公开(公告)号：US20250138237A1

公开(公告)日：2025-05-01

申请号：US18900926

申请日：2024-09-30

Applicant: ASUSTeK COMPUTER INC.

Inventor： Lin-Wei Chiu

IPC: F21V8/00

Abstract: A light emitting module includes a transparent substrate, a plurality of first light emitting components, a light guide plate and a plurality of second light emitting components. The transparent substrate includes a first surface and a second surface that are opposite to each other. The plurality of first light emitting components are arranged in an array on the first surface. The light guide plate is disposed on the second surface. The plurality of second light emitting components are disposed on the second surface and face the light incident side surface of the light guide plate.

公开(公告)号：US20250133649A1

公开(公告)日：2025-04-24

申请号：US18531714

申请日：2023-12-07

Applicant: ASUSTeK COMPUTER INC.

Inventor： Kuan-Chuan Wang ,  Yi-Hong Lin ,  Chin-Chuan Wu ,  Wei-Chia Liao

IPC: H05K1/02 ,  H05K7/20

Abstract: A heat dissipation module is adapted for being installed on a circuit board. The heat dissipation module includes a fixed base and a heat dissipating device. One end of the fixed base is adapted for being fixed to the circuit board, and the other end has a rotating component. The rotating component is pivoted on the fixed base along a rotation axis. The heat dissipation device includes a heat dissipation body and an alignment member extending from the heat dissipation body, and the alignment member is adapted to be detachably connected to the rotating component. When the heat dissipation device is connected to the rotating component through the alignment member, the heat dissipation body is adapted to flip relative to the fixed base along the rotating axis.

公开(公告)号：US12267970B2

公开(公告)日：2025-04-01

申请号：US18154476

申请日：2023-01-13

Applicant: ASUSTEK COMPUTER INC.

Inventor： Jhih-Wei Rao ,  Zih-Siang Huang ,  Hung-Chieh Wu ,  Liang-Jen Lin

IPC: H05K7/14 ,  G06F1/20 ,  H05K5/02 ,  H05K7/20

Abstract: A thermal dissipation holder for a handheld electronic device is provided. The thermal dissipation holder includes a main structure, a movable element, an elastic element, and a locker. The main structure has a front surface and a rear surface. The movable element is movably connected to the main structure along a first direction and has a clamp portion at a side away from the carrier. One end of the elastic element is connected to the main structure. The other end of the elastic element is connected to the movable element. The elastic element drives the movable element to move along the first direction. The locker is disposed in the main structure and has a locking portion, where a position of the locking portion corresponds to that of the clamp portion, and the locker is selectively engaged with the clamp portion through the locking portion to lock the movable element.

公开(公告)号：US12259548B2

公开(公告)日：2025-03-25

申请号：US17666557

申请日：2022-02-08

Applicant: ASUSTeK COMPUTER INC.

Inventor： Wen-Chang Hung ,  Yu-Chieh Cheng

IPC: G02B27/01 ,  F21V8/00

Abstract: A light guide substrate, including a light coupling-in region with multiple first gratings, a light expansion region with multiple sub light expansion regions, and a light coupling-out region, is provided. Each sub light expansion region includes multiple second gratings. The sub light expansion regions include a first set of sub light expansion regions and a second set of sub light expansion regions. Each second grating in the first set of sub light expansion regions includes a first microstructure and a second microstructure. The light coupling-out region includes multiple third gratings. When an image light enters the light guide substrate from the light coupling-in region through the first gratings, the image light is first transmitted to the light expansion region in the light guide substrate, then transmitted to the light coupling-out region through the second gratings, and then emitted from the light coupling-out region through the third gratings.

公开(公告)号：US20250094033A1

公开(公告)日：2025-03-20

申请号：US18469568

申请日：2023-09-19

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chia-In Liao ,  Chih-Hsien Yang ,  Li-Te Yang ,  Yung-Hsuan Kao ,  Chen-Yu Hsu ,  Shun-Wen Huang

IPC: G06F3/04847 ,  G06F3/04886

Abstract: Disclosed are an edge tool configuration method and an electronic device. The edge tool configuration method includes: detecting a placement status of the electronic device through a sensor; reading configuration information of the edge tool according to the placement status, wherein the configuration information includes initial configuration information of the edge tool in a plurality of default placement statuses; placing the edge tool at an edge position in a display interface of a display according to the configuration information in the placement status.

公开(公告)号：US12255677B2

公开(公告)日：2025-03-18

申请号：US17894145

申请日：2022-08-23

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chi-Lun Huang ,  Jung-Huang Chiang ,  Hsiao-Ming Tsai ,  Ten-Long Deng

IPC: H04B1/18 ,  H05B45/30

Abstract: A detachable antenna and an electronic device are provided. The detachable antenna includes a connector, an antenna module, and a light-emitting module. The light-emitting module includes a light-emitting unit and a bias circuit. The bias circuit includes an input end, a first output end, and a second output end. The input end of the bias circuit receives a mixed signal from the connector. The mixed signal includes a communication signal and a drive signal. The first output end of the bias circuit outputs the communication signal to the antenna module. The second output end of the bias circuit outputs the drive signal to the light-emitting unit. The detachable antenna of the disclosure is integrated with the light-emitting module and receives the mixed signal from a single input end to implement communication and light emitting functions simultaneously.

公开(公告)号：US20250071695A1

公开(公告)日：2025-02-27

申请号：US18945277

申请日：2024-11-12

Applicant: ASUSTek Computer Inc.

Inventor： Chun-Wei Huang ,  Yu-Hsuan Guo ,  Yi-Hsuan Kung

IPC: H04W52/36 ,  H04W52/10

Abstract: Methods and apparatuses are provided for power headroom report regarding multiple TRPs in a wireless communication system. The systems and methods of the present invention address, expand, and improve how networks perform power control on multiple TRPs, how networks manage power control for uplink transmissions for different links, and how a UE derives one or more PH/PHR for different links.

公开(公告)号：US12224530B2

公开(公告)日：2025-02-11

申请号：US17706672

申请日：2022-03-29

Applicant: ASUSTeK COMPUTER INC.

Inventor： Guang-Yi Zeng

IPC: H01R13/6474 ,  H01R24/60

Abstract: A connector assembly includes a male connector and a female connector. The male connector includes N pins with different lengths, and the N pins respectively correspond to N different transmission signals. The female connector includes N signal layers configured to transmit the N different transmission respectively, and each of the N signal layers includes N pass gates. One of the N pass gates of each of the N signal layers is configured to be coupled to a corresponding one of the N pins.

公开(公告)号：US20250016964A1

公开(公告)日：2025-01-09

申请号：US18459425

申请日：2023-09-01

Applicant: ASUSTeK COMPUTER INC.

Inventor： Yu-Wen Chung ,  Shun-Wei Yang ,  Heng-Yu Lee ,  Hao-Yuan Cheng ,  Chun-Shi Liu ,  Chia-Wei Chang

IPC: H05K7/20

Abstract: A node unit includes a base plate, at least one function module, and a non-conductive coolant. The function module includes a heat-generating element, a heat-dissipating structure, and a pump. The heat-generating element is disposed on the base plate, the heat-dissipating structure is disposed on the heat-generating element, and the pump is disposed on the heat-dissipating structure. The base plate and the at least one function module are immersed in the non-conductive coolant. The pump is configured to drive the non-conductive coolant to flow into the heat-dissipating structure and discharge from the heat-dissipating structure. An electronic device and an immersion cooling type equipment are also mentioned.

公开(公告)号：US20250016846A1

公开(公告)日：2025-01-09

申请号：US18889368

申请日：2024-09-18

Applicant: ASUSTek Computer Inc.

Inventor： Yi-Hsuan Kung ,  Yu-Hsuan Guo ,  Chun-Wei Huang

IPC: H04W74/0833 ,  H04W56/00 ,  H04W74/04 ,  H04W74/08

Abstract: Methods, systems, and apparatuses are provided for enhancing timing alignment for uplink (UL) multi-Transmission/Reception Point (TRP) (or mTRP) scenarios in a wireless communication system. A method for a UE in a wireless communication system can comprise receiving a signaling, wherein the signaling indicates activation for a first TRP and/or is a Physical Downlink Control Channel (PDCCH) signal, determining to perform a first random access procedure on the first TRP, based on the signaling, to obtain a first Time Alignment (TA) information associated with the first TRP, and performing multi-TRP operation on the first TRP associated with the first TA information and a second TRP associated with a second TA information.