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71.
公开(公告)号:US20180180873A1
公开(公告)日:2018-06-28
申请号:US15594287
申请日:2017-05-12
Applicant: STMicroelectronics S.r.l.
Inventor: Roberto Carminati , Domenico Giusti , Sonia Constantini
CPC classification number: G02B26/0858 , B81B3/0083 , B81B2201/032 , B81B2203/0118 , G02B26/105 , H04N9/3129
Abstract: A MEMS device includes a fixed structure and suspended structure including an internal structure and a first arm and a second arm. Each arm has a first end fixed to the fixed structure and a second end fixed to the internal structure. The ends are angularly arranged at a distance apart. Piezoelectric actuators mounted to the arms are driven so as to cause deformation of the arm and produce a rotation of the internal structure. In a resting condition, each of the first and second arms has a respective elongated portion with a respective concavity. The internal structure extends in part within the concavities of the elongated portions of the first and second arms.
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72.
公开(公告)号:US20180148325A1
公开(公告)日:2018-05-31
申请号:US15591652
申请日:2017-05-10
Applicant: STMICROELECTRONICS S.R.L.
Inventor: Enri Duqi , Lorenzo Baldo , Domenico Giusti
CPC classification number: B81C1/00238 , B81B7/0051 , B81B7/007 , B81B2201/0235 , B81B2201/0242 , B81B2201/0264 , B81B2203/0118 , B81B2203/0127 , B81B2203/0315 , B81B2207/012 , B81B2207/07 , B81C2201/0133 , B81C2203/032 , B81C2203/035 , B81C2203/0792
Abstract: An integrated device includes: a first die; a second die coupled in a stacked way on the first die along a vertical axis; a coupling region arranged between facing surfaces of the first die and of the second die, which face one another along the vertical axis and lie in a horizontal plane orthogonal to the vertical axis, for mechanical coupling of the first and second dies; electrical-contact elements carried by the facing surfaces of the first and second dies, aligned in pairs along the vertical axis; and conductive regions arranged between the pairs of electrical-contact elements carried by the facing surfaces of the first and second dies, for their electrical coupling. Supporting elements are arranged at the facing surface of at least one of the first and second dies and elastically support respective electrical-contact elements.
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73.
公开(公告)号:US20170160540A1
公开(公告)日:2017-06-08
申请号:US15165547
申请日:2016-05-26
Applicant: STMicroelectronics S.r.l.
Inventor: Domenico Giusti , Roberto Carminati , Massimiliano Merli
CPC classification number: G02B26/105 , B81B3/0048 , B81B3/0083 , B81B2201/042 , G02B26/0858 , H04N9/3173
Abstract: A micromechanical device includes a tiltable structure that is rotatable about a first rotation axis. The tiltable structure is coupled to a fixed structure through an actuation structure of a piezoelectric type. The actuation structure is formed by spring elements having a spiral shape. The spring elements each include actuation arms extending transversely to the first rotation axis. Each actuation arm carries a respective piezoelectric band of piezoelectric material. The actuation arms are divided into two sets with the piezoelectric bands thereof biased in phase opposition to obtain rotation in opposite directions of the tiltable structure about the first rotation axis.
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公开(公告)号:US20160107445A1
公开(公告)日:2016-04-21
申请号:US14976445
申请日:2015-12-21
Applicant: STMICROELECTRONICS S.R.L.
Inventor: Domenico Giusti , Daniele Prati
IPC: B41J2/14
CPC classification number: B41J2/14064 , B41J2/14056 , B41J2/14072 , B41J2/1412 , B41J2/14129 , B41J2002/14403 , B41J2202/11 , Y10T29/49352
Abstract: The present disclosure is directed to a microfluidic die that includes a first larger heater and a second smaller heater is a single chamber. The first heater is configured to form a primary bubble that ejects fluid from a nozzle associated with the chamber. The second heater is configured to form a secondary bubble to prevent blow back caused when the primary bubble bursts and ejects fluid from the nozzle. The first and second heater may be coupled to a single input trace and a single ground trace.
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75.
公开(公告)号:US09248648B2
公开(公告)日:2016-02-02
申请号:US14310898
申请日:2014-06-20
Applicant: STMicroelectronics S.r.l.
Inventor: Domenico Giusti , Daniele Prati
CPC classification number: B41J2/14064 , B41J2/14056 , B41J2/14072 , B41J2/1412 , B41J2/14129 , B41J2002/14403 , B41J2202/11 , Y10T29/49352
Abstract: The present disclosure is directed to a microfluidic die that includes a first larger heater and a second smaller heater is a single chamber. The first heater is configured to form a primary bubble that ejects fluid from a nozzle associated with the chamber. The second heater is configured to form a secondary bubble to prevent blow back caused when the primary bubble bursts and ejects fluid from the nozzle. The first and second heater may be coupled to a single input trace and a single ground trace.
Abstract translation: 本公开涉及包括第一较大加热器并且第二较小加热器是单室的微流体管芯。 第一加热器被配置成形成从与腔室相关联的喷嘴喷出流体的初级气泡。 第二加热器构造成形成二次气泡,以防止当初级泡沫从喷嘴中喷出并喷射流体时引起的回吹。 第一和第二加热器可以耦合到单个输入迹线和单个接地迹线。
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