Abstract:
Improved probing is provided using a knee probe where the knee curves away from the probe axis and then curves back to connect to the probe tip, crossing the probe axis on the way to the tip. The resulting lateral offset between the probe tip and the probe axis is a key geometrical parameter for predetermining the scrub motion provided by the probe in response to a predetermined contact force. The scrub motion preferably includes both a sliding motion and a rocking motion, where the sliding motion acts to clean the contact pad and the rocking motion acts to bring a clean part of the probe tip into contact with the freshly cleaned part of the contact pad. In preferred embodiments, the probe tip can include one or more relatively narrow “skates” for making contact to the contact pad. A dual skate configuration is especially appropriate when small dimples are at the centers of the contact pads.
Abstract:
A vertically folded probe is provided that can provide improved scrub performance in cases where the probe height is limited. More specifically, such a probe includes a base and a tip, and an arm extending from the base to the tip as a single continuous member. The probe arm is vertically folded, such that it includes three or more vertical arm portions. The vertical arm portions have substantial vertical overlap, and are laterally displaced from each other. When such a probe is vertically brought down onto a device under test, the probe deforms. During probe deformation, at least two of the vertical arm portions come into contact with each other. Such contact between the arm portions can advantageously increase the lateral scrub motion at the probe tip, and can also advantageously reduce the probe inductance.
Abstract:
Improved probing of closely spaced contact pads is provided by an array of guided vertical probes that has a sideways scrub relative to the line of contact pads. With this orientation of scrub motion, the probes can be relatively thin along the contact line, and relatively thick perpendicular to the contact line. The thin dimension of the probes allows for probing closely spaced contact pads, while the thick dimension of the probes provides mechanical robustness and current carrying capacity. The probes have a predetermined curvature in a plane including the contact line, to help determine the amount of scrub motion during contact. In a preferred embodiment, an array of probes is provided for probing two closely spaced and parallel rows of contact pads, offset from each other by half the contact pad pitch.
Abstract:
A vertically folded probe is provided that can provide improved scrub performance in cases where the probe height is limited. More specifically, such a probe includes a base and a tip, and an arm extending from the base to the tip as a single continuous member. The probe arm is vertically folded, such that it includes three or more vertical arm portions. The vertical arm portions have substantial vertical overlap, and are laterally displaced from each other. When such a probe is vertically brought down onto a device under test, the probe deforms. During probe deformation, at least two of the vertical arm portions come into contact with each other. Such contact between the arm portions can advantageously increase the lateral scrub motion at the probe tip, and can also advantageously reduce the probe inductance.
Abstract:
Improved probing of closely spaced contact pads is provided by an array of guided vertical probes that has a sideways scrub relative to the line of contact pads. With this orientation of scrub motion, the probes can be relatively thin along the contact line, and relatively thick perpendicular to the contact line. The thin dimension of the probes allows for probing closely spaced contact pads, while the thick dimension of the probes provides mechanical robustness and current carrying capacity. The probes have a predetermined curvature in a plane including the contact line, to help determine the amount of scrub motion during contact. In a preferred embodiment, an array of probes is provided for probing two closely spaced and parallel rows of contact pads, offset from each other by half the contact pad pitch.
Abstract:
Method and apparatus using a retention arrangement for probes used for electrical testing of a device under test (DUT). The apparatus has a number of probes each of which has a connect end for applying a test signal, a retaining portion, at least one arm portion and a contact tip for making an electrical contact with the DUT. A retention arrangement has a tip holder for holding each of the probes by its contacting tip and a plate with openings for holding each of the probes below the retaining portion. The retaining portion of each of the probes is potted in a potting region defined above the plate with the aid of a potting agent. The apparatus can be used with space transformers, a variety of probes of different geometries and scrub motion characteristics and is well-suited for use in probe card apparatus under tight pitch and small tolerance requirements.
Abstract:
A probe for engaging a conductive pad is provided. The probe includes a probe contact end for receiving a test current, a probe retention portion below the contact end, a block for holding the probe retention portion, a probe arm below the retention portion, a probe contact tip below the arm, and a generally planar self-cleaning skate disposed perpendicular below the contact tip. The self-cleaning skate has a square front, a round back and a flat middle section. The conductive pad is of generally convex shape having a granular non-conductive surface of debris and moves to engage the skate, whereby an overdrive motion is applied to the pad causing the skate to move across and scrub non-conductive debris from the pad displacing the debris along the skate and around the skate round back end to a position on the skate that is away from the pad.
Abstract:
A probe having a conductive body and a contacting tip that is terminated by one or more blunt skates for engaging a conductive pad of a device under test (DUT) for performing electrical testing. The contacting tip has a certain width and the blunt skate is narrower than the tip width. The skate is aligned along a scrub direction and also has a certain curvature along the scrub direction such that it may undergo both a scrub motion and a self-cleaning rotation upon application of a contact force between the skate and the conductive pad. While the scrub motion clears oxide from the pad to establish electrical contact, the rotation removes debris from the skate and thus preserves a low contact resistance between the skate and the pad. The use of probes with one or more blunt skates and methods of using such self-cleaning probes are especially advantageous when testing DUTs with low-K conductive pads or other mechanically fragile pads that tend to be damaged by large contact force concentration.
Abstract:
Method and apparatus for electrical testing of a device under test (DUT) that employs a connection board with signal contacts for applying test signals and a space transformer that has low pitch contacts arranged on one or more circumferential shelves that define an enclosure in the space transformer. The apparatus has a substrate with fine pitch contacts positioned such that these are within the enclosure. A set of wire bonds is used for pitch reduction by interconnecting the fine pitch contacts with the low pitch contacts arranged on the shelves. The probes are connected to the fine pitch contacts and are used to apply the test signals to a DUT by contacting its pads. In some embodiments, the fine pitch contacts may be embodied by plugs or by blind metal vias.
Abstract:
A interconnect assembly features a prefabricated interconnect structure metallurgically bonded to a terminal of a larger structure. Fabrication of the interconnect structure's independently and separate from the larger structure enables the use of economic mass fabrication techniques that are well-known for miniature scale sheet metal parts. During fabrication, positioning and attachment, each interconnect structure is combined with and/or held in a carrier structure from which it is separated after attachment to the terminal. The interconnect structure is configured such that an attachment tool may be brought into close proximity to the attachment interface between the interconnect structure and the terminal for a short and direct transmission of bonding energy onto the attachment interface. The attachment interface provides for an electrically conductive and a bending stress opposing mechanical connection between the interconnect structure and the terminal. The interconnect assembly is preferably part of a probe apparatus.