-
公开(公告)号：US20230380060A1
公开(公告)日：2023-11-23
申请号：US18364547
申请日：2023-08-03
发明人： Takayuki NABA , Keiichi YANO , Hiromasa KATO
CPC分类号： H05K1/0306 , H05K1/0265 , H05K3/388 , H05K1/0271 , H05K2201/06
摘要： A ceramic circuit board includes a ceramic substrate and a metal plate bonded together via a bonding layer, wherein when the ceramic circuit board is observed through a cross-section defined by a thickness direction and lateral direction of the ceramic circuit board: a side surface of the metal plate has an inclined shape; and the bonding layer has a bonding-layer protruding portion which protrudes by 20 μm or more and 150 μm or less from an edge where the bonding layer is in contact with the side surface of the metal plate. The shape and Vickers hardness of the side surface of the metal plate are controlled. The ceramic substrate is preferably a silicon nitride substrate.
-
公开(公告)号：US20230303904A1
公开(公告)日：2023-09-28
申请号：US18323288
申请日：2023-05-24
CPC分类号： C09K5/14 , C01F17/294 , G01R33/3804 , F25B9/145 , H01F6/04 , F17C6/00 , C01P2002/52 , C01P2006/32 , C01P2004/61 , C01P2004/54 , C01P2004/50 , F25B2309/1412 , F17C2225/013 , F17C2221/017 , F17C2223/0123
摘要： A cold storage material of an embodiment includes a rare earth oxysulfide containing at least one rare earth element selected from the group consisting of Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu, and a first group element of 0.001 atom % or more and 10 atom % or less, in which a maximum value of volume specific heat in a temperature range of 2 K or more and 10 K or less is 0.5 J/(cm3·K) or more.
-
公开(公告)号：US20230187310A1
公开(公告)日：2023-06-15
申请号：US18163466
申请日：2023-02-02
发明人： Seiichi SUENAGA , Maki YONETSU , Sachiko FUJISAWA , Yoichiro MORI
IPC分类号： H01L23/373 , H01L23/498
CPC分类号： H01L23/3735 , H01L23/49866
摘要： According to the embodiment, a bonded body includes a ceramic substrate, a copper plate. A bonding layer is located on at least one surface of the ceramic substrate. The bonding layer bonds the ceramic substrate and the copper plate. The bonding layer includes a Ti reaction layer including titanium nitride or titanium oxide as a major component, and a plurality of first alloys positioned between the Ti reaction layer and the copper plate. Each of the plurality of first alloys includes at least one selected from a Cu—Sn alloy and a Cu—In alloy. The first alloys have mutually-different Sn concentrations or In concentrations. According to the embodiment, a warp amount can be reduced. A heating rate and a cooling rate in the bonding process can be increased. According to the embodiment, a silicon nitride substrate is favorable for the ceramic substrate.
-
公开(公告)号：US20220308243A1
公开(公告)日：2022-09-29
申请号：US17685252
申请日：2022-03-02
发明人： Kohichi NAKAYAMA , Koichi NITTOH , Yukio SONODA , Yukihiro FUKUTA
摘要： According to an embodiment, a radiation-scintillated shield which attenuates an incident radiation, includes a shielding part containing an activator-added gadolinium compound as an aggregate. The activator uses the gadolinium compound as a base material and emits light when struck by the radiation. Consequently, it becomes possible to shield a γ-ray and a neutron with a thickness which is about the same as that of a conventional concrete shield of γ-ray shield, and to confirm leakage of radiation.
-
公开(公告)号：US20220260731A1
公开(公告)日：2022-08-18
申请号：US17660861
申请日：2022-04-27
摘要： A scintillator array includes: a structure having scintillator segments and a first reflective layer, the first reflective layer being provided between the scintillator segments and being configured to reflect light, and the scintillator segments having a sintered compact containing a rare earth oxysulfide phosphor; and a layer having a second reflective layer provided above the structure, the second reflective layer being configured to reflect light. The first reflective layer has a portion extending into the layer.
-
公开(公告)号：US20220172875A1
公开(公告)日：2022-06-02
申请号：US17677343
申请日：2022-02-22
发明人： Tadao SAITO , Takahiro MAEDA , Satoru HABU
摘要： A magnetic ribbon according to an embodiment has a crystallinity degree of 0.05 or higher and 0.4 or lower when the magnetic ribbon is subjected to XRD analysis, the magnetic ribbon being Fe—Nb—Cu—Si—B-base, and the crystallinity degree being expressed by “a peak total area of a crystalline phase”/(“a peak area of an amorphous phase”+“the peak total area of the crystalline phase”). Also, the magnetic ribbon is preferred to have a region in which a KIKUCHI pattern is detected when the crystalline phase is subjected to EBSD analysis. Also, the thickness of the magnetic ribbon is preferred to be 25 μm or less.
-
公开(公告)号：US20220130644A1
公开(公告)日：2022-04-28
申请号：US17438184
申请日：2020-03-13
发明人： Masahiro YOKOTA , Akihiko HAPPOYA , Ken TAKAHASHI , Shusuke MORITA , Jiro OSHIMA , Shuichi SAITO , Noriaki YAGI , Atsuya SASAKI
IPC分类号： H01J37/32
摘要： A plasma processing apparatus includes: a chamber including a first member, and a second member detachable from the first member; a conductive member disposed between the first member and the second member; and a first high frequency power supply generating plasma in the chamber. The conductive member includes a resin member made of a resin material, and a metal film covering a surface of the resin member.
-
公开(公告)号：US20220037225A1
公开(公告)日：2022-02-03
申请号：US17467853
申请日：2021-09-07
发明人： Takayuki NABA , Hiromasa KATO , Keiichi YANO
IPC分类号： H01L23/373 , H01L23/498 , H01L21/48
摘要： A ceramic copper circuit board including a ceramic substrate, and a copper circuit part located on the ceramic substrate, wherein an arbitrary line parallel to a first direction at a cross section of the copper circuit part parallel to the first direction crosses multiple copper crystal grains, the first direction is from the ceramic substrate toward the copper circuit part, an average of multiple distances in a second direction between the line and edges of the copper crystal grains is not more than 300 μm, and the second direction is perpendicular to the first direction.
-
公开(公告)号：US11130194B2
公开(公告)日：2021-09-28
申请号：US16324110
申请日：2017-08-04
发明人： Hidetoshi Fujii , Yoshiaki Morisada , Kai Funaki , Isao Ikeda , Yutaka Abe , Masahiro Kato
IPC分类号： B23K20/00 , B23K20/12 , C04B35/584 , C04B37/02
摘要： The friction stir welding tool member according to the present invention is made of a ceramic member in which a shoulder portion and a probe portion are integrally formed, wherein a root portion of the probe portion and an end portion of the shoulder portion have a curved surface shape; and the friction stir welding tool member has a ratio (R1/D) of 0.02 or more and 0.20 or less when a curvature radius of the end portion of the shoulder portion is defined as R1 (mm) and an outer diameter of the shoulder portion is defined as D (mm). In addition, the ceramic member is preferably made of a silicon nitride sintered body having a Vickers hardness of 1400 HV1 or more. According to the above-described configuration, a friction stir welding tool member having excellent durability can be provided.
-
公开(公告)号：US11129282B2
公开(公告)日：2021-09-21
申请号：US16774820
申请日：2020-01-28
摘要： According to one embodiment, a method for manufacturing a ceramic circuit board is disclosed. The ceramic circuit board includes a copper plate bonded to at least one surface of a ceramic substrate via a brazing material layer including Ag, Cu, and a reactive metal. The method includes: preparing a ceramic circuit board in which a copper plate is bonded on a ceramic substrate via a brazing material layer, and a portion of the brazing material layer is exposed between a pattern shape of the copper plate; a first chemical polishing process of chemically polishing the portion of the brazing material layer; and a first brazing material etching process of etching the chemically polished portion of the brazing material layer by using an etchant having a pH of 6 or less and including one type or two types selected from hydrogen peroxide and ammonium peroxodisulfate.
-
-
-
-
-
-
-
-
-
搜索结果
353 条记录 (耗时 0.03 秒)
