Abstract:
A copper electroplating bath for producing copper electrodeposits is described. The copper electroplating bath comprises (a) a soluble copper salt, (b) an electrolyte comprising one or more acids, and (c) a grain refining additive comprising an alkyl, aryl or alkylaryl diamine. The copper electroplating bath can be used for producing electroformed copper deposits having low oxygen content.
Abstract:
A copper strike plating bath comprising a copper cyanide compound and one or more of salts of inorganic acids and salts of organic acids. The copper cyanide compound is preferably sodium copper cyanide, potassium copper cyanide or a mixture thereof.
Abstract:
A copper strike electroplating bath comprising tetrapotassium pyrophosphate, potassium cyanide and cuprous cyanide. The strike is especially useful for plating on electroless metal deposits such as nickel.