Abstract:
A multi-layered hot melt adhesive transfer hose is provided. The transfer hose has a barrier layer that prevents or minimizes the ingress of oxygen and other gases into a conduit of the hose. The transfer hose has at least one structural layer overlaying an exterior surface of the barrier layer to help the hose withstand a high fluid pressure. The barrier layer prevents the hot melt adhesive being transported in the hose from discoloring and charring when the adhesive is heated from about 250° F. up to and including 450° F. for an extended period of time.
Abstract:
A melt system that includes a melt unit. The melt unit includes a reservoir and a melter. The melter is configured to expose solid adhesive to a temperature sufficient to form a molten adhesive, which is deposited into the reservoir. The melt unit includes a hopper disposed above the melter and for holding a supply of the solid adhesive. The hopper has an access door disposed on a wall of the hopper that is movable between a closed position where the hopper is closed and an open position where an internal chamber of the hopper is accessible to receive the solid adhesive. The hopper and the solid adhesive in the hopper are thermally isolated from the reservoir.
Abstract:
The present disclosure describes a method and system for controlling dispensing of adhesive from an applicator. The method includes pumping adhesive from a plurality of pump assemblies to a plurality of dispensing modules and measuring current draw from each of the plurality of pump assemblies. The method also includes determining an adjustment to an operating speed of each of the plurality of pump assemblies individually based on their respective current draws and adjusting the operating speed of each of the plurality of pump assemblies individually.
Abstract:
A cooled hot melt adhesive material storage system includes a bin and a cooling unit. The bin receives and holds a supply of hot melt adhesive pieces, and includes an outlet for communicating hot melt adhesive pieces to a melter device. The cooling unit is operatively coupled with the bin, and is configured for cooling hot melt adhesive pieces contained in the bin.
Abstract:
A melter for heating and melting particulate hot melt adhesive into a liquefied form is disclosed. The melter includes a heated receiving device having an interior with an inlet configured to receive the particulate hot melt adhesive and an outlet. A flexible hopper holds a supply of the particulate hot melt adhesive and a particulate hot melt adhesive feed device allows the particulate hot melt adhesive to be directed from the flexible hopper to the inlet of the heated receiving device.
Abstract:
Systems, feeder devices and methods for moving particulate hot melt adhesive from an adhesive supply to an adhesive melter. A feeder device includes a body having an inlet and an outlet, and an interior communicating with the inlet and the outlet. The inlet is configured to receive particulate hot melt adhesive from an outlet of the adhesive supply, and the outlet is configured to provide particulate hot melt adhesive to an inlet of the adhesive melter. The feeder device further includes a mechanical agitator positioned in the interior for urging the particulate hot melt adhesive in a flow direction toward the outlet.
Abstract:
An adhesive dispensing system and method are configured to melt adhesive on demand and maintain the adhesive in a liquid state between dispensing cycles. The dispensing system includes a dispensing applicator with a manifold passage, a receiving device including a receiving chamber for holding a small amount of solid adhesive at the dispensing applicator and a first heating device for melting the adhesive on demand, and a second heating device at the manifold to maintain the temperature of the melted adhesive before dispensing. The second heating device applies heat energy to maintain the adhesive in the manifold passage as a liquid.
Abstract:
The present disclosure describes a method and system for controlling dispensing of adhesive from an applicator. The method includes pumping adhesive from a plurality of pump assemblies to a plurality of dispensing modules and measuring current draw from each of the plurality of pump assemblies. The method also includes determining an adjustment to an operating speed of each of the plurality of pump assemblies individually based on their respective current draws and adjusting the operating speed of each of the plurality of pump assemblies individually.
Abstract:
An apparatus for melting thermoplastic material is disclosed. The apparatus includes a heated manifold and at least one heating element disposed within the heated manifold. The heated manifold defines a plurality of cavities, a pump supply passage, and a discharge passage. The plurality of cavities are spaced apart from one another, and each receives particles of thermoplastic material from a hopper. The particles of thermoplastic material are melted within the plurality of cavities. The pump supply passage receives molten thermoplastic material from the plurality of cavities and supplies the molten thermoplastic material to a pump. The discharge passage receives pressurized molten thermoplastic material from the pump and is in fluid communication with a dispenser. The heating element transfers heat substantially throughout the heated manifold.
Abstract:
An adhesive dispensing system and method are configured to melt adhesive on demand and maintain the adhesive in a liquid state between dispensing cycles. The dispensing system includes a dispensing applicator with a manifold passage, a receiving device including a receiving chamber for holding a small amount of solid adhesive at the dispensing applicator and a first heating device for melting the adhesive on demand, and a second heating device at the manifold to maintain the temperature of the melted adhesive before dispensing. The receiving device is positioned adjacent to or partially nested within a manifold of the dispensing applicator such that the melted adhesive is delivered directly into the dispensing applicator. The second heating device applies heat energy to maintain the adhesive in the manifold passage as a liquid.