公开(公告)号：US20220011507A1

公开(公告)日：2022-01-13

申请号：US17373576

申请日：2021-07-12

申请人： Acacia Communications, Inc.

发明人： Li Chen ,  Long Chen ,  Christopher Doerr

IPC分类号： G02B6/122 ,  G02B6/136

摘要： In part, in one aspect, the disclosure relates to a method for passivating a waveguide of an optical circuit. The method includes etching a suspended waveguide in the optical circuit; the suspended waveguide having a top surface, a bottom surface, and side surfaces; and covering the top surface and side surfaces of the suspended waveguide with a passivation coating having a thickness that ranges from between about 10 nm to about 20 nm. In one embodiment, the method further includes removing one or more coatings from a portion of the optical circuit. The disclosure also relates to various passivated optical silicon circuit embodiments.

公开(公告)号：US20210325306A1

公开(公告)日：2021-10-21

申请号：US17113243

申请日：2020-12-07

申请人： Pacific Biosciences of California, Inc.

发明人： Annette GROT ,  Ravi SAXENA ,  Paul LUNDQUIST

IPC分类号： G01N21/64 ,  G01N21/78 ,  G02B27/42 ,  G01N21/77 ,  G02B6/132 ,  G02B6/136 ,  H01L27/146

摘要： Arrays of integrated analytical devices and their methods for production are provided. The arrays are useful in the analysis of highly multiplexed optical reactions in large numbers at high densities, including biochemical reactions, such as nucleic acid sequencing reactions. The devices allow the highly sensitive discrimination of optical signals using features such as spectra, amplitude, and time resolution, or combinations thereof. The devices include an integrated diffractive beam shaping element that provides for the spatial separation of light emitted from the optical reactions.

公开(公告)号：US20210318561A1

公开(公告)日：2021-10-14

申请号：US17358256

申请日：2021-06-25

申请人： Intel Corporation

发明人： Meer Nazmus Sakib ,  Saeed Fathololoumi ,  Harel Frish ,  John Heck ,  Eddie Bononcini ,  Reece Defrees ,  Stanley J. Dobek ,  Aliasghar Eftekhar ,  Walter Garay ,  Lingtao Liu ,  Wei Qian

IPC分类号： G02F1/01 ,  G02B6/136 ,  G02B6/132

摘要： A method may include: forming a base layer on a substrate; forming a waveguide assembly on the base layer, where the waveguide assembly is surrounded by a cladding layer; forming a trench opening through the cladding layer and the base layer; forming an undercut void by etching the substrate through the trench opening, where the undercut void extends under the waveguide assembly and the base layer; and filling the trench opening with a filler to seal off the undercut void. Other embodiments are described and claimed.

公开(公告)号：US11125942B2

公开(公告)日：2021-09-21

申请号：US16453555

申请日：2019-06-26

申请人： FURUKAWA ELECTRIC CO., LTD.

发明人： Yasuyoshi Uchida ,  Yuuki Taniguchi ,  Hiroshi Kawashima ,  Kazutaka Nara ,  Masanori Takahashi

IPC分类号： G02B6/02 ,  G02B6/10 ,  G02B6/12 ,  G02B6/14 ,  G02B6/27 ,  C03C14/00 ,  G02B6/122 ,  G02B6/136 ,  G02B6/293 ,  G02B6/28 ,  G02B6/125

摘要： An optical waveguide element includes: a cladding portion made of silica-based glass; and a plurality of optical waveguides positioned in the cladding portion and made of silica-based glass in which ZrO2 crystal particles are dispersed. The optical waveguide element is a planar lightwave circuit. The plurality of optical waveguides configure an arrayed waveguide grating element.

公开(公告)号：US11109781B2

公开(公告)日：2021-09-07

申请号：US15890206

申请日：2018-02-06

申请人： Sheng Yang ,  Yen-Chun Yeh ,  Dominik Schmidt

发明人： Sheng Yang ,  Yen-Chun Yeh ,  Dominik Schmidt

IPC分类号： A61B5/1455 ,  G02B6/136 ,  G02B6/42 ,  G01J3/44 ,  G01J3/18 ,  A61B5/145 ,  G01N21/65 ,  G02B6/12 ,  G01J3/02 ,  A61B5/00 ,  G01J3/28

摘要： Various embodiments of the invention provide systems and methods for low-cost, low-power Array Waveguide Grating (AWG)-based miniaturized Raman spectroscopy for use in non-invasive glucose monitoring systems, such as in wearable devices that require no replenishment of chemicals or enzymes. The AWG may be manufactured using VLSI processing technology, which significantly reduces manufacturing cost and replaces holographic grating as the dispersive component of light. In embodiments, the AWG is integrated with a number of PIN photodiode detectors on a substrate to further reduce cost and signal loss. In embodiments, a prism-coupling method eliminates alignment problems associated with traditional approaches that utilize fiber-coupling methods.

公开(公告)号：US20210268756A1

公开(公告)日：2021-09-02

申请号：US17186902

申请日：2021-02-26

申请人： Magic Leap, Inc.

发明人： Mauro Melli ,  Chieh Chang ,  Ling Li ,  Melanie Maputol West ,  Christophe Peroz ,  Ali Karbasi ,  Sharad D. Bhagat ,  Brian George Hill

IPC分类号： B29D11/00 ,  G02B6/136 ,  G02B6/12

摘要： Methods are disclosed for fabricating molds for forming eyepieces having waveguides with integrated spacers. The molds are formed by etching deep holes (e.g., 5 μm to 1000 μm deep) into a substrate using a wet etch or dry etch. The etch masks for defining the holes may be formed with a thick metal layer and/or multiple layers of different metals. A resist layer may be disposed over the etch mask. The resist layer may be patterned to form a pattern of holes, the pattern may be transferred to the etch mask, and the etch mask may be used to transfer the pattern into the underlying substrate. The patterned substrate may be utilized as a mold onto which a flowable polymer may be introduced and allowed to harden. Hardened polymer in the holes may form integrated spacers. The hardened polymer may be removed from the mold to form a waveguide with integrated spacers.

公开(公告)号：US11101617B2

公开(公告)日：2021-08-24

申请号：US16513661

申请日：2019-07-16

申请人： Ayar Labs, Inc.

发明人： Roy Edward Meade

IPC分类号： H01L25/075 ,  H01S5/02 ,  F21V8/00 ,  G02B6/43 ,  G02B6/124 ,  G02B6/30 ,  G02B6/136 ,  G02B6/12

摘要： A wafer includes a number of die, with each die including electronic integrated circuits and optical devices. The wafer has a top surface and a bottom surface and a base layer. The bottom surface of the wafer corresponds to a bottom surface of the base layer. A wafer support system is attached to the top surface of the wafer. A thickness of the base layer is removed to expose a target layer within the wafer and to give the wafer a new bottom surface. A replacement handle structure is attached to the new bottom surface of the wafer. The replacement handle structure includes a first thickness region and a second thickness region. The first thickness region is positioned closest to the new bottom surface. The first thickness region is formed of an optical cladding material that mitigates optical coupling between optical devices within the die and the replacement handle structure.

公开(公告)号：US11067748B2

公开(公告)日：2021-07-20

申请号：US16678282

申请日：2019-11-08

申请人： Lightwave Logic Inc.

发明人： Michael Lebby ,  Frederick J Leonberger ,  Richard Becker

IPC分类号： G02B6/12 ,  G02B6/138 ,  G02B6/122 ,  G02F1/225 ,  G02B6/136 ,  G02F1/065 ,  G02B6/132 ,  G02B6/42

摘要： A guide transition device including a light source designed to generate a light beam, a light input port on a first plane and coupled to receive the light beam from the light source, a light output port on a second plane different than the first plane, the light output port designed to couple a received light beam to output equipment and plane shifting apparatus coupled to receive the light beam from the light input port on the first plane and to shift or transfer the light beam to the second plane. The plane shifting apparatus is coupled to transfer the light beam to the light output port on the second plane.

公开(公告)号：US11067727B2

公开(公告)日：2021-07-20

申请号：US16971529

申请日：2019-02-28

申请人： OSRAM OLED GmbH

发明人： Georg Roßbach ,  Hubert Halbritter

IPC分类号： G02B6/136 ,  G02B5/18

摘要： A method for manufacturing a multilayer optical element is disclosed. In an embodiment the method includes providing a substrate, applying a first optical layer by applying a first layer having a dielectric first material having a first refractive index, structuring the first layer by sectionally removing the first material and filling first interspaces with a dielectric second material having a second refractive index different from the first refractive index so that the second material has at least the same height as the first material, and applying at least a second optical layer by applying a second layer having the first material, structuring the second layer by sectionally removing the first material so that the first optical layer is exposed in second interspaces between second areas with the first material and filling the second interspaces with the second material so that the second material has at least the same height as the first material.

公开(公告)号：US20210124119A1

公开(公告)日：2021-04-29

申请号：US17078277

申请日：2020-10-23

申请人： Commissariat a I'Energie Atomique et aux Energies Alternatives

发明人： Sylvie MENEZO ,  Bertrand SZELAG

IPC分类号： G02B6/136

摘要： The invention relates to a process for fabricating a photonic chip (1) comprising steps of transferring a die to an actual transfer region Zre of the receiving substrate (20) comprising a central region Zc entirely covered by the die and a peripheral region Zp having a free surface (25), a first waveguide lying solely in the central region Zc, and a second waveguide lying in the peripheral region Zp; depositing an etch mask (31) on a segment of the die (10) and around the actual transfer region Zre; and dry etching a free segment of the die (10), the free surface (25) of the peripheral region Zp then being partially etched.