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公开(公告)号:US11133397B2
公开(公告)日:2021-09-28
申请号:US16430843
申请日:2019-06-04
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Alexander Lee Martin , Jagar Singh
IPC: H01L31/072 , H01L29/66 , H01L29/737 , H01L21/285 , H01L29/417 , H01L21/033 , H01L29/423 , H01L29/16
Abstract: One illustrative method of forming heterojunction bipolar devices includes, among other things, forming a first gate structure above an active semiconductor layer, forming a second gate structure adjacent a first side of the first gate structure, forming a third gate structure adjacent a second side of the first gate structure, forming an emitter of a bipolar transistor in the active semiconductor layer between the first gate structure and the second gate structure, forming a collector of the bipolar transistor in the active semiconductor layer between the first gate structure and the third gate structure, and forming a first base contact contacting the active region adjacent an end of the first gate structure, wherein a portion of the active semiconductor layer positioned under the first gate structure defines a base of the bipolar transistor.
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公开(公告)号:US20210226044A1
公开(公告)日:2021-07-22
申请号:US16745833
申请日:2020-01-17
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Alexander Derrickson , Edmund K. Banghart , Alexander Martin , Ryan Sporer , Jagar Singh , Katherina Babich , George R. Mulfinger
IPC: H01L29/737 , H01L29/08 , H01L29/10 , H01L29/165 , H01L29/66 , H01L21/02 , H01L21/324
Abstract: Structures for a heterojunction bipolar transistor and methods of forming a structure for a heterojunction bipolar transistor. A first portion of a first semiconductor layer defines an emitter, a first portion of a second semiconductor layer defines a collector, and a base includes respective second portions of the first and second semiconductor layers that are laterally positioned between the first portion of the first semiconductor layer and the first portion of the second semiconductor layer. The first portion of the first semiconductor layer has a first thickness, and the first portion of the second semiconductor layer has a second thickness that is greater than the first thickness. The first portion and the second portion of the first semiconductor layer adjoin at a first junction having the first thickness. The first portion and the second portion of the second semiconductor layer adjoin at a second junction having the second thickness.
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