Abstract:
Various techniques are provided to compensate for and/or update ineffective (e.g., stale) calibration terms due to calibration drifts in infrared imaging devices. For example, a virtual-shutter non-uniformity correction (NUC) procedure may be initiated to generate NUC terms to correct non-uniformities when appropriate triggering events and/or conditions are detected that may indicate presence of an object or scene to act as a shutter (e.g., a virtual shutter). Scene-based non-uniformity correction (SBNUC) may be performed during image capturing operations of the infrared imaging device, for example, when a virtual-shutter scene is not available. Further, snapshots of calibration data (e.g., NUC terms) produced during the virtual-shutter NUC procedure, the SBNUC process, and/or other NUC process may be taken. Such snapshots may be utilized to provide useful NUC data when the infrared imaging device starts up or is otherwise reactivated, so that the SBNUC or other NUC methods may produce effective results soon after the start-up. Such snapshots may also be utilized to update ineffective calibration terms.
Abstract:
Various techniques are provided to monitor electrical equipment. In some implementations, a monitoring system for a cabinet may include an infrared camera and a non-thermal camera. The infrared camera may be configured to capture one or more thermal images of at least a portion of electrical equipment positioned in an interior cavity of the cabinet. The non-thermal camera may be configured to capture one or more non-thermal images such as visible light images of the portion of electrical equipment. In some implementations, combined images may be generated that include characteristics of the thermal images and the non-thermal images for viewing by a user. In some implementations, the cameras may receive electrical power through a physical coupling to an electrical connector within the cabinet and/or through electromagnetic energy harvesting techniques. Other implementations are also provided.
Abstract:
Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture thermal infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device. Thermal infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device.
Abstract:
Various techniques are provided for using one or more shielded (e.g., blinded, blocked, and/or obscured) infrared sensors of a thermal imaging device. In one example, a method includes capturing a signal from a shielded infrared sensor that is substantially blocked from receiving infrared radiation from a scene. The method also includes capturing a signal from an unshielded infrared sensor configured to receive the infrared radiation from the scene. The method also includes determining an average thermographic offset reference for the shielded and unshielded infrared sensors based on the captured signal of the shielded infrared sensor. The method also includes determining an absolute radiometric value for the scene based on the average thermographic offset reference and the captured signal of the unshielded infrared sensor.
Abstract:
Various techniques are provided for implementing, operating, and manufacturing infrared imaging devices using integrated circuits. In one example, a system includes a focal plane array (FPA) integrated circuit comprising an array of infrared sensors adapted to image a scene, a plurality of active circuit components, a first metal layer disposed above and connected to the circuit components, a second metal layer disposed above the first metal layer and connected to the first metal layer, and a third metal layer disposed above the second metal layer and below the infrared sensors. The third metal layer is connected to the second metal layer and the infrared sensors. The first, second, and third metal layers are the only metal layers of the FPA between the infrared sensors and the circuit components. The first, second, and third metal layers are adapted to route signals between the circuit components and the infrared sensors.
Abstract:
A housing for an infrared camera module may be implemented with a substantially non-metal cover configured to substantially or completely enclose various components of an infrared imaging device. A metal layer may be disposed on various interior and/or exterior surfaces of the cover. Such implementations may be used to reduce the effects of various environmental conditions which may otherwise adversely affect the performance of the infrared imaging device. In addition, one or more conductive traces may be built into the housing and/or on interior surfaces of the housing to facilitate the passing of signals from components of the infrared imaging device such as infrared sensors, read out circuitry, a temperature measurement component, and/or other components. One or more fiducial markers may be provided to align various components of the infrared camera module during manufacture.