COOLING SYSTEM
    71.
    发明申请
    COOLING SYSTEM 有权
    冷却系统

    公开(公告)号:US20110121582A1

    公开(公告)日:2011-05-26

    申请号:US12947857

    申请日:2010-11-17

    IPC分类号: F03G7/06 F28D15/00 H02K7/18

    CPC分类号: F03G7/06

    摘要: A cooling system configured for converting thermal energy to mechanical energy includes a source of thermal energy provided by a temperature difference between a heat source having a first temperature and a coolant having a second temperature that is lower than the first temperature. The cooling system includes a cooling circuit configured for conveying the coolant to and from the heat source. The cooling circuit includes a conduit and a pump in fluid communication with the conduit and configured for delivering the coolant to the heat source. The cooling system also includes a heat engine disposed in thermal relationship with the conduit and configured for converting thermal to mechanical energy. The heat engine includes a first element formed from a first shape memory alloy having a crystallographic phase changeable between austenite and martensite at a first transformation temperature in response to the temperature difference between the heat source and coolant.

    摘要翻译: 构造成将热能转换为机械能的冷却系统包括由具有第一温度的热源和具有低于第一温度的第二温度的冷却剂之间的温度差提供的热能源。 冷却系统包括冷却回路,该冷却回路构造成将冷却剂输送到热源。 冷却回路包括导管和与导管流体连通的构造成将冷却剂输送到热源的泵。 冷却系统还包括与导管热关系设置的热引擎,并被配置为将热转换成机械能。 热机包括由第一形状记忆合金形成的第一元件,该第一形状记忆合金在第一相变温度下响应于热源和冷却剂之间的温度差,具有在奥氏体和马氏体之间可变化的结晶相。

    Temperature protection system for electronic devices
    79.
    发明授权
    Temperature protection system for electronic devices 有权
    电子设备温度保护系统

    公开(公告)号:US08203818B2

    公开(公告)日:2012-06-19

    申请号:US12704854

    申请日:2010-02-12

    IPC分类号: H02H5/00

    CPC分类号: H02H5/047 H02H11/00

    摘要: An electronics system includes an electronic device, a power source and a temperature control switch. An actuator having a shape memory alloy is attached to the temperature control switch and moves the temperature control switch between an open position preventing a current flow between the power source and the electronic device, and a closed position permitting current flow between the power source and the electronic device. The shape memory alloy transforms shapes upon the ambient temperature falling below a low critical temperature or rising above a high critical temperature to move the temperature control switch into one of the closed position to permit current flow to the electronic device or the open position to prevent current flow to the electronics device respectively.

    摘要翻译: 电子系统包括电子设备,电源和温度控制开关。 具有形状记忆合金的致动器附接到温度控制开关,并且将温度控制开关移动到防止电源和电子设备之间的电流的打开位置和允许电源与电源之间的电流流动的关闭位置 电子设备。 形状记忆合金在环境温度低于低临界温度或高于高临界温度时转换形状,以将温度控制开关移动到闭合位置之一,以允许电流流向电子设备或打开位置以防止电流 分别流到电子设备。

    TEMPERATURE PROTECTION SYSTEM FOR ELECTRONIC DEVICES
    80.
    发明申请
    TEMPERATURE PROTECTION SYSTEM FOR ELECTRONIC DEVICES 有权
    电子设备温度保护系统

    公开(公告)号:US20110199711A1

    公开(公告)日:2011-08-18

    申请号:US12704854

    申请日:2010-02-12

    IPC分类号: H02H5/04

    CPC分类号: H02H5/047 H02H11/00

    摘要: An electronics system includes an electronic device, a power source and a temperature control switch. An actuator having a shape memory alloy is attached to the temperature control switch and moves the temperature control switch between an open position preventing a current flow between the power source and the electronic device, and a closed position permitting current flow between the power source and the electronic device. The shape memory alloy transforms shapes upon the ambient temperature falling below a low critical temperature or rising above a high critical temperature to move the temperature control switch into one of the closed position to permit current flow to the electronic device or the open position to prevent current flow to the electronics device respectively.

    摘要翻译: 电子系统包括电子设备,电源和温度控制开关。 具有形状记忆合金的致动器附接到温度控制开关,并且将温度控制开关移动到防止电源和电子设备之间的电流的打开位置和允许电源与电源之间的电流流动的关闭位置 电子设备。 形状记忆合金在环境温度低于低临界温度或高于高临界温度时转换形状,以将温度控制开关移动到关闭位置之一,以允许电流流向电子设备或打开位置以防止电流 分别流到电子设备。