Plasma uniformity control in pulsed DC plasma chamber

    公开(公告)号:US12148595B2

    公开(公告)日:2024-11-19

    申请号:US17537328

    申请日:2021-11-29

    Abstract: Embodiments provided herein generally include apparatus, e.g., plasma processing systems and methods for the plasma processing of a substrate in a processing chamber. In some embodiments, aspects of the apparatus and methods are directed to improving process uniformity across the surface of the substrate, reducing defectivity on the surface of the substrate, or both. In some embodiments, the apparatus and methods provide for improved control over the uniformity of a plasma formed over the edge of a substrate and/or the distribution of ion energies at the surface of the substrate. The improved control over the plasma uniformity may be used in combination with substrate handling methods, e.g., de-chucking methods, to reduce particulate-related defectivity on the surface of the substrate. In some embodiments, the improved control over the plasma uniformity is used to preferentially clean accumulated processing byproducts from portions of the edge ring during an in-situ plasma chamber cleaning process.

    Buffer circuitry for store to load forwarding

    公开(公告)号:US12147707B2

    公开(公告)日:2024-11-19

    申请号:US17951528

    申请日:2022-09-23

    Applicant: Synopsys, Inc.

    Abstract: A system and method for performing a store to load process includes receiving a first store instruction. The first store instruction includes a first target address, a first mask, and a first data structure. Further, the first target address, the first mask, and the first data structure are stored within a first store buffer location of a store buffer. A first entry identification associated with the first store buffer location is stored within an age buffer. The first data structure is output based on an order of entry identifications within the age buffer.

    Scalable acceleration of reentrant compute operations

    公开(公告)号:US12147379B2

    公开(公告)日:2024-11-19

    申请号:US18089780

    申请日:2022-12-28

    Applicant: XILINX, INC.

    Abstract: Examples herein describe techniques for performing parallel processing using a plurality of processing elements (PEs) and a controller for data that has data dependencies. For example, a calculation may require an entire row or column to be summed, or to determine its mean. The PEs can be assigned different chunks of a data set (e.g., a tensor set, a column, or a row) for processing. The PEs can use one or more tokens to inform the controller when they are done with partial processing of their data chunks. The controller can then gather the partial results and determine an intermediate value for the data set. The controller can then distribute this intermediate value to the PEs which then re-process their respective data chunks using the intermediate value to generate final results.

    Systems and methods of managing communication endpoints

    公开(公告)号:US12143881B2

    公开(公告)日:2024-11-12

    申请号:US18077892

    申请日:2022-12-08

    Applicant: INEMSOFT, Inc.

    Abstract: In one embodiment, a method includes receiving a trigger to dynamically modify a serving site of a communication endpoint, wherein the communication endpoint is registered to receive digital communication service from a first serving site. The method further includes determining a stored serving-site selection policy applicable to the communication endpoint. The method also includes selecting a second serving site for the communication endpoint based, at least part, on a stored serving-site selection policy. Also, the method includes determining endpoint-configuration requirements of the second serving site. Furthermore, the method includes dynamically generating endpoint configurations that satisfy the endpoint-configuration requirements of the second serving site. Moreover, the method includes writing the generated endpoint configurations to the communication endpoint. Additionally, the method includes causing the communication endpoint to register to receive digital communication service from the second serving site in place of the first serving site.

    Methods of modifying portions of layer stacks

    公开(公告)号:US12142487B2

    公开(公告)日:2024-11-12

    申请号:US17197969

    申请日:2021-03-10

    Abstract: Embodiments provided herein generally relate to methods of modifying portions of layer stacks. The methods include forming deep trenches and narrow trenches, such that a desirably low voltage drop between layers is achieved. A method of forming a deep trench includes etching portions of a flowable dielectric, such that a deep metal contact is disposed below the deep trench. The deep trench is selectively etched to form a modified deep trench. A method of forming a super via includes forming a super via trench through a second layer stack of a layer superstack. The methods disclosed herein allow for decreasing the resistance, and thus the voltage drop, of features in a semiconductor layer stack.

    Gray tone uniformity control over substrate topography

    公开(公告)号:US12140871B2

    公开(公告)日:2024-11-12

    申请号:US18048748

    申请日:2022-10-21

    Abstract: Embodiments of the present disclosure generally relate to lithography systems. More particularly, embodiments of the present disclosure relate to a method, a system, and a software application for a lithography process to control transmittance rate of write beams and write gray tone patterns in a single exposure operation. In one embodiment, a plurality of shots are provided by an image projection system in a lithography system to a photoresist layer. The plurality of shots exposes the photoresist layer to an intensity of light emitted from the image projection system. The local transmittance rate of the plurality of shots within an exposure area is varied to form varying step heights in the exposure area of the photoresist layer.

    Polishing fluid collection apparatus and methods related thereto

    公开(公告)号:US12138741B2

    公开(公告)日:2024-11-12

    申请号:US17430688

    申请日:2019-04-04

    Abstract: Embodiments of the present disclosure generally provide apparatus for collecting and reuse polishing fluids and methods related thereto. In particular, the apparatus and methods provided herein feature a polishing fluid collection system used to collect and reuse polishing fluids dispensed during the chemical mechanical polishing (CMP) of a substrate in an electronic device manufacturing process. In one embodiment, a polishing fluid catch basin assembly includes a catch basin sized to surround at least a portion of a polishing platen and to be spaced apart therefrom. The catch basin features an outer wall, an inner wall disposed radially inward of the outer wall, and a base portion connecting the inner wall to the outer wall. The outer wall, the inner wall, and the base portion collectively define a trough. A radially inward facing surface of the inner wall is defined by an arc radius which is greater than a radius of the polishing platen the catch basin is sized to surround.

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