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公开(公告)号：US20110275167A1
公开(公告)日：2011-11-10
申请号：US13090934
申请日：2011-04-20
IPC分类号： H01L21/66
CPC分类号： B24B37/013 , H01L22/12 , H01L22/26
摘要： A method of optically monitoring a substrate during polishing includes receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing, measuring a first spectrum from the substrate during polishing, the first spectrum measured within an initial time following initiation of polishing, measuring a sequence of second spectra from the substrate during polishing, the sequence of second spectra measured after the initial time, for each second spectrum in the sequence of second spectra, removing the first spectrum from the second spectrum to generate a sequence of modified third spectra, determining a value of a characteristic of the selected spectral feature for each third spectrum in the sequence of third spectra to generate a sequence of values for the characteristic, and determining a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.
摘要翻译： 在抛光期间光学监测基底的方法包括接收所选择的光谱特征的标识和所选择的光谱特征的特征以在抛光期间监测，在抛光期间测量来自基底的第一光谱，在初始时间之后测量的第一光谱 开始抛光，在抛光期间测量来自衬底的第二光谱序列，在初始时间之后测量的第二光谱序列，对于第二光谱序列中的每个第二光谱，从第二光谱去除第一光谱以产生序列 修改的第三光谱，确定第三光谱序列中的每个第三光谱的所选光谱特征的特征值，以产生该特征值的序列，并且基于以下步骤确定抛光终点或抛光速率的调整： 值序列。
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公开(公告)号：US08202738B2
公开(公告)日：2012-06-19
申请号：US13090934
申请日：2011-04-20
IPC分类号： H01L21/66
CPC分类号： B24B37/013 , H01L22/12 , H01L22/26
摘要： A method of optically monitoring a substrate during polishing includes receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing, measuring a first spectrum from the substrate during polishing, the first spectrum measured within an initial time following initiation of polishing, measuring a sequence of second spectra from the substrate during polishing, the sequence of second spectra measured after the initial time, for each second spectrum in the sequence of second spectra, removing the first spectrum from the second spectrum to generate a sequence of modified third spectra, determining a value of a characteristic of the selected spectral feature for each third spectrum in the sequence of third spectra to generate a sequence of values for the characteristic, and determining a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.
摘要翻译： 在抛光期间光学监测基底的方法包括接收所选择的光谱特征的标识和所选择的光谱特征的特征以在抛光期间监测，在抛光期间测量来自基底的第一光谱，在初始时间之后测量的第一光谱 开始抛光，在抛光期间测量来自衬底的第二光谱序列，在初始时间之后测量的第二光谱序列，对于第二光谱序列中的每个第二光谱，从第二光谱去除第一光谱以产生序列 修改的第三光谱，确定第三光谱序列中的每个第三光谱的所选光谱特征的特征值，以产生该特征值的序列，并且基于以下步骤确定抛光终点或抛光速率的调整： 值序列。
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63.发明申请TECHNIQUES FOR MATCHING MEASURED SPECTRA TO REFERENCE SPECTRA FOR IN-SITU OPTICAL MONITORING 审中-公开将测量光谱匹配到用于现场光学监测的参考光谱的技术公开(公告)号：US20120034845A1
公开(公告)日：2012-02-09
申请号：US13198635
申请日：2011-08-04
申请人： Xiaoyuan Hu , Zhihong Wang , Harry Q. Lee , Zhize Zhu , Jeffrey Drue David , Dominic J. Benvegnu , Jimin Zhang , Wen-Chiang Tu
发明人： Xiaoyuan Hu , Zhihong Wang , Harry Q. Lee , Zhize Zhu , Jeffrey Drue David , Dominic J. Benvegnu , Jimin Zhang , Wen-Chiang Tu
CPC分类号： B24B37/013 , B24B37/042 , B24B37/107 , B24B37/205 , B24B49/045 , B24B49/12
摘要： A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum using a matching technique other than sum of squared differences to generate a sequence of best matching reference spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of best matching reference spectra. Finding a best matching reference spectrum may include performing a cross-correlation of the measured spectrum with each of two or more of the plurality of reference spectra from the library and selecting a reference spectrum with the greatest correlation to the measured spectrum as a best matching reference spectrum.
摘要翻译： 控制抛光的方法包括：存储具有多个参考光谱的库，抛光衬底，在抛光期间测量来自衬底的光的光谱序列，对于光谱序列的每个测量光谱，使用 除了平方差的和以产生最佳匹配参考光谱的序列之外的匹配技术，以及基于最佳匹配参考光谱的序列来确定抛光终点或抛光速率的调整中的至少一个。 找到最佳匹配的参考光谱可以包括执行所测量的光谱与来自文库的多个参考光谱中的两个或更多个的互相关，并且选择与所测量的光谱具有最大相关性的参考光谱作为最佳匹配参考 光谱。
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公开(公告)号：US20140113524A1
公开(公告)日：2014-04-24
申请号：US13658737
申请日：2012-10-23
申请人： Jun Qian , Sivakumar Dhandapani , Benjamin Cherian , Thomas H. Osterheld , Jeffrey Drue David , Gregory E. Menk , Boguslaw A. Swedek , Doyle E. Bennett
发明人： Jun Qian , Sivakumar Dhandapani , Benjamin Cherian , Thomas H. Osterheld , Jeffrey Drue David , Gregory E. Menk , Boguslaw A. Swedek , Doyle E. Bennett
IPC分类号： B24B37/013 , B24B49/12
CPC分类号： B24B37/013 , B24B49/12
摘要： A method of controlling polishing includes polishing a substrate, monitoring the substrate during polishing with an in-situ spectrographic monitoring system to generate a sequence of measured spectra, selecting less than all of the measured spectra to generate a sequence of selected spectra, generating a sequence of values from the sequence of selected spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.
摘要翻译： 控制抛光的方法包括抛光衬底，用原位光谱监测系统在抛光期间监测衬底以产生测量光谱序列，选择少于所有测量光谱以产生选定光谱序列，产生序列 根据所选光谱的序列的值，并且基于所述值序列来确定抛光终点或抛光速率的调整中的至少一个。
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公开(公告)号：US07153185B1
公开(公告)日：2006-12-26
申请号：US10921485
申请日：2004-08-18
CPC分类号： B24B37/005 , B24B49/105 , B24B49/12
摘要： A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. The eddy current monitoring system or the optical monitoring system can be used to determine the substrate edge. A focusing optic can be used to improve the accuracy of the optical monitoring system in detecting the edge of the substrate.
摘要翻译： 化学机械抛光装置和方法可以使用涡流监测系统和光学监测系统。 来自监控系统的信号可以组合在输出线上并由计算机提取。 涡流监测系统或光学监测系统可用于确定衬底边缘。 可以使用聚焦光学器件来提高光学监测系统在检测衬底的边缘方面的精度。
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公开(公告)号：US07097537B1
公开(公告)日：2006-08-29
申请号：US10922110
申请日：2004-08-18
IPC分类号： B49D1/00
CPC分类号： B24B37/013 , B24B49/105
摘要： A chemical mechanical polishing apparatus and method can use an in-situ monitoring system. A measurement of a position of a carrier head and a sinusoidal first function can be used to define a second function that associates measurements from the series with positions on the substrate. For each measurement in a series from the in-situ monitoring system, the second function can be used to determine a position on the substrate where the measurement was taken. In addition, a measurement of the position of the carrier head, a time when the measurement of the substrate property is made, and a phase correction representing lag resulting from a processing delay in generating the measurement of the position of the carrier head can be used in determining a position on the substrate where a measurement of a substrate property was taken.
摘要翻译： 化学机械抛光装置和方法可以使用原位监测系统。 可以使用载波头位置和正弦第一函数的测量来定义将来自串联的测量与基板上的位置相关联的第二函数。 对于来自原位监测系统的一系列中的每个测量，第二功能可用于确定在测量被测量的基板上的位置。 此外，可以使用载波头的位置的测量，进行基板特性的测量的时间，以及表示在产生载波头的位置的测量的处理延迟时产生的延迟的相位校正 在确定基板特性的测量时在基板上的位置。
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公开(公告)号：US09221147B2
公开(公告)日：2015-12-29
申请号：US13658737
申请日：2012-10-23
申请人： Jun Qian , Sivakumar Dhandapani , Benjamin Cherian , Thomas H. Osterheld , Jeffrey Drue David , Gregory E. Menk , Boguslaw A. Swedek , Doyle E. Bennett
发明人： Jun Qian , Sivakumar Dhandapani , Benjamin Cherian , Thomas H. Osterheld , Jeffrey Drue David , Gregory E. Menk , Boguslaw A. Swedek , Doyle E. Bennett
IPC分类号： G06F19/00 , B24B37/013 , B24B49/12
CPC分类号： B24B37/013 , B24B49/12
摘要： A method of controlling polishing includes polishing a substrate, monitoring the substrate during polishing with an in-situ spectrographic monitoring system to generate a sequence of measured spectra, selecting less than all of the measured spectra to generate a sequence of selected spectra, generating a sequence of values from the sequence of selected spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.
摘要翻译： 控制抛光的方法包括抛光衬底，用原位光谱监测系统在抛光期间监测衬底以产生测量光谱序列，选择少于所有测量光谱以产生选定光谱序列，产生序列 根据所选光谱的序列的值，并且基于所述值序列来确定抛光终点或抛光速率的调整中的至少一个。
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68.发明授权公开(公告)号：US06991516B1
公开(公告)日：2006-01-31
申请号：US10920726
申请日：2004-08-17
申请人： Jeffrey Drue David , Dirk De Roover , Jimin Zhang , Boguslaw A. Swedek , Doyle E. Bennett , Manoocher Birang
发明人： Jeffrey Drue David , Dirk De Roover , Jimin Zhang , Boguslaw A. Swedek , Doyle E. Bennett , Manoocher Birang
CPC分类号： B24B49/105 , B24B37/04 , B24B49/12
摘要： A plurality of portions of a substrate are monitored during polishing at a first polishing station with an in-situ monitoring system. A plurality of thicknesses are determined based on measurements by the in-situ monitoring system, and the plurality of pressures to apply to the plurality of regions of the substrate are calculated in a closed-loop control system. However, if a representative thickness of the layer is less than a threshold thickness, calculation of the plurality of pressures by the closed-loop control system is halted and a plurality of predetermined pressures are applied to the plurality of regions of the substrate.
摘要翻译： 在具有原位监测系统的第一抛光站的抛光期间，监测基板的多个部分。 基于通过原位监测系统的测量确定多个厚度，并且在闭环控制系统中计算应用于衬底的多个区域的多个压力。 然而，如果层的代表性厚度小于阈值厚度，则闭环控制系统的多个压力的计算被停止，并且多个预定压力施加到基板的多个区域。
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公开(公告)号：US06945845B2
公开(公告)日：2005-09-20
申请号：US10643773
申请日：2003-08-18
CPC分类号： B24B37/013 , B24B37/04 , B24B49/105
摘要： Conductive elements of a chemical mechanical polishing system may generate undesired eddy currents under the influence of a time-dependent magnetic field used in an eddy current monitoring system. To improve the accuracy of an eddy current monitoring system, elements that may contribute an undesired signal to the sensed eddy current signal may be fabricated from a non-conductive material such as plastic or ceramic. In some implementations, elements may be fabricated from non-magnetic materials.
摘要翻译： 化学机械抛光系统的导电元件可能在涡流监测系统中使用的时间依赖磁场的影响下产生不期望的涡流。 为了提高涡流监测系统的精度，可能会对非传导性材料（如塑料或陶瓷）制造可能对感测到的涡流信号造成不必要信号的元件。 在一些实施方案中，元件可以由非磁性材料制成。
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公开(公告)号：US07074109B1
公开(公告)日：2006-07-11
申请号：US10920701
申请日：2004-08-17
IPC分类号： B24B49/00
CPC分类号： H01L21/3212 , B24B37/013 , B24B49/00 , H01L22/26
摘要： A system, method, and computer program product for chemical mechanical polishing a substrate in which initially a plurality of predetermined pressures are applied to a plurality of regions of the substrate. A plurality of portions of the substrate are monitored during polishing with an in-situ monitoring system. If the difference in thickness between two portions of the substrate exceeds a predetermined threshold, a plurality of adjusted pressures are calculated in a closed-loop control system, and the plurality of adjusted pressures are applied to the plurality of regions of the substrate. The predetermined threshold includes an initial threshold for the start of the polishing process and a second threshold for a period of polishing after the start of the polishing process.
摘要翻译： 一种用于化学机械抛光衬底的系统，方法和计算机程序产品，其中最初将多个预定压力施加到衬底的多个区域。 在用原位监测系统进行抛光时监测基板的多个部分。 如果基板的两个部分之间的厚度差超过预定阈值，则在闭环控制系统中计算多个调节压力，并且将多个调节压力施加到基板的多个区域。 预定阈值包括用于开始抛光处理的初始阈值和在抛光过程开始之后的抛光周期的第二阈值。
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