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    Dual-chamber fluid pump for a multi-fluid electronics cooling system and method
    62.
    发明授权
    Dual-chamber fluid pump for a multi-fluid electronics cooling system and method 有权
    双腔流体泵用于多流体电子冷却系统和方法

    公开(公告)号：US07841385B2

    公开(公告)日：2010-11-30

    申请号：US11426431

    申请日：2006-06-26

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： F28F7/00 ,  F04F1/18

    CPC分类号： H05K7/20218

    摘要： A dual-chamber fluid pump is provided for a multi-fluid electronics cooling system and method. The pump has a first fluid path for pumping a first fluid coolant and a second fluid path for pumping a second fluid coolant, with the first fluid path including a first pumping chamber and the second fluid path including a second pumping chamber. The first and second pumping chambers are separated by at least one diaphragm, and an actuator is coupled to the diaphragm for transitioning the diaphragm between a first position and a second position. Transitioning of the diaphragm to the first position pumps first fluid coolant from the first pumping chamber while concurrently drawing second fluid coolant into the second pumping chamber, and transitioning of the diaphragm to the second position pumps second fluid coolant from the second pumping chamber while concurrently drawing first fluid coolant into the first pumping chamber.

    摘要翻译： 为多流体电子冷却系统和方法提供双室流体泵。 泵具有用于泵送第一流体冷却剂的第一流体路径和用于泵送第二流体冷却剂的第二流体路径，其中第一流体路径包括第一泵送室，第二流体路径包括第二泵送室。 第一和第二泵送室由至少一个隔膜隔开，并且致动器联接到隔膜，用于在第一位置和第二位置之间转换隔膜。 将隔膜转换到第一位置将第一流体冷却剂从第一泵送室抽出，同时将第二流体冷却剂拉入第二泵送室，并且将膜片转移到第二位置，从第二泵送室泵送第二流体冷却剂，同时拉伸 第一流体冷却剂进入第一泵送室。

    Cooling apparatuses with discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled
    63.
    发明授权
    Cooling apparatuses with discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled 有权
    冷却装置具有分离的冷板，其顺应地耦合在待冷却的组件的公共歧管和电子部件之间

    公开(公告)号：US07830664B2

    公开(公告)日：2010-11-09

    申请号：US12137775

    申请日：2008-06-12

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

    CPC分类号： G06F1/20 ,  G06F2200/201 ,  H05K7/2079

    摘要： Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at least one coolant carrying channel disposed therebetween; and a manifold for distributing coolant to and exhausting coolant from the cold plates. The cooling apparatus also includes multiple flexible hoses connecting the coolant inlets of the cold plates to the manifold, as well as the coolant outlets to the manifold, with each hose segment being disposed between a respective cold plate and the manifold. A biasing mechanism biases the cold plates away from the manifold and towards the electronics components, and at least one fastener secures the manifold to the support structure, compressing the biasing mechanism, and thereby forcing the parallel coupled cold plates towards their respective electronics components to ensure good thermal interface.

    摘要翻译： 提供冷却装置和方法用于冷却包括支撑多个电子部件的平面支撑结构的组件。 冷却装置包括：多个分立的冷板，每个分别具有冷却剂入口，冷却剂出口和设置在其间的至少一个冷却剂承载通道; 以及用于将冷却剂分配到冷板并从冷板排出冷却剂的歧管。 冷却装置还包括将冷板的冷却剂入口连接到歧管的多个柔性软管以及到歧管的冷却剂出口，每个软管段设置在相应的冷板和歧管之间。 偏置机构将冷板偏离歧管并朝向电子部件，并且至少一个紧固件将歧管固定到支撑结构，压缩偏置机构，从而迫使并联的冷板朝向它们各自的电子部件以确保 良好的热界面。

    Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways
    64.
    发明授权
    Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways 有权
    冷却装置，冷却电子模块和使用具有交错冷却剂入口和出口通道的歧管结构的制造方法

    公开(公告)号：US07762314B2

    公开(公告)日：2010-07-27

    申请号：US11739160

    申请日：2007-04-24

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： F28F7/00 ,  H05K7/20

    CPC分类号： F28F3/12 ,  F28F3/02 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from an electronic device. The cooling apparatus includes a manifold structure having a plurality of inlet and outlet passageways for injecting coolant onto, and exhausting coolant after impinging on, a surface to be cooled. The coolant inlet and outlet passageways are interleaved in the manifold structure, and coolant is injected and exhausted through a common edge of the manifold. The manifold structure further includes coolant inlet and outlet plenums, with coolant passing through the inlet passageways from the inlet plenum in a first direction and coolant passing through the outlet passageways to the outlet plenum in a second direction, the first and second directions being perpendicular to the surface to be cooled and being opposite directions, and wherein the manifold structure is contained within a rectangular volume defined by a projection of the common edge.

    摘要翻译： 提供冷却装置和制造方法以便于从电子设备移除热量。 冷却装置包括具有多个入口和出口通道的歧管结构，该入口和出口通道用于将冷却剂喷射到待冷却的表面上并且在撞击待冷却表面之后排出冷却剂。 冷却剂入口和出口通道在歧管结构中交错，并且冷却剂通过歧管的公共边缘被注入和排出。 歧管结构还包括冷却剂入口和出口增压室，其中冷却剂沿着第一方向从入口通风室通过入口通道，并且冷却剂在第二方向上通过出口通道到出口增压室，第一和第二方向垂直于 待冷却的表面并且是相反的方向，并且其中歧管结构包含在由公共边缘的突出部限定的矩形体积内。

    Coolant control unit and cooled electronics system employing the same
    65.
    发明授权
    Coolant control unit and cooled electronics system employing the same 有权
    冷却液控制单元和采用其的冷却电子系统

    公开(公告)号：US07609519B2

    公开(公告)日：2009-10-27

    申请号：US12053863

    申请日：2008-03-24

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K7/20 ,  F25B21/02

    CPC分类号： H05K7/2079

    摘要： A coolant control unit for a liquid cooled electronics system is provided, which includes an external coolant inlet and outlet for receiving and returning external coolant; an internal coolant loop for circulating coolant to the electronics system; a first and second control valve coupling the external coolant inlet and outlet to the internal coolant loop; a heat exchanger connected between the first and second control valves; and control logic for controlling operation of the coolant control unit in one of an external coolant mode and an internal coolant mode. In the external coolant mode, the first and second control valves allow passage of external coolant through the internal coolant loop to the electronics system, and in the internal coolant mode, the first and second control valves isolate coolant within the internal coolant loop from the external coolant inlet and outlet, and pass the coolant therein through the heat exchanger.

    摘要翻译： 提供了一种用于液冷电子系统的冷却剂控制单元，其包括用于接收和返回外部冷却剂的外部冷却剂入口和出口; 用于将冷却剂循环到电子系统的内部冷却剂回路; 将外部冷却剂入口和出口连接到内部冷却剂回路的第一和第二控制阀; 连接在第一和第二控制阀之间的热交换器; 以及用于控制冷却剂控制单元在外部冷却剂模式和内部冷却剂模式之一中的操作的控制逻辑。 在外部冷却剂模式中，第一和第二控制阀允许外部冷却剂通过内部冷却剂回路到电子系统，并且在内部冷却剂模式中，第一和第二控制阀将内部冷却剂回路内的冷却剂与外部 冷却剂入口和出口，并使冷却剂通过热交换器。

    COOLING APPARTUSES WITH DISCRETE COLD PLATES COMPLIANTLY COUPLED BETWEEN A COMMON MANIFOLD AND ELECTRONICS COMPONENTS OF AN ASSEMBLY TO BE COOLED
    66.
    发明申请
    COOLING APPARTUSES WITH DISCRETE COLD PLATES COMPLIANTLY COUPLED BETWEEN A COMMON MANIFOLD AND ELECTRONICS COMPONENTS OF AN ASSEMBLY TO BE COOLED 有权
    冷却配件与散装冷却板的冷却配件在通用冷却器和要组装的组件的电子部件之间紧密耦合

    公开(公告)号：US20080245506A1

    公开(公告)日：2008-10-09

    申请号：US12137775

    申请日：2008-06-12

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： F28F7/00

    CPC分类号： G06F1/20 ,  G06F2200/201 ,  H05K7/2079

    摘要： Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at least one coolant carrying channel disposed therebetween; and a manifold for distributing coolant to and exhausting coolant from the cold plates. The cooling apparatus also includes multiple flexible hoses connecting the coolant inlets of the cold plates to the manifold, as well as the coolant outlets to the manifold, with each hose segment being disposed between a respective cold plate and the manifold. A biasing mechanism biases the cold plates away from the manifold and towards the electronics components, and at least one fastener secures the manifold to the support structure, compressing the biasing mechanism, and thereby forcing the parallel coupled cold plates towards their respective electronics components to ensure good thermal interface.

    摘要翻译： 提供冷却装置和方法用于冷却包括支撑多个电子部件的平面支撑结构的组件。 冷却装置包括：多个分立的冷板，每个分别具有冷却剂入口，冷却剂出口和设置在其间的至少一个冷却剂承载通道; 以及用于将冷却剂分配到冷板并从冷板排出冷却剂的歧管。 冷却装置还包括将冷板的冷却剂入口连接到歧管的多个柔性软管以及到歧管的冷却剂出口，每个软管段设置在相应的冷板和歧管之间。 偏置机构将冷板偏离歧管并朝向电子部件，并且至少一个紧固件将歧管固定到支撑结构，压缩偏置机构，从而迫使并联的冷板朝向它们各自的电子部件以确保 良好的热界面。

    Hybrid cooling system and method for a multi-component electronics system
    67.
    发明授权
    Hybrid cooling system and method for a multi-component electronics system 有权
    用于多组件电子系统的混合冷却系统和方法

    公开(公告)号：US07400505B2

    公开(公告)日：2008-07-15

    申请号：US11539902

    申请日：2006-10-10

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20736 ,  F28F1/20 ,  F28F1/22 ,  H05K7/20009 ,  H05K7/20554 ,  H05K7/20772

    摘要： A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least one primary and at least one secondary heat generating component to be cooled; and a liquid-based cooling subsystem including at least one cold plate, physically coupled to the at least one primary heat generating component, and a thermally conductive coolant-carrying tube in fluid communication with the at least one cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and includes a plurality of thermally conductive fins extending from a surface thereof. The plurality of thermally conductive fins are disposed at least partially over the at least one secondary heat generating component to be cooled, and provide supplemental cooling of at least a portion of the air flow established across the multiple components of the electronics system.

    摘要翻译： 为多组件电子系统提供混合冷却系统和制造方法。 该冷却系统包括用于建立穿过要被冷却的至少一个主要和至少一个次要发热部件的空气流的空气移动装置; 以及液体冷却子系统，其包括物理耦合到所述至少一个主发热部件的至少一个冷板和与所述至少一个冷板流体连通的导热冷却剂供给管。 导热辅助结构联接到冷却剂承载管并且包括从其表面延伸的多个导热翅片。 多个导热翅片至少部分地设置在待冷却的至少一个二次发热组件上，并且为跨越电子系统的多个部件建立的空气流的至少一部分提供补充冷却。

    Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing
    68.
    发明授权
    Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing 有权
    隔离阀和冷却剂连接/断开组件和用于连接液冷电子子系统和电子设备外壳的制造方法

    公开(公告)号：US07380409B2

    公开(公告)日：2008-06-03

    申请号：US10954792

    申请日：2004-09-30

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Donald W. Porter ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Donald W. Porter ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： F25D23/12 ,  F28D15/00 ,  H05K7/20 ,  F16K31/44

    CPC分类号： H05K7/20772

    摘要： An isolation valve assembly, a coolant connect/disconnect assembly, a cooled multi-blade electronics center, and methods of fabrication thereof are provided employing an isolation valve and actuation mechanism. The isolation valve is disposed within at least one of a coolant supply or return line providing liquid coolant to the electronics subsystem. The actuation member is coupled to the isolation valve to automatically translate a linear motion, resulting from insertion of the electronics subsystem into the operational position within the electronics housing, into a rotational motion to open the isolation valve and allow coolant to pass. The actuation mechanism, which operates to automatically close the isolation valve when the liquid cooled electronics subsystem is withdrawn from the operational position, can be employed in combination with a compression valve coupling, with one fitting of the compression valve coupling being disposed serially in fluid communication with the isolation valve.

    摘要翻译： 使用隔离阀和致动机构来提供隔离阀组件，冷却剂连接/断开组件，冷却的多叶片电子设备中心及其制造方法。 隔离阀设置在向电子子系统提供液体冷却剂的冷却剂供应或返回管线中的至少一个中。 致动构件联接到隔离阀以自动地将由电子系统子系统插入电子设备外壳内的操作位置而产生的直线运动转换成旋转运动，以打开隔离阀并允许冷却剂通过。 当液体冷却的电子子系统从操作位置退出时，操作以自动关闭隔离阀的致动机构可以与压缩阀联接一起使用，压缩阀联接器的一个配件串联设置为流体连通 与隔离阀。

    METHOD OF ASSEMBLING A COOLING SYSTEM FOR A MULTI-COMPONENT ELECTRONICS SYSTEM
    69.
    发明申请
    METHOD OF ASSEMBLING A COOLING SYSTEM FOR A MULTI-COMPONENT ELECTRONICS SYSTEM 失效
    用于组装多分量电子系统的冷却系统的方法

    公开(公告)号：US20080092387A1

    公开(公告)日：2008-04-24

    申请号：US11539907

    申请日：2006-10-10

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： B21D53/02 ,  B23P15/26

    CPC分类号： H05K7/20772 ,  H05K7/20009 ,  Y10T29/4935 ,  Y10T29/49359 ,  Y10T29/49895

    摘要： A cooling system assembly method including: providing a support fixture having a multi-level support surface and multiple positioning dowels extending therefrom; positioning multiple liquid-cooled cold plates on the support surface employing the multiple dowels, the dowels providing relative positioning and alignment of the cold plates for facilitating subsequent coupling thereof to electronic components to be cooled; sealing multiple coolant-carrying tubes in fluid communication with the cold plates; and sealing a header subassembly to the coolant-carrying tubes to provide an assembled liquid-based cooling system. In operation, the support fixture facilitates shipping of the assembled cooling system by maintaining the components in fixed relation. A transfer fixture is employed in removing the cooling system from the support fixture and placing the cooling system in engagement with the electronics system. The transfer fixture includes multiple clips engaging and holding components of cooling system in fixed relation when removed from the support fixture.

    摘要翻译： 一种冷却系统组装方法，包括：提供具有多级支撑表面的支撑夹具和从其延伸的多个定位销; 使用多个销钉将多个液冷冷板定位在支撑表面上，该销钉提供冷板的相对定位和对准，以便于其随后与要冷却的电子部件的耦合; 密封与冷板流体连通的多个冷却剂供给管; 并将集管组件密封到冷却剂供给管以提供组装的基于液体的冷却系统。 在操作中，支撑夹具有助于通过将部件保持固定关系来运输组装的冷却系统。 使用转移夹具来从支撑固定装置移除冷却系统并将冷却系统放置在与电子系统接合的位置。 转移夹具包括多个夹具，当从支撑固定装置移除时，将固定关系的冷却系统的部件接合并保持。