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    Transaction card with embedded electronic components and process for manufacture
    61.
    发明授权
    Transaction card with embedded electronic components and process for manufacture 有权

    公开(公告)号：US11315002B2

    公开(公告)日：2022-04-26

    申请号：US17101096

    申请日：2020-11-23

    Applicant: CompoSecure, LLC

    Inventor： Adam Lowe ,  Syeda Hussain

    IPC: G06K19/077 ,  G06K19/06 ,  G06K19/02

    Abstract: A process for making a transaction card defined by a plurality of layers is described. The process includes providing a first portion of the card, the first portion comprising a non-plastic layer having first and second faces and a thickness therebetween; forming an opening in the non-plastic layer, the opening defined through the first face; disposing embedded electronics in the opening; providing a second portion of the card; and providing a fill disposed in portions of the opening not occupied by the embedded electronics and attaching the first portion of the card to the second portion of the card.

    Metal dual interface card
    65.
    发明授权
    Metal dual interface card 有权

    公开(公告)号：US11182662B2

    公开(公告)日：2021-11-23

    申请号：US16476949

    申请日：2018-01-10

    Applicant: CompoSecure, LLC

    Inventor： Adam Lowe

    IPC: G06K19/06 ,  G06K19/07 ,  G06K19/077

    Abstract: A dual interface transaction card includes a metal card body having first and second surfaces. A contact-only transaction module is secured in the card body, the contact-only transaction module including contact pads disposed on the first surface of the card body and including a first transaction circuit. A contactless transaction module is secured in a void in the metal card body. The contactless transaction module includes a second transaction circuit and an antenna. Also disclosed is a process for manufacturing the dual interface transaction card. The process includes the steps of constructing a metal card body having the first and second surfaces, securing the contact-only transaction module in the metal card body, forming the void in the metal card body, and securing the contactless transaction module in the void.

    DI METAL TRANSACTION DEVICES AND PROCESSES FOR THE MANUFACTURE THEREOF
    68.
    发明申请
    DI METAL TRANSACTION DEVICES AND PROCESSES FOR THE MANUFACTURE THEREOF 有权

    公开(公告)号：US20210154898A1

    公开(公告)日：2021-05-27

    申请号：US17168382

    申请日：2021-02-05

    Applicant: CompoSecure, LLC

    Inventor： Adam Lowe ,  John Esau

    IPC: B29C45/14 ,  G06K19/077 ,  H01Q13/10 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  B22D19/00 ,  B29C45/17

    Abstract: A transaction device includes a metal layer with one or more discontinuities in the metal layer. Each discontinuity comprises a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity that defines a path from the device periphery to the opening. A transponder chip module is disposed in the opening. A booster antenna is in communication with the transponder chip module. The device may include at least one fiber-reinforced epoxy laminate material layer. The transponder chip module and the booster antenna may comprise components in a payment circuit, with the metal layer electrically isolated from the payment circuit. The booster antenna may be formed on or embedded in the fiber-reinforced epoxy laminate material layer. Processes for manufacturing transaction devices including a metal layer with one or more fiber-reinforced epoxy laminate material layers are also disclosed.

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