公开(公告)号：US11656665B2

公开(公告)日：2023-05-23

申请号：US17357589

申请日：2021-06-24

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: G06F1/20 ,  G05B15/02 ,  H05K7/20

CPC classification number: G06F1/206 ,  G05B15/02 ,  H05K7/20836

Abstract: Systems and methods for operating a datacenter are disclosed. In at least one embodiment, hybrid cooling unit is disclosed wherein an evaporative cooler is to provide a source of cooled air and a liquid heat exchanger is to provide a source of cooled liquid for cooling one or more electronic components, the hybrid cooling unit further including an air inlet to direct a flow of external air to remove heat from the evaporative cooler and the liquid heat exchanger.

公开(公告)号：US20220361380A1

公开(公告)日：2022-11-10

申请号：US17314184

申请日：2021-05-07

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  G06F1/20

Abstract: Systems and methods for evaluating cooling characteristics are disclosed. In at least one embodiment, a thermal testing rig for a data center can include one or more pluggable heat-generating elements to direct a heat flux in an upward direction towards one or more thermal distribution elements.

公开(公告)号：US20220354017A1

公开(公告)日：2022-11-03

申请号：US17246330

申请日：2021-04-30

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

Abstract: Systems and methods for cooling a mobile datacenter are disclosed. In at least one embodiment, a cooling loop is located on a mobile unit and includes at least one cold plate within a pod on a mobile unit and includes a dry cooler external to a pod on a mobile unit so as to enable coolant to be provided to a cold plate and to enable such coolant to be provided to a dry cooler for removal of heat from at least one computing device to an ambient environment.

公开(公告)号：US20220346285A1

公开(公告)日：2022-10-27

申请号：US17238384

申请日：2021-04-23

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  G05B13/02

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a control unit within a rack has a pump or compressor unit to cause two-phase fluid to circulate through a cold plate associated with a computing device and to circulate through a heat exchanger associated with a rear door of a rack, so as to dissipate heat from a computing device through a heat exchanger by a control unit within a rack.

公开(公告)号：US20220338377A1

公开(公告)日：2022-10-20

申请号：US17224814

申请日：2021-04-07

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  G05B15/02

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a cold plate includes an evaporator to remove heat from at least one computing device using a two-phase fluid and using a buffer to perform flow stabilization represented by different volumes or different flow rates of a two-phase fluid that is enabled to flow between an evaporator and a condensing or compressor unit located external to a cold plate.

公开(公告)号：US20220338368A1

公开(公告)日：2022-10-20

申请号：US17235051

申请日：2021-04-20

Applicant: Nvidia Corporation

Inventor： Jeremy Rodriguez ,  Ali Heydari

IPC: H05K7/20 ,  G06N3/08

Abstract: Configurations for exhaust baffles are disclosed. In at least one embodiment, one or more baffles direct an outlet air flow from a heat exchanger.

公开(公告)号：US20220174846A1

公开(公告)日：2022-06-02

申请号：US17107128

申请日：2020-11-30

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an alternate cooling loop with its own fluid source and a liquid-to-air heat exchanger is used to provide cooling for the at least one computing component alternatively from a secondary cooling loop that is associated with a primary cooling loop and a chilling facility.

公开(公告)号：US20220151114A1

公开(公告)日：2022-05-12

申请号：US17095649

申请日：2020-11-11

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, at least one rigid manifold having flow controllers to extend out of a platform and out from at least one row manifold so that push coupling is enabled with one or more mating couplers of at least one rack manifold of a rack that is positioned in a designated position on the platform.

公开(公告)号：US20220142007A1

公开(公告)日：2022-05-05

申请号：US17083554

申请日：2020-10-29

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a thermal buffer is provided to collect coolant from a plurality of coolant distribution units (CDUs), to enable thermal stability for the coolant within the thermal buffer, and to facilitate a cooling loop with one or more cooling manifolds associated with at least one computing device.

公开(公告)号：US20220104403A1

公开(公告)日：2022-03-31

申请号：US17032541

申请日：2020-09-25

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an absorption chiller includes a generator vessel to enable removal of heat from fluid returned from at least one computing component of the datacenter.