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61.发明授权公开(公告)号：US11183624B2
公开(公告)日：2021-11-23
申请号：US16214607
申请日：2018-12-10
发明人： Ercan Mehmet Dede
摘要： Electronic assemblies for thermoelectric generation are disclosed. In one embodiment, an electronic assembly includes a substrate having a first surface and a second surface, and a conductive plane and a plurality of thermal guide traces position on the first surface of the substrate. The conductive plane includes a plurality of arms radially extending from a central region. The plurality of thermal guide traces surrounds the conductive plane, and is shaped and positioned to guide heat flux present on or within the substrate toward the central region of the conductive plane. The electronic assembly may also include a thermoelectric generator device thermally coupled to the central region of the conductive plane, and a plurality of heat generating devices coupled to the second surface of the substrate.
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公开(公告)号：US11149937B2
公开(公告)日：2021-10-19
申请号：US16777403
申请日：2020-01-30
发明人： Yuqing Zhou , Ercan Mehmet Dede
IPC分类号： F21V29/75 , H01L23/467 , H01L23/473 , H01L23/427
摘要： Embodiments disclosed herein describe a manifold microchannel heat sink having a target surface, a microchannel structure and an insert disposed over the microchannel structure. The microchannel structure includes a plurality of fins extending in a normal direction from the target surface and defining a plurality of microchannels. The individual fins are shaped as rectangular plates and the individual microchannels comprise gaps between the individual fins. The plurality of fins are distributed on the target surface such that at least a thickness of the individual fins or a width of the gaps comprising the individual microchannels is varied along a plane of the target surface. The insert disposed over the microchannel structure has a plurality of inlet dividers and a plurality of outlet dividers. The individual inlet dividers define an inlet channel and the individual outlet dividers define an outlet channel.
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公开(公告)号：US20210236061A1
公开(公告)日：2021-08-05
申请号：US16778844
申请日：2020-01-31
摘要： An extendable biosensing device comprising a robotic structure. The robotic structure comprises a pliable exterior lining and an extendable core. The robotic structure comprises at least one sensor located on or within the pliable exterior lining. The sensor is configured to measure a physiological condition. The extendable core automatically extends from a retracted state to a deployed state in response to a triggering event.
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公开(公告)号：US20210149489A1
公开(公告)日：2021-05-20
申请号：US16683547
申请日：2019-11-14
摘要： A touchpad for use in an infotainment system and a method of use is provided. The touchpad comprises a bottom layer comprising processing circuitry configured to control operation of a plurality of tactile pixels. The tactile pixels are disposed in a tactile pixel layer on top of the bottom layer. Each tactile pixel comprises a top plate having a plurality of vertices and a support strut coupled to each vertex, each strut comprising a liquid crystal elastomer (LCE) hinge disposed between a first rigid portion and a second rigid portion.
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公开(公告)号：US20210097378A1
公开(公告)日：2021-04-01
申请号：US16589603
申请日：2019-10-01
发明人： Sean P. Rodrigues , Paul Donald Schmalenberg , Hideo Iizuka , Jae Seung Lee , Ercan Mehmet Dede
摘要： Embodiments described herein relate to an adaptable photonic apparatus including an optical neural network. The photonic apparatus includes an optical input that provides an optical signal. The photonic apparatus also includes a chassis component and an optical neural network (ONN). The chassis component includes at least one modular mounting location for receiving a modular network component. The ONN is operably connected with the optical input and is configured to perform optical processing on the optical signal according to a deep learning algorithm. The ONN includes optical components arranged into layers to form the ONN. The modular network component is an additional optical processing component that is configured to function in cooperation with the ONN to adapt the deep learning algorithm.
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公开(公告)号：US20200294883A1
公开(公告)日：2020-09-17
申请号：US16353201
申请日：2019-03-14
发明人： Ercan Mehmet Dede
IPC分类号： H01L23/373 , H01L23/31 , H01L23/29 , H01L23/60 , H01L23/532 , H01L27/02
摘要： A power electronics assembly is provided with a self-healing feature. The power electronics assembly may include a semiconductor electronics device and an insulating substrate coupled to the semiconductor electronics device. A base metal structural component may be provided, coupled to the insulating substrate. The assembly may include a frame component cooperating with the base metal structural component and defining an enclosure containing the semiconductor electronics device and the insulating substrate. The assembly further includes a self-healing polymer comprising disulfide bonds. The self-healing polymer is disposed within the enclosure; additional potting material may also be provided as a multi-layered encapsulation. In various aspects, the self-healing polymer may include polydimethylsiloxane based polyurethane (PDMS-PU) modified with disulfide bonds. The frame component may be configured to direct or confine heat to areas of the assembly where ESD may be problematic.
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67.发明授权公开(公告)号：US10556481B2
公开(公告)日：2020-02-11
申请号：US15633123
申请日：2017-06-26
发明人： Feng Zhou , Tianzhu Fan , Shailesh N. Joshi , Ercan Mehmet Dede
IPC分类号： B60H1/00
摘要： Systems and methods for providing heating and cooling to a cabin of an autonomous or semiautonomous electric vehicle. A system includes one or more autonomous or semiautonomous electric vehicle components generating thermal energy as a byproduct of operation, a radiator fluidly coupled to the one or more vehicle components and positioned downstream from the one or more vehicle components such that the radiator receives at least a portion of the thermal energy, a thermoelectric cooler thermally coupled to and located downstream from the radiator, and one or more bypass valves that control fluid flow from the radiator such that fluid flows directly to a cabin of the vehicle or flows through the thermoelectric cooler before flowing into the cabin.
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公开(公告)号：US10453777B2
公开(公告)日：2019-10-22
申请号：US15883897
申请日：2018-01-30
IPC分类号： H01L23/00 , H01L23/473 , H01L23/373 , H01L23/48 , B81C3/00 , H01L21/50 , F28F13/00 , B81B7/00 , B81C1/00 , H01L23/522 , H01L23/22 , H01L23/34 , H01L23/46
摘要： A 2-in-1 power electronics assembly includes a frame with a lower dielectric layer, an upper dielectric layer spaced apart from the lower dielectric layer, and a sidewall disposed between and coupled to the lower dielectric layer and the upper dielectric layer. The lower dielectric layer includes a lower cooling fluid inlet and the upper dielectric layer includes an upper cooling fluid outlet. A first semiconductor device assembly and a second semiconductor device assembly are included and disposed within the frame. The first semiconductor device is disposed between a first lower metal inverse opal (MIO) layer and a first upper MIO layer, and the second semiconductor device is disposed between a second lower MIO layer and a second upper MIO layer. An internal cooling structure that includes the MIO layers provides double sided cooling for the first semiconductor device and the second semiconductor device.
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69.发明授权公开(公告)号：US10385469B2
公开(公告)日：2019-08-20
申请号：US15700723
申请日：2017-09-11
摘要： A thermal stress compensation layer includes a metal inverse opal (MIO) layer with a plurality of hollow spheres and a predefined porosity disposed between a pair of bonding layers. The thermal stress compensation layer has a melting point above a TLP sintering temperature and the pair of bonding layers each have a melting point below the TLP sintering temperature such that the MIO layer can be transient liquid phase bonded between a metal substrate and a semiconductor device. The pair of bonding layers may comprise a first pair of bonding layers and a second pair of bonding layers with the first pair of bonding layers disposed between the MIO layer and the second pair of bonding layers. The first pair of bonding layers may have a melting point above the TLP sintering temperature and the second pair of bonding layers may have a melting point below the TLP sintering temperature.
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公开(公告)号：US20190237425A1
公开(公告)日：2019-08-01
申请号：US15882216
申请日：2018-01-29
IPC分类号： H01L23/00 , H01L23/46 , H01L23/488
CPC分类号： H01L24/32 , H01L23/46 , H01L23/488 , H01L23/564 , H01L24/83 , H01L2924/35121
摘要： A power electronics assembly includes a substrate, a semiconductor device and a metal inverse opal (MIO) bonding layer positioned between and bonded to the substrate and the semiconductor device. A first electrode is disposed on a first surface, a second electrode is disposed on a second surface, and a third electrode is disposed on a third surface. The first surface may be a top surface of the semiconductor device, the second surface may be a bottom surface of the semiconductor device, the third surface may be spaced apart from the bottom surface of the semiconductor device, and the second electrode is in electrical communication with the third electrode through the MIO bonding layer. A cooling fluid circuit with a cooling fluid inlet, a cooling fluid outlet and a cooling fluid path through the MIO bonding layer may be included.
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