公开(公告)号：US11502017B2

公开(公告)日：2022-11-15

申请号：US16215237

申请日：2018-12-10

申请人： INTEL CORPORATION

发明人： Cheng Xu ,  Zhimin Wan ,  Lingtao Liu ,  Yikang Deng ,  Junnan Zhao ,  Chandra Mohan Jha ,  Kyu-oh Lee

IPC分类号： H01L23/367 ,  H01L23/538 ,  H01L21/48 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

摘要： An integrated circuit (IC) package comprises a substrate comprising a dielectric and a thermal conduit that is embedded within the dielectric. The thermal conduit has a length that extends laterally within the dielectric from a first end to a second end. An IC die is thermally coupled to the first end of the thermal conduit. The IC die comprises an interconnect that is coupled to the first end of the thermal conduit. An integrated heat spreader comprises a lid over the IC die and at least one sidewall extending from the edge of the lid to the substrate that is thermally coupled to the second end of the thermal conduit.

公开(公告)号：US20200185300A1

公开(公告)日：2020-06-11

申请号：US16215237

申请日：2018-12-10

申请人： INTEL CORPORATION

发明人： Cheng Xu ,  Zhimin Wan ,  Lingtao Liu ,  Yikang Deng ,  Junnan Zhao ,  Chandra Mohan Jha ,  Kyu-oh Lee

IPC分类号： H01L23/367 ,  H01L23/538 ,  H01L21/48 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

摘要： An integrated circuit (IC) package comprises a substrate comprising a dielectric and a thermal conduit that is embedded within the dielectric. The thermal conduit has a length that extends laterally within the dielectric from a first end to a second end. An IC die is thermally coupled to the first end of the thermal conduit. The IC die comprises an interconnect that is coupled to the first end of the thermal conduit. An integrated heat spreader comprises a lid over the IC die and at least one sidewall extending from the edge of the lid to the substrate that is thermally coupled to the second end of the thermal conduit.

公开(公告)号：US20210318561A1

公开(公告)日：2021-10-14

申请号：US17358256

申请日：2021-06-25

申请人： Intel Corporation

发明人： Meer Nazmus Sakib ,  Saeed Fathololoumi ,  Harel Frish ,  John Heck ,  Eddie Bononcini ,  Reece Defrees ,  Stanley J. Dobek ,  Aliasghar Eftekhar ,  Walter Garay ,  Lingtao Liu ,  Wei Qian

IPC分类号： G02F1/01 ,  G02B6/136 ,  G02B6/132

摘要： A method may include: forming a base layer on a substrate; forming a waveguide assembly on the base layer, where the waveguide assembly is surrounded by a cladding layer; forming a trench opening through the cladding layer and the base layer; forming an undercut void by etching the substrate through the trench opening, where the undercut void extends under the waveguide assembly and the base layer; and filling the trench opening with a filler to seal off the undercut void. Other embodiments are described and claimed.