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177 条记录 (耗时 0.021 秒)

    Thermal wake suppressor
    71.
    发明授权
    Thermal wake suppressor 有权

    公开(公告)号：US11874712B2

    公开(公告)日：2024-01-16

    申请号：US17647042

    申请日：2022-01-05

    申请人： Quanta Computer Inc.

    发明人： Chao-Jung Chen ,  Herman Tan ,  Tien-Juei Chuang

    IPC分类号： G06F1/20 ,  H05K7/20

    CPC分类号： G06F1/20 ,  H05K7/20727

    摘要： According to certain aspects of the present disclosure, a system includes a heat-generating component and a thermal wake suppressor positioned downstream from the heat-generating component. The heat-generating component produces a thermal wake in a downstream direction. The thermal wake suppressor includes a spacing grid and a plurality of twist plates extending from the spacing grid at an angle. The spacing grid is defined by a plurality of longitudinal ribs and a plurality of transverse ribs that form a plurality of intersections. The plurality of twist plates is periodically arranged on the plurality of longitudinal ribs and the plurality of transverse ribs, such that a subset of the plurality of twist plates is arranged to break apart the thermal wake into sub-vortexes in the downstream direction.

    Server rack cooling system
    72.
    发明授权
    Server rack cooling system 有权

    公开(公告)号：US11765868B2

    公开(公告)日：2023-09-19

    申请号：US17070194

    申请日：2020-10-14

    申请人： Quanta Computer Inc.

    发明人： Chao-Jung Chen ,  Yu-Nien Huang ,  Kuan-Hsiang Liao

    IPC分类号： G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K7/20

    CPC分类号： H05K7/20836 ,  H05K7/20718

    摘要： A cooling system is disclosed for a server rack holding one or more servers. The cooling system includes a cooling module configured to condition coolant to provide cooling within the server rack. The cooling system further includes at least one evaporator configured to couple to an upstream side of the server rack, relative to airflow through the server rack, and cool the airflow flowing into the server rack with the coolant. The cooling system further includes at least one condenser configured to couple to a downstream side of the server rack, relative to the airflow through the server rack, and cool the coolant after the coolant passes through the at least one evaporator.

    Lock mechanism for a flap
    73.
    发明授权
    Lock mechanism for a flap 有权

    公开(公告)号：US11558971B2

    公开(公告)日：2023-01-17

    申请号：US17123985

    申请日：2020-12-16

    申请人： Quanta Computer Inc.

    发明人： Chao-Jung Chen ,  Hou-Hsien Chang

    IPC分类号： H05K5/02 ,  H05K7/14 ,  F16H19/04 ,  E05C3/12

    摘要： A lock mechanism within a slot of a computer chassis is disclosed. The lock mechanism includes a gear wheel, a gear rack body, a push rod latch, a push rod body, and a chassis latch. The gear wheel, the gear rack body, the push rod latch, the push rod body, and the chassis latch cooperate to restrict a flap in the slot from opening when the flap is in the closed position, and the chassis latch is engaged with a cutout on the push rod body.

    Front and rear modular chassis alignment
    74.
    发明授权
    Front and rear modular chassis alignment 有权

    公开(公告)号：US11191176B1

    公开(公告)日：2021-11-30

    申请号：US17022699

    申请日：2020-09-16

    申请人： QUANTA COMPUTER INC.

    发明人： Chao-Jung Chen ,  Hou-Hsien Chang

    IPC分类号： H05K5/02 ,  H05K7/14

    摘要： A computer chassis for accepting a front module and a rear module without a midplane board is disclosed. A middle bracket positioned within the chassis facilitates alignment of connectors of the front module and rear module, which can be directly connected together by applying sufficient force. The rear module can be inserted into the chassis and can automatically lock in place, thereby allowing force applied from the front module to be used to connect the connectors of the front module and rear module together, rather than pressing the rear module out of the chassis. The rear module can further include elements to improve safety and structure. In some cases, supplemental locking mechanisms can be used to ensure the rear module cannot be removed until certain sub-modules (e.g., a power supply unit) has been removed.

    High performance outdoor edge server
    76.
    发明授权
    High performance outdoor edge server 有权

    公开(公告)号：US10856447B2

    公开(公告)日：2020-12-01

    申请号：US16246050

    申请日：2019-01-11

    申请人： QUANTA COMPUTER INC.

    发明人： Chao-Jung Chen ,  Yu-Nien Huang ,  Ching-Yu Chen ,  Kuo-Wei Lee

    IPC分类号： H05K7/20 ,  F28F3/02 ,  H05K5/02 ,  H05K5/06

    摘要： A server includes an inner housing disposed within an outer housing such that a channel is defined between them. The inner housing includes a low-power electronic component and a high-power electronic component, and is sealed to protect the components. A first heat sink extends through the inner housing. Heat generated by the low-power electronic component is transferred through an inner portion of the first heat sink to an outer portion of the first heat sink. A second heat sink disposed in the channel is coupled to the high-power electronic component via heat pipes that extend through the inner housing. Heat generated by the high-power electronic component is transferred through the heat pipes to the second heat sink. A fan positioned in the channel causes air to enter the channel through a first vent, flow through the channel, and exit the channel via a second vent to remove the generated heat.

    Server system
    77.
    再颁专利
    Server system 有权

    公开(公告)号：USRE48135E1

    公开(公告)日：2020-07-28

    申请号：US14822002

    申请日：2015-08-10

    申请人： Quanta Computer Inc.

    发明人： Maw-Zan Jau ,  Wei-Yi Chu ,  Chao-Jung Chen ,  Tzu-Hung Wang ,  Chih-Ming Chen

    IPC分类号： H05K7/14 ,  H05K7/20

    摘要： A server system includes a rack, a power supply module, a switch, and a plurality of servers. The rack can be divided into a plurality of rack units. The rack units are parallel to each other and vertically arranged. The power supply module and the switch are disposed in close proximity to each other in at least one of the rack units. The power supply is adjacent to the rear side of the rack. The switch is adjacent to the front side of the rack. Each of the servers is disposed in one of the other rack units and electrically connected to the power supply module and the switch.

    Transceiver hot swap contact structure
    79.
    发明授权
    Transceiver hot swap contact structure 有权

    公开(公告)号：US10651598B2

    公开(公告)日：2020-05-12

    申请号：US16058408

    申请日：2018-08-08

    申请人： QUANTA COMPUTER INC.

    发明人： Chao-Jung Chen ,  Yu-Nien Huang ,  Kuen-Hsien Wu ,  Kuo-Wei Lee

    IPC分类号： H01R13/631 ,  H01R13/502 ,  H05K7/20 ,  G02B6/42 ,  H04B5/02

    摘要： A heat transfer system between a heat source and a heat sink, wherein the heat transfer contact surfaces comprise a metal which forms numerous voids when placed adjacent one another. A thermal pad comprising a polymer filled with ceramic particles is placed between these heat transfer surfaces to intimately contact each of the metal surfaces without void formation, thereby increasing thermal conductivity. The heat source and heat sink are joined by relative sliding motion. This sliding motion might damage the thermal pad. Thus, a hot swap structure is provided for controlling the movement of the thermal pad into contact with the heat source as the sliding motion is completed.