公开(公告)号：US20140042182A1

公开(公告)日：2014-02-13

申请号：US14021424

申请日：2013-09-09

Applicant: NORDSON CORPORATION

Inventor： Leslie J. Varga

IPC: B05C9/14

CPC classification number: B29B13/022 ,  B05B12/006 ,  B05C5/001 ,  B05C5/0225 ,  B05C5/0237 ,  B05C9/14 ,  B05C11/101 ,  B29B13/02 ,  E06B3/9612

Abstract: An apparatus for melting and dispensing thermoplastic material is provided that includes an un-heated hopper having an inlet for receiving particles of a thermoplastic material and an outlet for discharging the particles and a heated manifold including at least one cavity formed therein and having an inlet and an outlet the inlet communicating with the outlet of the hopper for receipt of the particles from the hopper. The hopper is disposed external of the heated manifold. The heated manifold is effective for melting the particles into molten thermoplastic material therein. The apparatus further includes a pump having an inlet in fluid communication with the cavity. An outlet of the pump is in fluid communication with an inlet of a dispenser and an outlet of the dispenser is effective for dispensing the molten thermoplastic material therethrough.

Abstract translation: 提供了一种用于熔化和分配热塑性材料的设备，其包括未加热的料斗，其具有用于接收热塑性材料的颗粒的入口和用于排出颗粒的出口和包括形成在其中的至少一个空腔的加热歧管，并且具有入口和 入口与入口的出口连通以从料斗接收颗粒。 料斗设置在加热歧管的外部。 加热的歧管对于将颗粒熔化成熔融热塑性材料是有效的。 该装置还包括具有与空腔流体连通的入口的泵。 泵的出口与分配器的入口流体连通，并且分配器的出口有效地分配熔融的热塑性材料通过其中。

公开(公告)号：US08360704B2

公开(公告)日：2013-01-29

申请号：US12707071

申请日：2010-02-17

Applicant: Shinya Sasamoto ,  Atsushi Tsuchiya

Inventor： Shinya Sasamoto ,  Atsushi Tsuchiya

IPC: B42C9/00 ,  B42C13/00 ,  G03G15/00

CPC classification number: B42C9/00 ,  B05C1/003 ,  B05C1/08 ,  B05C1/0813 ,  B05C11/101

Abstract: The present invention provides an adhesive application apparatus that forms a uniform application layer when applying an adhesive to a sheet bundle for a various a length or a width of the sheet bundle. The apparatus includes an applying operation controlling device including a reference value storing device for previously setting and storing a preset reference value of an application length and/or an application width of the sheet bundle, a size recognizing device for identifying an application length and/or an application width of the adhesive applied to the sheet bundle, and an application region comparing device for comparing an identified value of the application length and/or the application width of the adhesive applied to the sheet bundle from the size recognizing device with a preset reference value of the application length and/or the application width of the sheet bundle from the reference value storing device.

Abstract translation: 本发明提供了一种粘合剂施加装置，其在片材束的各种长度或宽度上对粘合剂施加粘合剂时形成均匀的涂布层。 该装置包括：应用操作控制装置，包括用于预先设置和存储纸张捆的应用长度和/或应用宽度的预设参考值的参考值存储装置，用于识别应用长度的尺寸识别装置和/或 施加到片材摞上的粘合剂的施加宽度，以及应用区域比较装置，用于将施加到片材摞上的粘合剂的施加长度的识别值和/或施加宽度与尺寸识别装置进行比较， 来自参考值存储装置的片材束的应用长度和/或应用宽度的值。

公开(公告)号：US20120145743A1

公开(公告)日：2012-06-14

申请号：US13378076

申请日：2010-06-11

Applicant: Kazumasa Ikushima

Inventor： Kazumasa Ikushima

IPC: B05C11/10 ,  B65B3/26 ,  B67D7/58

CPC classification number: F04B23/02 ,  B05C5/0225 ,  B05C11/1007 ,  B05C11/101 ,  F04B15/02 ,  Y10T137/7761

Abstract: A device for discharging a constant amount of a high-viscosity material, capable of accurately discharging the material even if the material is sent under high pressure. A device for discharging a constant amount of a high-viscosity material, provided with: a discharge unit (400) having a discharge opening which discharges the high-viscosity material; a holding unit (300) having a holding area which holds the high-viscosity material, a receiving opening which supplies the high-viscosity material to the holding area, and a delivery opening which delivers the high-viscosity material to the discharge unit; and a high-pressure supply pump (100) for supplying to the holding unit under a first pressure the high-viscosity material having been filled into a container. A liquid sending unit (200) having a pump mechanism and a valve mechanism is provided in the flow path for connecting the high-pressure supply pump (100) and the holding unit (300), and the liquid sending unit sends the high-viscosity material to the holding unit by a second pressure adjusted to a lower pressure than the first pressure.

Abstract translation: 用于排出恒定量的高粘度材料的装置，即使在高压下输送材料也能够精确地排出材料。 一种用于排出恒定量的高粘度材料的装置，其具有：具有排出高粘度材料的排出口的排出单元（400）; 具有保持高粘度材料的保持区域的保持单元（300），将高粘度材料供给到保持区域的接收开口和将高粘度材料输送到排出单元的输送口; 以及用于在第一压力下将已经填充到容器中的高粘度材料供给到保持单元的高压供应泵（100）。 在用于连接高压供给泵（100）和保持单元（300）的流路中设置有具有泵机构和阀机构的送液单元（200），送液单元将高粘度 材料通过被调节到比第一压力更低的压力的第二压力保持在保持单元上。

公开(公告)号：US20090288598A1

公开(公告)日：2009-11-26

申请号：US12154322

申请日：2008-05-21

Applicant: Thomas James Riga, JR. ,  Danny Richard Gubbels ,  Robert Burgard

Inventor： Thomas James Riga, JR. ,  Danny Richard Gubbels ,  Robert Burgard

IPC: B05C11/10 ,  B05C1/08 ,  G05D9/00 ,  G05D7/00

CPC classification number: G05D9/12 ,  B05C1/0813 ,  B05C1/0817 ,  B05C11/04 ,  B05C11/101

Abstract: A supply system for a chambered doctor blade assembly makes possible the sequential use of water-based and non-water-based coating materials through automated functions programmed in a PLC that controls the system. A pair of pneumatically driven diaphragm pumps serve as supply pump and return pump between the doctor blade chamber and a coating reservoir A PLC controls the pulse rate of pneumatic pressure to the pumps to control the rate of flow of the coating material into, and out of the doctor blade chamber. An ultrasonic sensor mounted detects the liquid level in the trough collection area. The PLC is programmed to modify the pulse rate of the supply pump and return pump to maintain the liquid level in the trough collection area above the drain thereof and below the maximum tolerance.

Abstract translation: 用于腔室刮刀组件的供应系统使得可以通过在PLC中编程的自动功能来顺序使用水基和非水基涂层材料来控制系统。 一对气动驱动的隔膜泵在刮刀室和涂层储存器之间用作供应泵和回流泵。PLC控制泵的气动压力的脉率，以控制涂层材料流入和流出的速率 刮刀室。 安装的超声波传感器检测槽收集区域中的液位。 PLC被编程为修改供给泵和回流泵的脉冲速率，以保持其排水管上方的槽收集区域中的液位并且低于最大公差。

公开(公告)号：US20090155457A1

公开(公告)日：2009-06-18

申请号：US12196674

申请日：2008-08-22

Applicant: Daisuke IKEDA ,  Akira Shimoyoshi ,  Motonari Kifune ,  Hideaki Hirabara

Inventor： Daisuke IKEDA ,  Akira Shimoyoshi ,  Motonari Kifune ,  Hideaki Hirabara

IPC: B05D5/06 ,  B05C5/02

CPC classification number: B05C11/101 ,  B05C5/005 ,  H01J9/02

Abstract: A die coater of the present invention includes: a replaceable-type paste container containing a paste inside thereof and including, in its upper surface, a paste ejection port for ejecting the paste; a buffer tank for storing the paste ejected from the paste ejection port; and a coat-layer formation portion for discharging the paste ejected from the buffer tank onto a substrate through a head to form a coat layer, wherein the paste container is placed such that the upper surface thereof is oriented more downwardly than a vertical plane, in order to cause the paste to be ejected from the paste ejection port due to its weight.

Abstract translation: 本发明的模涂机包括：在其内部含有糊状物的可替换型糊剂容器，在其上表面包括用于喷射膏体的糊剂喷射口; 缓冲罐，用于储存从所述粘贴喷射口喷出的浆料; 以及涂层形成部，用于通过头部将从缓冲罐喷出的糊状物排出到基板上，形成涂层，其中，糊状容器的上表面比垂直面更向下取向， 为了使糊料由于其重量而从糊料喷出口喷出。

公开(公告)号：US07390533B2

公开(公告)日：2008-06-24

申请号：US10658706

申请日：2003-09-08

Applicant: Wallace F. Krueger

Inventor： Wallace F. Krueger

IPC: B05D5/06

CPC classification number: B05C1/06 ,  B05B9/04 ,  B05B15/50 ,  B05C5/0204 ,  B05C5/0216 ,  B05C5/022 ,  B05C11/101 ,  B05C11/1023 ,  B05C13/02 ,  C03C17/002

Abstract: The automated system includes a fluid dispenser having an applicator tip which is used to apply a fluid to an object. A compliance mechanism is utilized to assist in maintaining the applicator tip of the fluid dispenser in contact with the object during the coating operation. A robot can be utilized to advance the object past the applicator tip during the coating operation. The fluid dispenser is mounted on a movable arm to allow the fluid dispenser to be moved or rotated into and away from the position where fluid is applied to the object. The automated system provides a fluid application system that can apply a precise and repeatable layer of fluid to an object. The use of the robot allows larger objects to be easily handled and for the coating process to be done in a rapid fashion. The automated system is flexible and can readily accommodate changes in the object that is to be coated or the configuration of the coating that is to be applied to the object.

Abstract translation: 该自动化系统包括流体分配器，其具有用于向流体施加流体的施用器尖端。 在涂覆操作期间，使用顺应性机构来帮助维持流体分配器的施用器尖端与物体接触。 可以利用机器人在涂覆操作期间使物体超过施用器尖端。 流体分配器安装在可移动臂上，以允许流体分配器移动或旋转进入或远离流体被施加到物体的位置。 自动化系统提供流体应用系统，其可以将精确和可重复的流体层应用于对象。 机器人的使用允许较大的物体被容易地处理，并且可以以快速的方式进行涂覆过程。 自动化系统是灵活的，并且可以容易地适应待涂覆的物体的变化或将要施加到物体的涂层的构造。

公开(公告)号：US20040120671A1

公开(公告)日：2004-06-24

申请号：US10326475

申请日：2002-12-20

Inventor： Siu-Ping Hong ,  Jason W. Shiroishi ,  James A. Hudson

IPC: G02B006/22 ,  B05D005/06

CPC classification number: C03C25/18 ,  B05C11/1002 ,  B05C11/101 ,  Y10T137/3124 ,  Y10T137/3127

Abstract: Systems and methods are disclosed for an automatic and continuous supply of coating material to a coating applicator in optical fiber fabrication. The present invention switches from one coating reservoir to another by way of a transitional period in which both coating reservoirs are supplying coating material to the coating applicator. For example, while an in-use reservoir is supplying the coating material to the coating applicator, a standby reservoir is being filled, settled to off gas air bubbles and then slowly pressurized. A sized orifice is used to slowly bleed off pressure from the in-use reservoir at a rate that does not allow the pressure in the in-use reservoir from falling out of a desired pressure range. When the in-use reservoir is substantially emptied of coating material and the pressures in both reservoirs are substantially equalized, then both reservoirs simultaneously supply coating material to the coating applicator for a period of time before switching completely over to the standby reservoir.

Abstract translation: 公开了用于在光纤制造中自动连续地向涂布器供应涂料的系统和方法。 本发明通过两个涂层储存器向涂布器供应涂料的过渡时段，从一个涂料储存器切换到另一个涂料储存器。 例如，当使用中的储存器将涂料供应到涂布器时，备用储存器被填充，沉降到气体气泡中，然后缓慢加压。 使用尺寸的孔口以不允许使用中储存器中的压力从期望压力范围脱落的速率缓慢地从使用中的储存器中排出压力。 当使用中的储存器基本上被清除了涂层材料并且两个储存器中的压力基本相等时，则两个储存器同时将涂层材料提供给涂布器一段时间，直到完全切换到备用储存器。

公开(公告)号：US06471774B1

公开(公告)日：2002-10-29

申请号：US09565908

申请日：2000-05-05

Applicant: Wallace F. Krueger

Inventor： Wallace F. Krueger

IPC: B05C502

CPC classification number: B05C1/06 ,  B05B9/04 ,  B05B15/50 ,  B05C5/0204 ,  B05C5/0216 ,  B05C5/022 ,  B05C11/101 ,  B05C11/1023 ,  B05C13/02 ,  C03C17/002

Abstract: The automated system includes a fluid dispenser having an applicator tip which is used to apply a fluid to an object. A compliance mechanism is utilized to assist in maintaining the applicator tip of the fluid dispenser in contact with the object during the coating operation. A robot can be utilized to advance the object past the applicator tip during the coating operation. The fluid dispenser is mounted on a movable arm to allow the fluid dispenser to be moved or rotated into and away from the position where fluid is applied to the object. The automated system provides a fluid application system that can apply a precise and repeatable layer of fluid to an object. The use of the robot allows larger objects to be easily handled and for the coating process to be done in a rapid fashion. The automated system is flexible and can readily accommodate changes in the object that is to be coated or the configuration of the coating that is to be applied to the object.

Abstract translation: 该自动化系统包括流体分配器，其具有用于向流体施加流体的施用器尖端。 在涂覆操作期间，使用顺应性机构来帮助维持流体分配器的施用器尖端与物体接触。 可以利用机器人在涂覆操作期间使物体超过施用器尖端。 流体分配器安装在可移动臂上，以允许流体分配器移动或旋转进入或远离流体被施加到物体的位置。 自动化系统提供流体应用系统，其可以将精确和可重复的流体层应用于对象。 机器人的使用允许较大的物体被容易地处理，并且可以以快速的方式进行涂覆过程。 自动化系统是灵活的，并且可以容易地适应待涂覆的物体的变化或将要施加到物体的涂层的构造。

公开(公告)号：US06431258B1

公开(公告)日：2002-08-13

申请号：US09708631

申请日：2000-11-09

Applicant: Nobuo Konishi ,  Keizo Hirose

Inventor： Nobuo Konishi ,  Keizo Hirose

IPC: F28F700

CPC classification number: H01L21/6715 ,  B05C11/08 ,  B05C11/1002 ,  B05C11/101 ,  B05C11/1042

Abstract: A process solution supplying mechanism for supplying a process solution to a wafer, comprises a source for containing the process solution, a pipe for introducing the process solution from the source to the wafer, a process solution supply driving system for supplying the process solution from the source to the wafer, and a process solution supplying/stopping mechanism for carrying out apply and stop of the process solution, wherein the pipe and the process solution supply driving system are provided separately and the process solution supplying/stopping mechanism is provided to a portion other than the pipe.

公开(公告)号：US06383291B1

公开(公告)日：2002-05-07

申请号：US09708633

申请日：2000-11-09

Applicant: Nobuo Konishi

Inventor： Nobuo Konishi

IPC: B05C1100

CPC classification number: H01L21/6715 ,  B05C11/08 ,  B05C11/1002 ,  B05C11/101 ,  B05C11/1042

Abstract: A process solution supplying mechanism for supplying a process solution to a wafer, comprises a source for containing the process solution, a pipe for introducing the process solution from the source to the wafer, a process solution supply driving system for supplying the process solution from the source to the wafer, and a process solution supplying/stopping mechanism for carrying out apply and stop of the process solution, wherein the pipe and the process solution supply driving system are provided separately and the process solution supplying/stopping mechanism is provided to a portion other than the pipe.

Abstract translation: 一种用于将工艺溶液提供给晶片的工艺溶液供应机构，包括用于容纳处理溶液的源，用于将来自源至晶片的工艺溶液引入的管道，用于从处理溶液供应源 来源于晶片，以及用于执行处理溶液的施加和停止的处理溶液供应/停止机构，其中管道和处理溶液供应驱动系统分开设置，并且处理溶液供应/停止机构被提供到部分 除了管道。