Contact structure and electronic device including same

    公开(公告)号:US11553068B2

    公开(公告)日:2023-01-10

    申请号:US16958878

    申请日:2019-01-08

    IPC分类号: H04M1/02 H01R24/60

    摘要: An electronic device according to various embodiments of the present invention comprises: a housing that includes a first plate oriented in a first direction, a second plate oriented in a second direction opposite to the first direction, and a side member covering a space between the first plate and the second plate; a printed circuit board disposed in the space of the housing; a contact structure that is processed and formed toward at least one side of the printed circuit board from the side member of the housing and provides a contact point with an external electronic device; and a contact point structure that is disposed between the contact structure and the printed circuit board. The contact structure includes: at least one contact part of which at least a part is exposed to an external space and is made of the same material as the side member; and an insulating part, disposed around the at least one contact part, for separating the contact part and the side member from each other.

    STRUCTURE FOR GROUND AND ELECTRONIC APPARATUS INCLUDING SAME

    公开(公告)号:US20220095794A1

    公开(公告)日:2022-03-31

    申请号:US17546731

    申请日:2021-12-09

    IPC分类号: A47B88/437

    摘要: Disclosed is an electronic device of a slide type and including a main body, a guide rail coupled with the main body and configured to enable rotational movement, a driving device coupled with the main body and configured to control the rotational movement of the guide rail, a guide structure coupled with the main body, a slide body; and a connector structure coupled with the slide body, wherein the connector structure is coupled with the guide rail to linearly move according to the rotational movement, wherein the slide body is flexibly disposed in a designated area according to the linear movement of the connector structure, and wherein one surface of the connector structure and one surface of the guide structure are configured to form an electrical connection.