摘要:
A zoom adjustment system, comprising a touch panel, a course detector, and a first zoom adjuster, is provided. The touch panel has an input surface. The touch panel detects a certain location on the input surface when it is touched. The touch panel detects a touched location. The course detector detects a course traced on the input surface by the touched location when the touched location is moved about on the input surface while maintaining continuous contact with the input surface. The first zoom adjuster adjusts a magnification of a photographic optical system according to the traced course detected by the course detector.
摘要:
A charged particle beam apparatus for obtaining information of an uneven surface or a depression/protrusion of a sample by irradiating a charged particle beam to a sample having an uneven surface or a depression/protrusion at a plurality of focal positions, measuring signal emitted from the sample, and comparing profile waveforms corresponding to edge portions of the uneven surface.
摘要:
A charged particle beam apparatus for obtaining information of an uneven surface or a depression/protrusion of a sample by irradiating a charged particle beam to a sample having an uneven surface or a depression/protrusion at a plurality of focal positions, measuring signal emitted from the sample, and comparing profile waveforms corresponding to edge portions of the uneven surface.
摘要:
A charged particle beam apparatus is provided which can prevent the accuracy of positional shift detection from being degraded owing to differences in picture quality, so that even when the state of a charged particle beam is changed at the time that optical conditions are changed or the optical axis changes with time, an auto adjustment of the optical axis can be realized easily and highly accurately. In the charged particle beam apparatus, evaluation or adjustment of focusing is conducted before the deflection condition of an alignment deflector for optical axis adjustment is changed or a table of focus adjustment amounts in correspondence with deflection conditions of the alignment deflector is provided, whereby when the deflection condition of the alignment deflector is changed, a focus adjustment is carried out in accordance with the table.
摘要:
An electron beam inspection apparatus in which the order of inspection is determined to shorten the inspection time is disclosed. The order of inspection is determined by minimizing the total of the moving time and the inspection time as well as by simply optimizing the covered distance. At the time of preparing a recipe to determine the inspection points and the order of inspection, the sequence of a series of inspection points sequentially inspected is changed to optimize the order of inspection. Not only the sequence which minimizes the covered distance is determined but also the order of inspection of the inspection points is optimized in accordance with the charged state, warping of the wafer, the delivery position and other situations.
摘要:
An electron beam inspection apparatus in which the order of inspection is determined to shorten the inspection time is disclosed. The order of inspection is determined by minimizing the total of the moving time and the inspection time as well as by simply optimizing the covered distance. At the time of preparing a recipe to determine the inspection points and the order of inspection, the sequence of a series of inspection points sequentially inspected is changed to optimize the order of inspection. Not only the sequence which minimizes the covered distance is determined but also the order of inspection of the inspection points is optimized in accordance with the charged state, warping of the wafer, the delivery position and other situations.
摘要:
An electron beam inspection apparatus in which the order of inspection is determined to shorten the inspection time is disclosed. The order of inspection is determined by minimizing the total of the moving time and the inspection time as well as by simply optimizing the covered distance. At the time of preparing a recipe to determine the inspection points and the order of inspection, the sequence of a series of inspection points sequentially inspected is changed to optimize the order of inspection. Not only the sequence which minimizes the covered distance is determined but also the order of inspection of the inspection points is optimized in accordance with the charged state, warping of the wafer, the delivery position and other situations.
摘要:
An object of the present invention is to provide a scanning electron microscope for reducing a process concerning inspection positioning or an input operation, thereby functioning with high precision at high speed. To accomplish the above object, the present invention provides a scanning electron microscope having a function for identifying a desired position on the basis of a pattern registered beforehand, which includes a means for setting information concerning the pattern kind, the interval between a plurality of parts constituting the pattern, and the size of parts constituting the pattern and a means for forming a pattern image composed of a plurality of parts on the basis of the information obtained by the concerned means.
摘要:
A charged-particle beam emitting device which includes the following configuration devices so that a lowering in the image resolution will be suppressed even if a primary beam is tilted relative to a sample: A device for causing orbit of the primary beam to pass through off-axes of a plurality of lenses, and controlling off-axis orbit of the primary beam. This device allows the aberration which occurs in the objective lens at the time of beam tilt to be cancelled out by the aberration which occurs in the other lens. Also, there is provided a device for simultaneously modulating excitations of the plurality of lenses including the objective lens.
摘要:
According to the pattern search method of the present invention, detection of a detection image region relative to an observation image is performed by a pattern matching. An image whose size is substantially the same as that of the observation image is used as the detection image region. The detection image region is relatively displaced with reference to the observation image, thereby detecting a degree of similarity for a common region which is common to both of the region and the image. Displacement range of the detection image region is set in advance. If area of the common region is larger than a predetermined value, calculating the degree of similarity will be performed.