the passive optical cavity. The passive optical cavity and the optical waveguide are collectively configured such that a light propagation constant of the optical waveguide substantially matches the unique light propagation constant of the preferred radial mode within the passive optical cavity.
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公开(公告)号:US11799554B2
公开(公告)日:2023-10-24
申请号:US17866482
申请日:2022-07-16
Applicant: Ayar Labs, Inc.
Inventor: Chen Sun , Roy Edward Meade , Mark Wade , Alexandra Wright , Vladimir Stojanovic , Rajeev Ram , Milos Popovic , Derek Van Orden , Michael Davenport
CPC classification number: H04B10/504 , H01S5/0268 , H01S5/02325 , H01S5/4012 , H01S5/4087 , H04B10/506 , H04B10/801 , G02B6/42 , H01S5/02476 , H01S5/50
Abstract: An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.
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公开(公告)号:US11705972B2
公开(公告)日:2023-07-18
申请号:US17583967
申请日:2022-01-25
Applicant: Ayar Labs, Inc.
Inventor: Roy Edward Meade , Vladimir Stojanovic , Chen Sun , Mark Wade , Hugo Saleh , Charles Wuischpard
CPC classification number: H04B10/80 , G02B6/4249 , G02B6/4274 , G11C5/04 , G11C5/06 , G11C5/141 , G11C11/42 , H04B10/516
Abstract: A computer memory system includes an electro-optical chip, an electrical fanout chip electrically connected to an electrical interface of the electro-optical chip, and at least one dual in-line memory module (DIMM) slot electrically connected to the electrical fanout chip. A photonic interface of the electro-optical chip is optically connected to an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals into outgoing optical data signals for transmission through the optical link. The optical macro also converts incoming optical data signals from the optical link into incoming electrical data signals and transmits the incoming electrical data signals to the electrical fanout chip. The electrical fanout chip directs bi-directional electrical data communication between the electro-optical chip and a dynamic random access memory (DRAM) DIMM corresponding to the at least one DIMM slot.
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公开(公告)号:US11675132B2
公开(公告)日:2023-06-13
申请号:US17562522
申请日:2021-12-27
Applicant: Ayar Labs, Inc.
Inventor: John Fini , Derek Van Orden , Mark Wade
CPC classification number: G02B6/2934 , G02B6/12007
Abstract: A photonic system includes a passive optical cavity and an optical waveguide. The passive optical cavity has a preferred radial mode for light propagation within the passive optical cavity. The preferred radial mode has a unique light propagation constant within the passive optical cavity. The optical waveguide is configured to extend past the passive optical cavity such that at least some light propagating through the optical waveguide will evanescently couple into the passive optical cavity. The passive optical cavity and the optical waveguide are collectively configured such that a light propagation constant of the optical waveguide substantially matches the unique light propagation constant of the preferred radial mode within the passive optical cavity.
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公开(公告)号:US11563506B2
公开(公告)日:2023-01-24
申请号:US17410443
申请日:2021-08-24
Applicant: Ayar Labs, Inc.
Inventor: Vladimir Stojanovic , Alexandra Wright , Chen Sun , Mark Wade , Roy Edward Meade
Abstract: A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module. The TORminator module coverts the multiple uplink optical data signals to multiple uplink electrical data signals, and transmits the multiple uplink electrical data signals to the rack switch.
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公开(公告)号:US20220390691A1
公开(公告)日:2022-12-08
申请号:US17892361
申请日:2022-08-22
Applicant: Ayar Labs, Inc.
Inventor: Michael Davenport , Mark Wade , Chong Zhang
IPC: G02B6/42
Abstract: A substrate includes a first area in which a laser array chip is disposed. The substrate includes a second area in which a planar lightwave circuit is disposed. The second area is elevated relative to the first area. A trench is formed in the substrate between the first area and the second area. The substrate includes a third area in which an optical fiber alignment device is disposed. The third area is located next to and at a lower elevation than the second area within the substrate. The planar lightwave circuit has optical inputs facing toward and aligned with respective optical outputs of the laser array chip. The planar lightwave circuit has optical outputs facing toward the third area. The optical fiber alignment device is configured to receive optical fibers such that optical cores of the optical fibers respectively align with the optical outputs of the planar lightwave circuit.
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公开(公告)号:US11424830B2
公开(公告)日:2022-08-23
申请号:US17014665
申请日:2020-09-08
Applicant: Ayar Labs, Inc.
Inventor: Chen Sun , Roy Edward Meade , Mark Wade , Alexandra Wright , Vladimir Stojanovic , Rajeev Ram , Milos Popovic , Derek Van Orden
IPC: G02B6/12 , H04B10/50 , H01S5/40 , H01S5/026 , H04J14/02 , H01S5/02325 , H01S5/50 , H01S5/024 , H01S4/00
Abstract: A laser module includes a laser source and an optical marshalling module. The laser source is configured to generate and output a plurality of laser beams. The plurality of laser beams have different wavelengths relative to each other. The different wavelengths are distinguishable to an optical data communication system. The optical marshalling module is configured to receive the plurality of laser beams from the laser source and distribute a portion of each of the plurality of laser beams to each of a plurality of optical output ports of the optical marshalling module, such that all of the different wavelengths of the plurality of laser beams are provided to each of the plurality of optical output ports of the optical marshalling module. An optical amplifying module can be included to amplify laser light output from the optical marshalling module and provide the amplified laser light as output from the laser module.
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公开(公告)号:US20220148627A1
公开(公告)日:2022-05-12
申请号:US17583967
申请日:2022-01-25
Applicant: Ayar Labs, Inc.
Inventor: Roy Edward Meade , Vladimir Stojanovic , Chen Sun , Mark Wade , Hugo Saleh , Charles Wuischpard
Abstract: A computer memory system includes an electro-optical chip, an electrical fanout chip electrically connected to an electrical interface of the electro-optical chip, and at least one dual in-line memory module (DIMM) slot electrically connected to the electrical fanout chip. A photonic interface of the electro-optical chip is optically connected to an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals into outgoing optical data signals for transmission through the optical link. The optical macro also converts incoming optical data signals from the optical link into incoming electrical data signals and transmits the incoming electrical data signals to the electrical fanout chip. The electrical fanout chip directs bi-directional electrical data communication between the electro-optical chip and a dynamic random access memory (DRAM) DIMM corresponding to the at least one DIMM slot.
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公开(公告)号:US20210405296A1
公开(公告)日:2021-12-30
申请号:US17353789
申请日:2021-06-21
Applicant: Ayar Labs, Inc.
Inventor: Pavan Bhargava , Derek Van Orden , Mark Wade , John Fini , Chen Sun , Milos Popovic , Anatol Khilo
Abstract: An electro-optic combiner includes a polarization splitter and rotator (PSR) that directs a portion of incoming light having a first polarization through a first optical waveguide (OW). The PSR rotates a portion of the incoming light having a second polarization to the first polarization to provide polarization-rotated light. The PSR directs the polarization-rotated light through a second OW. Each of the first and second OW's has a respective combiner section. The first and second OW combiner sections extend parallel to each other and have opposite light propagation directions. A plurality of ring resonators is disposed between the combiner sections of the first and second OW's and within an evanescent optically coupling distance of both the first and second OW's. Each of ring resonators operates at a respective resonant wavelength to optically couple light from the combiner section of the first OW into the combiner section of the second OW.
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