MULTI-CONDUIT MANIFOLDS, SYSTEMS, AND METHODS FOR APPLYING REDUCED PRESSURE TO A SUBCUTANEOUS TISSUE SITE
    71.
    发明申请
    MULTI-CONDUIT MANIFOLDS, SYSTEMS, AND METHODS FOR APPLYING REDUCED PRESSURE TO A SUBCUTANEOUS TISSUE SITE 审中-公开
    用于将降低压力应用于多个组织网站的多管制装置,系统和方法

    公开(公告)号:US20150045726A1

    公开(公告)日:2015-02-12

    申请号:US14489173

    申请日:2014-09-17

    Abstract: The illustrative embodiments described herein are directed to systems, methods, and apparatuses for applying a reduced pressure to a subcutaneous tissue site. In one instance, a manifold for applying reduced pressure to a subcutaneous tissue site includes a plurality of first conduits, each of the plurality of first conduits having a wall with at least one first aperture and at least one second aperture. At least one of the plurality of first conduits is operable to deliver reduced pressure to the subcutaneous tissue site. The plurality of first conduits is coupled in a spaced arrangement that forms an interior space. The manifold further includes a second conduit comprising the interior space and formed by a portion of each wall of the plurality of first conduits. The second conduit is in fluid communication with the plurality of first conduits via the at least one second aperture.

    Abstract translation: 本文描述的说明性实施例涉及用于向皮下组织部位施加减压的系统,方法和装置。 在一种情况下,用于向皮下组织部位施加减压的歧管包括多个第一导管,多个第一导管中的每一个具有壁,其具有至少一个第一孔和至少一个第二孔。 多个第一导管中的至少一个可操作以将减压递送至皮下组织部位。 多个第一导管以形成内部空间的间隔布置联接。 歧管还包括包括内部空间并由多个第一导管的每个壁的一部分形成的第二导管。 第二导管经由至少一个第二孔与多个第一导管流体连通。

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