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公开(公告)号:US11853829B2
公开(公告)日:2023-12-26
申请号:US15861321
申请日:2018-01-03
Applicant: CompoSecure, LLC
Inventor: John Herslow , Adam Lowe , Luis Dasilva
IPC: B32B7/12 , B32B9/04 , B32B13/04 , B32B13/06 , B32B13/12 , B32B15/04 , B32B15/08 , B32B15/10 , B32B15/14 , B32B21/08 , B32B21/14 , B32B27/08 , B32B27/12 , B32B27/36 , B32B3/04 , B32B3/08 , C25D5/02 , C25D11/04 , C25D11/18 , G06K19/077 , C25D11/08 , C25D11/24 , C25D11/26 , C25D11/34 , G06K19/02 , B32B33/00 , B32B21/00 , B32B9/00 , B32B21/04 , B32B3/14 , B32B3/30 , B32B9/02 , B32B15/20 , B32B27/38 , B32B37/12 , B32B37/18 , B32B38/06 , B32B38/10 , B32B38/14 , B32B38/00 , C25D3/46 , C25D3/48 , C25D3/50 , C25D7/00 , B32B27/18
CPC classification number: G06K19/07722 , B32B3/04 , B32B3/08 , B32B3/14 , B32B3/30 , B32B7/12 , B32B9/00 , B32B9/005 , B32B9/02 , B32B9/025 , B32B9/04 , B32B9/041 , B32B9/042 , B32B9/045 , B32B9/047 , B32B13/04 , B32B13/06 , B32B13/12 , B32B15/04 , B32B15/043 , B32B15/08 , B32B15/10 , B32B15/14 , B32B15/20 , B32B21/00 , B32B21/04 , B32B21/08 , B32B21/14 , B32B27/08 , B32B27/12 , B32B27/36 , B32B27/38 , B32B33/00 , B32B37/12 , B32B37/18 , B32B38/06 , B32B38/10 , B32B38/14 , B32B38/145 , C25D3/46 , C25D3/48 , C25D3/50 , C25D5/022 , C25D7/00 , C25D11/04 , C25D11/08 , C25D11/243 , C25D11/26 , C25D11/34 , G06K19/02 , G06K19/022 , B32B27/18 , B32B38/0012 , B32B38/105 , B32B2038/0016 , B32B2250/03 , B32B2250/04 , B32B2255/00 , B32B2255/06 , B32B2255/08 , B32B2255/10 , B32B2255/20 , B32B2255/205 , B32B2264/108 , B32B2307/40 , B32B2307/402 , B32B2307/584 , B32B2307/732 , B32B2311/24 , B32B2313/04 , B32B2315/02 , B32B2317/08 , B32B2317/16 , B32B2363/00 , B32B2425/00 , C25D11/246 , Y10T29/49004 , Y10T29/49828 , Y10T156/10 , Y10T156/1039 , Y10T156/1082
Abstract: Cards made in accordance with the invention include a decorative layer attached to a core layer, where the decorative layer is designed to provide selected color(s) and/or selected texture(s) to a surface of the metal cards. At least one of the decorative layers is a layer derived from plant matter (e.g., wood). The cards may be dual interface smart cards that can be read in a contactless manner and/or via contacts.
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公开(公告)号:US11521035B2
公开(公告)日:2022-12-06
申请号:US16790868
申请日:2020-02-14
Applicant: CompoSecure, LLC
Inventor: John Herslow , Adam J. Lowe
IPC: G06K19/077 , G06K19/07 , B32B13/04 , B32B9/00 , B32B21/14 , B32B37/12 , B32B38/14 , C25D11/24 , B32B7/12 , B32B37/18 , B32B9/04 , B32B15/04 , B32B38/10 , C25D5/02 , C25D11/34 , B32B21/08 , C25D11/26 , B32B27/08 , C25D11/04 , B32B15/14 , B32B27/12 , B32B13/06 , B32B15/08 , C25D11/18 , B32B9/02 , B32B21/00 , B32B33/00 , B32B27/38 , B32B13/12 , B32B38/00 , B32B3/26 , B32B38/06 , B32B3/08 , B32B3/04 , B32B27/30 , B32B21/04 , B32B27/36 , G06K19/02 , B32B3/06 , B32B15/082 , B32B3/30 , B32B18/00 , B32B15/20 , B32B15/10 , B32B17/00 , B32B15/18 , B32B15/09 , B32B27/06 , B32B27/18
Abstract: A process for making a card includes the steps of forming a core layer having a first surface and a second surface, disposing an uncured decorative ceramic layer of ceramic particles disposed in a resin binder over the first surface of the core layer, such as by spray coating, and curing the uncured decorative ceramic layer to form a cured decorative ceramic layer. Card products of the process may have a core layer of metal, ceramic, or a combination thereof that form a bulk of the card.
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公开(公告)号:US10783422B2
公开(公告)日:2020-09-22
申请号:US15521519
申请日:2015-11-03
Applicant: COMPOSECURE, LLC
Inventor: John Herslow , Adam J. Lowe
IPC: G06K19/077 , G06K19/07 , B32B13/04 , B32B9/00 , B32B21/14 , B32B37/12 , B32B38/14 , C25D11/24 , B32B7/12 , B32B37/18 , B32B9/04 , B32B15/04 , B32B38/10 , C25D5/02 , C25D11/34 , B32B21/08 , C25D11/26 , B32B27/08 , C25D11/04 , B32B15/14 , B32B27/12 , B32B13/06 , B32B15/08 , C25D11/18 , B32B9/02 , B32B21/00 , B32B33/00 , B32B27/38 , B32B13/12 , B32B38/00 , C25D7/00 , B32B3/26 , B32B38/06 , B32B3/08 , B32B3/04 , B32B27/30 , B32B21/04 , B32B27/36 , G06K19/02 , B32B3/06 , B32B15/082 , B32B15/20 , B32B15/10 , B32B3/30 , B32B17/00 , B32B15/18 , B32B15/09 , B32B7/08 , B32B27/06 , B32B18/00 , B32B27/18
Abstract: A transaction card includes a monolithic ceramic card body having one or more pockets, and at least one of a magnetic stripe, a barcode, and a laser signature portion. The one or more pockets may be configured to receive at least one of the magnetic stripe, the barcode, a contact chip module, a contactless chip module, a dual interface chip module, a booster antenna, a hologram or commercial indicia. A transaction card may also include a substrate layer having a first side and a second side. A first ceramic layer is connected to the first side of the substrate layer.
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公开(公告)号:US10452967B2
公开(公告)日:2019-10-22
申请号:US15555248
申请日:2015-03-10
Applicant: COMPOSECURE, LLC
Inventor: John Herslow , Adam Lowe , Luis Dasilva
IPC: G06K19/06 , G06K19/077 , B32B7/12 , B32B3/30 , B32B27/30 , B32B27/36 , B32B27/08 , B32B37/12 , B32B38/00 , B32B38/06 , B29C59/02 , B32B15/08 , B32B3/08 , B42D25/41 , B42D25/425 , B42D25/455 , B42D25/46 , B42D25/435 , B42D25/373 , B42D25/328 , B32B15/082 , B32B15/09 , B32B38/14 , B29K667/00 , B29K627/06 , B29L17/00 , B29K27/06 , B29K67/00
Abstract: A multi layered card embodying the invention includes an outer layer of an amorphous laser reactive copolymer material which is embossed with a selected pattern at a selected temperature which is above the glass transition temperature, Tg, of the copolymer and below its melting temperature, Tm. So embossed, the selected pattern is set in the copolymer layer, and its external shape cannot be changed from the embossed form to which it was set at the selected temperature, without destroying the selected pattern. The outer layer may be laminated with the other layers of the card and laser engraved before or after lamination.
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公开(公告)号:US10318859B2
公开(公告)日:2019-06-11
申请号:US15976612
申请日:2018-05-10
Applicant: COMPOSECURE, LLC
Inventor: Adam Lowe , John Herslow , Luis Dasilva , Brian Nester
IPC: H01Q1/22 , G06K19/077 , H01L23/66 , H01Q1/38
Abstract: A card having a metal layer and an opening or cut-out region in the metal layer, with a dual-interface integrated circuit (IC) module disposed in the opening or cut-out region. A ferrite layer is disposed below the metal layer and a booster antenna is attached to the ferrite layer. A vertical hole extends beneath the IC module through the ferrite layer. The booster antenna may be physically connected to the IC module or may be configured to inductively couple to the IC module. In some embodiments, the IC may be disposed in or on a non-conductive plug disposed within the opening or cut-out region, or the vertical hole may have a non-conductive lining, or a connector may be disposed between the booster antenna and the IC module in the vertical hole.
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公开(公告)号:US10289944B2
公开(公告)日:2019-05-14
申请号:US15742813
申请日:2015-07-08
Applicant: CompoSecure, LLC
Inventor: John Herslow , Adam Lowe , Luis Dasilva , Brian Nester
IPC: G06K19/07 , G06K19/077
Abstract: A dual interface smart card having a metal layer includes an SC module, with contacts and RF capability, mounted on a plug, formed of non RF impeding material, between the top and bottom surfaces of the metal layer. The plug provides support for the IC module and a degree of electrical insulation and isolation from the metal layer. The resultant card can have contact and contactless operating capability and an entirely smooth external metal surface except for the contacts of the IC module.
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公开(公告)号:US11301744B2
公开(公告)日:2022-04-12
申请号:US16935948
申请日:2020-07-22
Applicant: CompoSecure, LLC
Inventor: John Herslow , Adam Lowe , Luis Dasilva , Brian Nester
IPC: G06K19/077 , H01L23/66 , H01Q1/38 , H01Q1/22
Abstract: A transaction card comprising a metal layer. A first cut out region in a first surface of said metal layer has a depth less than the thickness of the metal layer, and a first portion of an integrated circuit (IC) module is secured therein. A second cut out region extends from the first cut out region to the second surface of said metal layer and defines a non-RF-impeding volume having a perimeter greater than the perimeter of the first cut out region. One or more additional layers are stacked on the second surface of the metal layer, and a channel extends between one of the stacked layers and the IC module.
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公开(公告)号:US20200184303A1
公开(公告)日:2020-06-11
申请号:US16790868
申请日:2020-02-14
Applicant: CompoSecure, LLC
Inventor: John Herslow , Adam J. Lowe
IPC: G06K19/077 , G06K19/07 , B32B18/00 , B32B27/06 , B32B7/08 , B32B15/09 , B32B27/36 , B32B15/18 , B32B17/00 , B32B3/30 , B32B15/10 , B32B15/20 , B32B15/082 , B32B3/06 , G06K19/02 , B32B21/04 , B32B27/30 , B32B3/04 , B32B9/04 , B32B3/08 , B32B38/06 , B32B3/26 , C25D7/00 , B32B38/00 , B32B13/12 , B32B27/38 , B32B15/04 , B32B9/00 , B32B33/00 , B32B21/00 , B32B9/02 , C25D11/18 , B32B15/08 , B32B13/06 , B32B27/12 , B32B15/14 , C25D11/04 , B32B27/08 , C25D11/26 , B32B21/08 , C25D11/34 , C25D5/02 , B32B38/10 , B32B37/18 , B32B7/12 , C25D11/24 , B32B38/14 , B32B37/12 , B32B21/14 , B32B13/04
Abstract: A process for making a card includes the steps of forming a core layer having a first surface and a second surface, disposing an uncured decorative ceramic layer of ceramic particles disposed in a resin binder over the first surface of the core layer, such as by spray coating, and curing the uncured decorative ceramic layer to form a cured decorative ceramic layer. Card products of the process may have a core layer of metal, ceramic, or a combination thereof that form a bulk of the card.
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公开(公告)号:US20200151535A1
公开(公告)日:2020-05-14
申请号:US16739211
申请日:2020-01-10
Applicant: CompoSecure, LLC
Inventor: John Herslow , Adam Lowe , Luis Dasilva , Brian Nester
IPC: G06K19/077 , G06K19/07
Abstract: A smart card having a metal layer, an opening in the metal layer and a dual interface integrated circuit (IC) module and a plug non-RF-impeding material mounted in the opening, with at least one at least one additional layer stacked relative to the plug.
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公开(公告)号:US20200039280A1
公开(公告)日:2020-02-06
申请号:US16594591
申请日:2019-10-07
Applicant: CompoSecure, LLC
Inventor: John Herslow , Luis J. DaSilva
IPC: B42D25/46 , B32B15/08 , B32B27/08 , B32B27/30 , B32B38/06 , B42D25/425 , B32B27/06 , B32B27/36 , B32B3/30 , B32B27/32 , B42D25/00
Abstract: A card includes a layer of deformable material embossed with a three dimensional (3-D) pattern. A first layer is in direct contact with and overlies the embossed deformable layer. A second layer is in direct contact with and underlies the embossed deformable layer. The first layer is of conformable material and extends within the embossed pattern for filling, setting and maintaining the embossed pattern in a fixed condition. The second layer is of conformable material and conforms to the embossed pattern set in the deformable layer.
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