Additives for producing copper electrodeposits having low oxygen content
    71.
    发明授权
    Additives for producing copper electrodeposits having low oxygen content 有权
    用于生产氧含量低的铜电沉积物的添加剂

    公开(公告)号:US09243339B2

    公开(公告)日:2016-01-26

    申请号:US13480887

    申请日:2012-05-25

    Applicant: Trevor Pearson

    Inventor: Trevor Pearson

    CPC classification number: C25D1/04 C25D3/38 C25D3/40 C25D21/04

    Abstract: A copper electroplating bath for producing copper electrodeposits is described. The copper electroplating bath comprises (a) a soluble copper salt, (b) an electrolyte comprising one or more acids, and (c) a grain refining additive comprising an alkyl, aryl or alkylaryl diamine. The copper electroplating bath can be used for producing electroformed copper deposits having low oxygen content.

    Abstract translation: 描述了用于生产铜电沉积物的铜电镀浴。 铜电镀浴包括(a)可溶性铜盐,(b)包含一种或多种酸的电解质,和(c)包含烷基,芳基或烷基芳基二胺的晶粒细化添加剂。 铜电镀浴可用于生产氧含量低的电铸铜矿床。

    Copper strike plating bath
    72.
    发明申请
    Copper strike plating bath 审中-公开
    铜触电镀浴

    公开(公告)号:US20060027462A1

    公开(公告)日:2006-02-09

    申请号:US11197263

    申请日:2005-08-05

    CPC classification number: C25D5/34 C25D3/40

    Abstract: A copper strike plating bath comprising a copper cyanide compound and one or more of salts of inorganic acids and salts of organic acids. The copper cyanide compound is preferably sodium copper cyanide, potassium copper cyanide or a mixture thereof.

    Abstract translation: 包含氰化铜化合物和一种或多种无机酸盐和有机酸盐的铜触镀浴。 氰化铜化合物优选为氰化铜钠,氰化钾铜或其混合物。

    Copper strike bath and method for coating electrolessly plated articles
    73.
    发明授权
    Copper strike bath and method for coating electrolessly plated articles 失效
    铜冲洗浴和无电镀产品的涂覆方法

    公开(公告)号:US3928148A

    公开(公告)日:1975-12-23

    申请号:US48402374

    申请日:1974-06-28

    Applicant: AMP INC

    CPC classification number: C25D3/40 H05K3/244

    Abstract: A copper strike electroplating bath comprising tetrapotassium pyrophosphate, potassium cyanide and cuprous cyanide. The strike is especially useful for plating on electroless metal deposits such as nickel.

    Abstract translation: 包括焦磷酸四钾,氰化钾和氰化亚铜的铜触镀电镀浴。 该击穿对于诸如镍的无电金属沉积物的电镀特别有用。

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