Abstract:
Disclosed is an apparatus and method of communicating data for a digital mobile station, and more particularly a data transmitting and receiving apparatus and method capable of transmitting and receiving graphic and/or data using a Short Message Service(SMS). According to the present invention, an SMS message comprises an SMS header field and an SMS user data field, wherein the SMS user data field comprises a data transmission header field and a data field. The data transmission header field comprises a code field to indicate one of plural types of data associated with data contained in the data field of the SMS user data field, a data transmitting and receiving apparatus and method capable of transmitting and receiving graphic and/or audio data using a Short Message Service(SMS). Further, an SMS message comprises an SMS header field and an SMS user data field, wherein the SMS user data field comprises a data transmission header field and a data field. The data transmission header field comprises a code field to indicate one of plural types of data associated with data contained in the data field of the SMS user data field. The SMS message is communicated though SMS network.
Abstract:
The present invention pertains to a method for controlling the foaming of a waterborne composition or an industrial process by the incorporation of a foam controlling agent. The method comprises utilizing as the foam controlling agent a compound of the formula: HOR1R3C—[CH2]n—CR2R4OH R1 and R2 are independently selected from the group of alkyl radicals having from 3 to 6 carbon atoms. R3 and R4 are independently alkyl radicals having from 1 to 2 carbon atoms. n is an integer from 1 to 6. The compound generates an initial (t=0 min.) or a final (t=10 min.) foamed density at least 30% greater than that of a 0.5 wt % aqueous solution of a 12 mole ethoxylate of a C12-C15 primary alcohol (C12-C15E12) when added at 0.2 wt % to the C12-C15E12 solution. The present invention also pertains to an aqueous composition comprising the foam controlling agent.
Abstract:
Material is deposited from an active shutter onto a substrate located in a processing chamber housing with a shutter target coupled to a shutter target assembly. A first target assembly located in the housing supports a target for physical-vapor deposition of a first material onto the substrate. A shutter is selectively moveable to extend into a closed or activated position and to retract into an open position. The shutter target assembly is coupled to the shutter such that when the shutter is in the closed position, the shutter target assembly is positioned to allow deposition of material from the shutter target onto the substrate. When the shutter is in the open position, the first target is positioned to deposit material onto the substrate. Alternating layers of materials may be deposited by the shutter target and first target by cycling the shutter between an open position and a closed position.
Abstract:
An apparatus and method supports thermal processing of a microelectronic device such as a semiconductor chip in a substrate by heating the substrate with secondary radiation from an energy transfer device 40, which has a first set of energy transfer regions comprised of an emissive and thermally conductive material, and a second set of thermally insulating regions comprised of a reduced emissivity and reduced thermal conductivity material or free space. A multi-zone radiant energy source 30 provides radiative energy to energy transfer device 40, with a process controller 36, preferably a multi-zone controller, altering the amount of energy provided by each heat zone associated with each emissive region of energy transfer device 40. Sensors detect the thermal energy level of each energy transfer region to allow controller 36 to adjust the secondary radiation emitted by each region in real time, resulting in a predetermined and controlled distribution of thermal energy on substrate 20. Energy transfer device 40 can have plural emissive and thermally conductive concentric rings separated from each other by reduced emissivity and reduced thermal conductivity regions such as free space gaps 42. Alternatively, a solid plate 54 having an emissive coating or emissive surface 52 can have reduced emissivity and reduced conductivity isolation regions such as trenches 56 for defining the multi-zone high-emissivity and high thermal conductivity energy transfer regions.
Abstract:
This invention presents an automatic calibration system and method for calibration of a substrate temperature sensor in a thermal processing equipment, such as a rapid thermal processing system. The calibration system includes a temperature-sensitive probe associated with the substrate temperature sensor to calibrate the substrate temperature sensor and an actuator to position the temperature-sensitive probe relative to the substrate during a calibration cycle. The actuator and temperature-sensitive probe of the automatic calibration system can be incorporated into the thermal processing equipment in order to maintain the thermal processing equipment cleanliness and integrity during a calibration cycle, and to allow rapid automated calibration. In the preferred embodiment of this invention, the temperature-sensitive probe and its actuator are implemented in the gas showerhead assembly of a rapid thermal processing system.
Abstract:
An apparatus and method for wafer rotation in microelectronics manufacturing equipment is presented. The present invention combines an external stator assembly having a plurality of electromagnetic actuator coils with an internal rotor assembly having a plurality of multipolar permanent magnets or ferromagnetic coupling tabs. The rotor assembly supports the semiconductor wafer or any other substrate inside the process chamber. The electromagnetic actuator coils of the stator assembly receive a plurality of multi-phase, controlled frequency electrical currents to create magnetic fields around the actuator coils that interact with the multipolar permanent magnets or ferromagnetic coupling tabs of the rotor assembly to provide the rotational force to rotate the rotor assembly and thus, rotate the semiconductor wafer or any other substrate within the process chamber.