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公开(公告)号：US20220319963A1
公开(公告)日：2022-10-06
申请号：US17700259
申请日：2022-03-21
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Jing-En LUAN
IPC: H01L23/495 , H01L23/31 , H01L23/00 , H01L21/56
Abstract: The present disclosure is directed to embodiments of semiconductor device packages including a plurality of conductive vias and traces formed by an laser-direct structuring process, which includes at least a lasering step and a plating step. First ones of the plurality of conductive vias extend into an encapsulant to contact pads of a die encased within the encapsulant, and second ones of the plurality of conductive vias extend in the encapsulant to end portions of leads in the encapsulant. The second ones of the plurality of conductive vias may couple the leads to contact pads of the die. In some embodiments, the leads of the semiconductor device packages may extend outward and away from encapsulant. In some other alternative embodiments, the leads of the semiconductor device packages may extend outward and away from the encapsulant and then bend back toward the encapsulant such that an end of the lead overlaps a surface of the encapsulant at which the plurality of conductive vias are present.
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公开(公告)号：US20220291277A1
公开(公告)日：2022-09-15
申请号：US17826705
申请日：2022-05-27
Applicant: STMicroelectronics Pte Ltd
Inventor： Pedro Jr Santos PERALTA , David GANI
IPC: G01R31/28 , H01L21/66 , G01R31/3185 , G01R31/26
Abstract: A method of testing an integrated circuit die (IC) for cracks includes performing an assembly process on a wafer including multiple ICs including: lowering a tip of a first manipulator arm to contact and pick up a given IC, flipping the given IC such that a surface of the IC facing the wafer faces a different direction, and transferring the IC to a tip of a second manipulator arm, applying pressure from the second manipulator arm to the given IC such that pogo pins extending from the tip of the first manipulator arm make electrical contact with conductive areas of the IC for connection to a crack detector on the IC, and performing a conductivity test on the crack detector using the pogo pins. If the conductivity test indicates a lack of presence of a crack, then the second manipulator arm is used to continue processing of the given IC.
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公开(公告)号：US20220208819A1
公开(公告)日：2022-06-30
申请号：US17556604
申请日：2021-12-20
Applicant: STMICROELECTRONICS LTD , STMICROELECTRONICS PTE LTD
Inventor： David GANI , Yiying KUO
IPC: H01L27/146 , H01L23/498
Abstract: The present disclosure is directed to a package that includes a transparent layer that is on and covers a sensor of a die as well as a plurality of electrical connections that extend from a first surface of the package to the second surface of the package opposite to the first surface. In at least one embodiment of a package, the electrical connections each include a conductive structure that extends through the transparent layer to a first side of a corresponding contact pad of the die, and at least one electrical that extends into the second surface of the die to a second side of the corresponding contact pad that is opposite to the first side. In at least another embodiment of a package, the electrical connections include a conductive structure that extends through a molding compound to a first side of a corresponding contact pad of the die, and at least one electrical via that extends into the second surface of the die to a second side of the corresponding contact pad opposite to the first side.
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公开(公告)号：US20220199582A1
公开(公告)日：2022-06-23
申请号：US17556547
申请日：2021-12-20
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Jing-En LUAN
IPC: H01L25/065 , H01L25/00 , H01L23/31
Abstract: The present disclosure is directed to a package that includes a plurality of die that are stacked on each other. The plurality of die are within a first resin and conductive layer is on the first resin. The conductive layer is coupled between ones of first conductive vias extending into the first resin to corresponding ones of the plurality of die. The conductive layer and the first conductive vias couple ones of the plurality of die to each other. A second conductive via extends into the first resin to a contact pad of the substrate, and the conductive layer is coupled to the second conductive via coupling ones of the plurality of die to the contact pad of the substrate. A second resin is on and covers the first resin and the conductive layer on the first resin. In some embodiments, the first resin includes a plurality of steps (e.g., a stepped structure). In some embodiments, the first resin includes inclined surfaces (e.g., sloped surfaces).
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公开(公告)号：US20220130750A1
公开(公告)日：2022-04-28
申请号：US17572247
申请日：2022-01-10
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Daniel YAP , Hung Meng LOH
IPC: H01L23/498 , H01L23/31 , H01L21/48 , H01L23/495
Abstract: A method of forming a solder connection includes forming a solder mask on a thermal pad of a printed circuit board. The solder mask leaves unmasked portions of the thermal pad and forming the solder mask includes forming a plurality of mask stripes extending from edges of each unmasked portion towards a center of the unmasked portion. The method includes depositing solder paste on the unmasked portions of the thermal pad and placing an exposed thermal pad of an integrated circuit package on the solder paste deposited on the thermal pad of the printed circuit board. The method includes forming a solder connection by heating the solder paste between the unmasked portions of the thermal pad on the printed circuit board and the exposed thermal pad of the integrated circuit package.
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Patent Agency Ranking
公开(公告)号：US11270946B2
公开(公告)日：2022-03-08
申请号：US16987002
申请日：2020-08-06
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Yong Chen , David Gani
IPC: H01L23/538 , H01L25/065 , H01L23/00
Abstract: The present disclosure is directed to a package that includes openings that extend into the package. The openings are filled with a conductive material to electrically couple a first die in the package to a second die in the package. The conductive material that fills the openings forms electrical interconnection bridges between the first die and the second die. The openings in the package may be formed using a laser and a non-doped molding compound, a doped molding compound, or a combination of doped or non-doped molding compounds.
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公开(公告)号：US11226399B2
公开(公告)日：2022-01-18
申请号：US16539295
申请日：2019-08-13
Applicant: STMICROELECTRONICS PTE LTD
Inventor： David Gani
Abstract: A semiconductor package that is a proximity sensor includes a light transmitting die, a light receiving die, an ambient light sensor, a cap, and a substrate. The light receiving die and the light transmitting die are coupled to the substrate. The cap is coupled to the substrate forming a first chamber around the light transmitting die and a second chamber around the light receiving die. The cap further includes a recess with contact pads. The ambient light sensor is mounted within the recess of the cap and coupled to the contact pads. The cap includes electrical traces that are coupled to the contact pads within the recess coupling the ambient light sensor to the substrate. By utilizing a cap with a recess containing contact pads, a proximity sensor can be formed in a single semiconductor package all while maintaining a compact size and reducing the manufacturing costs of proximity sensors.
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公开(公告)号：US11137517B2
公开(公告)日：2021-10-05
申请号：US16890778
申请日：2020-06-02
Inventor： Wing Shenq Wong , Andy Price , Eric Christison
IPC: H01L25/16 , H01L31/167 , G01V8/12
Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.
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公开(公告)号：US10942157B2
公开(公告)日：2021-03-09
申请号：US15901721
申请日：2018-02-21
Applicant: STMICROELECTRONICS PTE LTD , STMICROELECTRONICS S.R.L.
Inventor： Malek Brahem , Hatem Majeri , Olivier Le Neel , Ravi Shankar , Enrico Rosario Alessi , Pasquale Biancolillo
Abstract: The present disclosure is directed to a gas sensor device that detects gases with large molecules (e.g., a gas with a molecular weight between 150 g/mol and 450 g/mol), such as siloxanes. The gas sensor device includes a thin film gas sensor and a bulk film gas sensor. The thin film gas sensor and the bulk film gas sensor each include a semiconductor metal oxide (SMO) film, a heater, and a temperature sensor. The SMO film of the thin film gas sensor is an thin film (e.g., between 90 nanometers and 110 nanometers thick), and the SMO film of the bulk film gas sensor is an thick film (e.g., between 5 micrometers and 20 micrometers thick). The gas sensor device detects gases with large molecules based on a variation between resistances of the SMO thin film and the SMO thick film.
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公开(公告)号：US20210066198A1
公开(公告)日：2021-03-04
申请号：US16987002
申请日：2020-08-06
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Yong CHEN , David GANI
IPC: H01L23/538 , H01L25/065 , H01L23/00
Abstract: The present disclosure is directed to a package that includes openings that extend into the package. The openings are filled with a conductive material to electrically couple a first die in the package to a second die in the package. The conductive material that fills the openings forms electrical interconnection bridges between the first die and the second die. The openings in the package may be formed using a laser and a non-doped molding compound, a doped molding compound, or a combination of doped or non-doped molding compounds.
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