公开(公告)号：US6046091A

公开(公告)日：2000-04-04

申请号：US94395

申请日：1998-06-09

Applicant: Nathaniel R. Quick ,  Clinton V. Kopp ,  Michael Liberman ,  Alexander Sobolevsky ,  Michael C. Murray

Inventor： Nathaniel R. Quick ,  Clinton V. Kopp ,  Michael Liberman ,  Alexander Sobolevsky ,  Michael C. Murray

IPC: H01G4/28 ,  H01G4/38 ,  H01L21/20

CPC classification number: H01G4/28 ,  H01G4/385 ,  Y10T29/435

Abstract: An apparatus and process for making a capacitor comprising a first capacitor plate element covered with a spacing material selected for forming a capacitor dielectric. The first capacitor plate element and the spacing material is encased with a second capacitor element. The second capacitor plate element is drawn for reducing the outer diameter thereof. A multiplicity of the capacitor elements are inserted within a second capacitor plate connector. The second capacitor plate connector is drawn for reducing the outer diameter of the metallic tube and for electrically interconnecting the multiplicity of the second capacitor plate elements with the second capacitor plate connector to form a second capacitor plate. The multiplicity of the first capacitor elements are interconnected with a first capacitor plate connector to form a first capacitor plate. The spacing material is replaced with a dielectric material to form the capacitor thereby.

Abstract translation: 一种用于制造电容器的装置和方法，包括被选择用于形成电容器电介质的间隔材料覆盖的第一电容器板元件。 第一电容器板元件和间隔材料被第二电容器元件封装。 拉伸第二电容器板元件以减小其外径。 多个电容器元件插入第二电容器板连接器内。 第二电容器板连接器被拉伸以减小金属管的外径，并且用于将多个第二电容器板元件与第二电容器板连接器电互连以形成第二电容器板。 第一电容器元件的多重性与第一电容器板连接器互连以形成第一电容器板。 间隔材料被电介质材料代替以形成电容器。

公开(公告)号：US4691091A

公开(公告)日：1987-09-01

申请号：US814986

申请日：1985-12-31

Applicant: Alan M. Lyons ,  Frederick T. Mendenhall, Jr. ,  Murray Robbins ,  Nathaniel R. Quick ,  Cletus W. Wilkins, Jr.

Inventor： Alan M. Lyons ,  Frederick T. Mendenhall, Jr. ,  Murray Robbins ,  Nathaniel R. Quick ,  Cletus W. Wilkins, Jr.

IPC: H01B1/04 ,  H01B13/00 ,  H05K3/10 ,  B23K26/00

CPC classification number: H05K3/105 ,  H05K2203/107 ,  H05K2203/1136

Abstract: Electrically conductive paths are produced on a polymeric substrate by laser writing, i.e., by tracing desired paths on the substrate by a laser beam. The resulting paths comprise electrically conductive carbon as produced by thermal decomposition of substrate surface material; the paths can serve; e.g., as electrical interconnections akin to printed circuitry on a wiring board. Optionally, the conductivity of paths can be enhanced by electroplating a suitable conductor metal or alloy onto the paths.

Abstract translation: 导电路径通过激光写入在聚合物衬底上产生，即通过用激光束追踪衬底上所需的路径。 所得到的路径包括由基底表面材料的热分解产生的导电碳; 路径可以服务; 例如，作为类似于布线板上的印刷电路的电互连。 可选地，可以通过将合适的导体金属或合金电镀到路径上来增强路径的导电性。