Abstract:
A modified method for forming cylinder-shaped stacked capacitors for DRAMs which circumvents oxide erosion due to misalignment is described. A planar silicon oxide (SiO2) first insulating layer is formed over device areas. A silicon nitride (Si3N4) etch-stop layer is deposited and first openings are etched for capacitor node contacts. A polysilicon layer is deposited and etched back to form node contacts in the first openings. A Si3N4 second etch-stop layer is deposited and etched back to form protective sidewall spacers in the first openings when the polysilicon node contact is inadvertently overetched. A second SiO2 insulating layer is deposited and second openings for bottom electrodes are etched over the node contacts. A conformal second polysilicon layer is deposited and chemically/mechanically polished back to form the bottom electrodes in the second openings. The second insulating layer is removed by wet etching to the first etch-stop layer. When the second openings are misaligned over the node contact openings, the Si3N4 sidewall spacers protect the SiO2 first insulating layer from being eroded over the devices on the substrate. The capacitors are now completed by forming an interelectrode dielectric layer on the bottom electrodes, and depositing and patterning a third polysilicon layer for top electrodes.
Abstract translation:描述了一种用于形成用于DRAM的圆柱形叠层电容器的修改方法,其规避了由于未对准引起的氧化物侵蚀。 在器件区域上形成平面氧化硅(SiO 2)第一绝缘层。 沉积氮化硅(Si 3 N 4)蚀刻停止层,并且蚀刻用于电容器节点触点的第一开口。 沉积多晶硅层并回蚀刻以在第一开口中形成节点接触。 当多晶硅节点接触不经意地过蚀刻时,沉积并蚀刻Si 3 N 4第二蚀刻停止层以在第一开口中形成保护性侧壁间隔物。 沉积第二SiO 2绝缘层,并且在节点触点上蚀刻用于底部电极的第二开口。 沉积保形第二多晶硅层并在第二开口中化学/机械抛光以形成底部电极。 通过湿蚀刻将第二绝缘层去除到第一蚀刻停止层。 当第二开口在节点接触开口上不对准时,Si 3 N 4侧壁间隔物保护SiO 2第一绝缘层免受衬底上的器件的侵蚀。 现在通过在底部电极上形成电极间电介质层来完成电容器,并且沉积并构图用于顶部电极的第三多晶硅层。
Abstract:
A method for increasing the surface area, and thus the capacitance of a DRAM, stacked capacitor structure, has been developed. A storage node electrode, incorporating branches of polysilicon, is created via use of multiple polysilicon and insulator depositions, as well as via the use of dry anisotropic, and wet isotropic, etching procedures. The use of polysilicon spacers, created on the sides of silicon oxide mesas, adds a vertical component to the polysilicon branches. Removal of a portion of insulator layer from between polysilicon branches, results in exposure of the increased storage node electrode surface area. Unetched portions of the insulator layers, between polysilicon branches, supply structural support for the storage node electrode, comprised of polysilicon branches.
Abstract:
Embodiments are described in terms of selective methods of sealing separators and jellyroll electrode assemblies and cells made using such methods. More particularly, methods of selectively heat sealing separators to encapsulate one of two electrodes for nickel-zinc rechargeable cells having jellyroll assemblies are described. Selective heat sealing may be applied to both ends of a jellyroll electrode assembly in order to selectively seal one of two electrodes on each end of the jellyroll.
Abstract:
Methods and systems for managing profiles for electronic content. The methods and systems may involve profiles for a plurality of electronic content items. If a user interaction with an electronic content item of the plurality of electronic content items meets an event definition, the user interaction may be identified as an event associated with the electronic content and recorded in the profile.
Abstract:
Methods and systems for interfacing packet and circuit telephony operations in a distributed telecommunications network. Initially, one or more digital circuit switches can be associated with the distributed telecommunications network. Thereafter, one or more network transmission elements within the distributed telecommunications network can be connected to one or more of the digital circuit switches. One or more broadband switches can then be associated with one or more of the network transmission elements, such that the broadband switches thereof interface with network transmission elements and the digital circuit switches to coordinate combined circuit and packet signaling, routing and calling processing services among varying terminals of the distributed telecommunications network.
Abstract:
Integrated circuit devices having fixed and programmable logic portions are made by combining a hardware description language representation of the fixed logic and a hardware description language representation of the programmable logic to create a single hardware description language representation of a device. This allows multiple portions of programmable logic, distributed where needed in whatever size needed, to be interspersed among the fixed logic. Because the behavior of the programmable logic, rather than of the user programming, is being represented, a programmable logic architecture is provided that lacks behaviors, such as combinational loops, that would cause compilation of the hardware description language to generate errors.