公开(公告)号：US10606004B2

公开(公告)日：2020-03-31

申请号：US15995694

申请日：2018-06-01

申请人： Intel Corporation

发明人： Jahnavi Sharma ,  Ganesh Balamurugan ,  Hao Li ,  Meer Nazmus Sakib ,  Haisheng Rong

IPC分类号： G02B6/43 ,  H01L27/146 ,  H04B10/67 ,  G02B6/12 ,  H01L31/12 ,  H01L31/14 ,  H04B10/66

摘要： Embodiments herein may relate to an optoelectronic receiver that includes a photonic integrated circuit (PIC) coupled with a light source. Respective PIC sections of the PIC may include a photodiode and a junction capacitor. The optoelectronic receiver may further include an electronic integrated circuit (EIC) coupled with the PIC. Respective EIC sections of the EIC may be communicatively coupled to respective ones of the PIC sections. Other embodiments may be described and/or claimed.

公开(公告)号：US12081276B2

公开(公告)日：2024-09-03

申请号：US17133360

申请日：2020-12-23

申请人： Intel Corporation

发明人： Meer Nazmus Sakib ,  Peicheng Liao ,  Ranjeet Kumar ,  Duanni Huang ,  Haisheng Rong ,  Harel Frish ,  John Heck ,  Chaoxuan Ma ,  Hao Li ,  Ganesh Balamurugan

IPC分类号： H04B10/61

CPC分类号： H04B10/6165 ,  H04B10/612 ,  H04B10/6164

摘要： Embodiments described herein may be related to apparatuses, processes, and techniques related to coherent optical receivers, including coherent receivers with integrated all-silicon waveguide photodetectors and tunable local oscillators implemented within CMOS technology. Embodiments are also directed to tunable silicon hybrid lasers with integrated temperature sensors to control wavelength. Embodiments are also directed to post-process phase correction of optical hybrid and nested I/Q modulators. Embodiments are also directed to demultiplexing photodetectors based on multiple microrings. In embodiments, all components may be implements on a silicon substrate. Other embodiments may be described and/or claimed.

公开(公告)号：US11137283B2

公开(公告)日：2021-10-05

申请号：US16402990

申请日：2019-05-03

申请人： Intel Corporation

发明人： Ganesh Balamurugan ,  Haisheng Rong ,  Meer Nazmus Sakib ,  Hao Li

IPC分类号： G01J1/44 ,  G01J1/16 ,  G01J1/42 ,  H01L31/0203 ,  G02B6/12 ,  G01J1/02 ,  G01J3/26

摘要： Embodiments of the present disclosure are directed toward techniques and configurations for a photonic apparatus with a photodetector with bias control to provide substantially constant responsivity. The apparatus includes a first photodetector, to receive an optical input and provide a corresponding electrical output; a second photodetector coupled with the first photodetector, wherein the second photodetector is free from receipt of the optical input; and circuitry coupled with the first and second photodetectors, to generate a bias voltage, based at least in part on a dark current generated by the second photodetector in an absence of the optical input, and provide the generated bias voltage to the first photodetector. The first photodetector is to provide a substantially constant ratio of the electrical output to optical input in response to the provision of the generated bias voltage. Additional embodiments may be described and claimed.

公开(公告)号：US20190257688A1

公开(公告)日：2019-08-22

申请号：US16402990

申请日：2019-05-03

申请人： Intel Corporation

发明人： Ganesh Balamurugan ,  Haisheng Rong ,  Meer Nazmus Sakib ,  Hao Li

IPC分类号： G01J1/16 ,  G01J1/42 ,  G02B6/12 ,  H01L31/0203

摘要： Embodiments of the present disclosure are directed toward techniques and configurations for a photonic apparatus with a photodetector with bias control to provide substantially constant responsivity. The apparatus includes a first photodetector, to receive an optical input and provide a corresponding electrical output; a second photodetector coupled with the first photodetector, wherein the second photodetector is free from receipt of the optical input; and circuitry coupled with the first and second photodetectors, to generate a bias voltage, based at least in part on a dark current generated by the second photodetector in an absence of the optical input, and provide the generated bias voltage to the first photodetector. The first photodetector is to provide a substantially constant ratio of the electrical output to optical input in response to the provision of the generated bias voltage. Additional embodiments may be described and claimed.

公开(公告)号：US20220221743A1

公开(公告)日：2022-07-14

申请号：US17711922

申请日：2022-04-01

申请人： Intel Corporation

发明人： Sanjeev Gupta ,  Olufemi I. Dosunmu ,  Nikolai Fediakine ,  Jin Hong ,  David Chak Wang Hui ,  Christian Malouin ,  Meer Nazmus Sakib ,  Jianying Zhou

IPC分类号： G02F1/025 ,  G02F1/01

摘要： Techniques for termination for microring modulators are disclosed. In the illustrative embodiment, a microring modulator on a photonic integrated circuit (PIC) die is modulated by radiofrequency (RF) signals connected to electrodes across the microring modulator. A resistor is connected to each of the electrodes. The resistors both provide termination for the RF signals, preventing or reducing reflections, as well as forming part of a bias tee, allowing for a DC bias voltage to be applied across the electrodes.

公开(公告)号：US20210318561A1

公开(公告)日：2021-10-14

申请号：US17358256

申请日：2021-06-25

申请人： Intel Corporation

发明人： Meer Nazmus Sakib ,  Saeed Fathololoumi ,  Harel Frish ,  John Heck ,  Eddie Bononcini ,  Reece Defrees ,  Stanley J. Dobek ,  Aliasghar Eftekhar ,  Walter Garay ,  Lingtao Liu ,  Wei Qian

IPC分类号： G02F1/01 ,  G02B6/136 ,  G02B6/132

摘要： A method may include: forming a base layer on a substrate; forming a waveguide assembly on the base layer, where the waveguide assembly is surrounded by a cladding layer; forming a trench opening through the cladding layer and the base layer; forming an undercut void by etching the substrate through the trench opening, where the undercut void extends under the waveguide assembly and the base layer; and filling the trench opening with a filler to seal off the undercut void. Other embodiments are described and claimed.

公开(公告)号：US20190049680A1

公开(公告)日：2019-02-14

申请号：US15995694

申请日：2018-06-01

申请人： Intel Corporation

发明人： Jahnavi Sharma ,  Ganesh Balamurugan ,  Hao Li ,  Meer Nazmus Sakib ,  Haisheng Rong

IPC分类号： G02B6/43 ,  H01L27/146 ,  H01L31/12 ,  G02B6/12 ,  H04B10/67

摘要： Embodiments herein may relate to an optoelectronic receiver that includes a photonic integrated circuit (PIC) coupled with a light source. Respective PIC sections of the PIC may include a photodiode and a junction capacitor. The optoelectronic receiver may further include an electronic integrated circuit (EIC) coupled with the PIC. Respective EIC sections of the EIC may be communicatively coupled to respective ones of the PIC sections. Other embodiments may be described and/or claimed.